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Overview
| Topology | Other Topology |
| IC revision | E1 |
Description
The AM64x IO-Link and high speed expansion board is an add-on module for the AM64x GP EVM. This board includes eight (8) IO-Link ports and general purpose signal breakout. The Breakout board section provides the test access to all the IO signals included on the High Speed Expansion connector from AM64x EVM. This design helps build a universal and scalable IO-Link master. This IO link board/breakout board shall have 150 pin HSE connector and 20 pin ADC connector to mate with General Processor EVM board and eight M12 connectors to execute IO-Link functionality.FeaturesProvides access to all signals on AM64x GP EVM HSE connectorx8 M12 IO-Link ports with fault protectionPrecision current monitoring with onboard INA253x16 individually addressable LEDs
Features
Provides access to all signals on AM64x GP EVM HSE connectorx8 M12 IO-Link ports with fault protectionPrecision current monitoring with onboard INA253x16 individually addressable LEDs
Typical applications
- IO-link and high-speed breakout
More information
Products
| Order Code | Datasheet | Simulation | Downloads | Status | Product series | λDom typ. (nm) | Emitting Color | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chip Technology | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Size | Operating Temperature | DF (%) | RISO | Ceramic Type | L (mm) | W (mm) | H (mm) | Fl (mm) | Packaging | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 150060VS75000 | SPEC | 7 files | Active i| Production is active. Expected lifetime: >10 years. | WL-SMCW SMT Mono-color Chip LED Waterclear | 570 | Bright Green | 572 | 40 | 2 | AlInGaP | 140 | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | 1.6 | 0.8 | 0.7 | – | Tape and Reel | ||
 | 150060RS55040 | SPEC | 25 files RAY files
| Active i| Production is active. Expected lifetime: >10 years. | WL-SMCD SMT Mono-color Chip LED Diffused | 624 | Red | 632 | 90 | 2 | AlInGaP | 140 | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | 1.6 | 0.8 | 0.4 | – | Tape and Reel | ||
 | 885012205050 | SPEC | 9 files | Active i| Production is active. Expected lifetime: >10 years. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | 10 nF | ±10% | 25 | 0402 | -55 °C up to +125 °C | 3.5 | 10 GΩ | X7R Class II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | ||
| 885012105012 | SPEC | 9 files | Active i| Production is active. Expected lifetime: >10 years. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | 1 µF | ±20% | 10 | 0402 | -55 °C up to +85 °C | 15 | 0.05 GΩ | X5R Class II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | ||
| 885012105018 | SPEC | 9 files | Active i| Production is active. Expected lifetime: >10 years. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | 100 nF | ±20% | 25 | 0402 | -55 °C up to +85 °C | 10 | 5 GΩ | X5R Class II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | ||
| 885012207079 | SPEC | 8 files | Active i| Production is active. Expected lifetime: >10 years. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | 2.2 µF | ±10% | 25 | 0805 | -55 °C up to +125 °C | 10 | 0.05 GΩ | X7R Class II | 2 | 1.25 | 1.25 | 0.5 | 7" Tape & Reel | ||
| 885012207103 | SPEC | 9 files | Active i| Production is active. Expected lifetime: >10 years. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 1 µF | ±10% | 50 | 0805 | -55 °C up to +125 °C | 10 | 0.1 GΩ | X7R Class II | 2 | 1.25 | 1.25 | 0.5 | 7" Tape & Reel |
| Order Code | Datasheet | Simulation | |
|---|---|---|---|
| 150060VS75000 | SPEC | |
| 150060RS55040 | SPEC | |
| 885012205050 | SPEC | |
| 885012105012 | SPEC | |
| 885012105018 | SPEC | |
| 885012207079 | SPEC | |
| 885012207103 | SPEC |
| Samples |
|---|
| Order Code | Datasheet | Simulation | Downloads | Status | Product series | λDom typ. (nm) | Emitting Color | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chip Technology | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Size | Operating Temperature | DF (%) | RISO | Ceramic Type | L (mm) | W (mm) | H (mm) | Fl (mm) | Packaging | Samples |
|---|
