Topologie | Sonstige Topologie |
IC-Revision | E1 |
The AM64x IO-Link and high speed expansion board is an add-on module for the AM64x GP EVM. This board includes eight (8) IO-Link ports and general purpose signal breakout. The Breakout board section provides the test access to all the IO signals included on the High Speed Expansion connector from AM64x EVM. This design helps build a universal and scalable IO-Link master. This IO link board/breakout board shall have 150 pin HSE connector and 20 pin ADC connector to mate with General Processor EVM board and eight M12 connectors to execute IO-Link functionality.FeaturesProvides access to all signals on AM64x GP EVM HSE connectorx8 M12 IO-Link ports with fault protectionPrecision current monitoring with onboard INA253x16 individually addressable LEDs
Provides access to all signals on AM64x GP EVM HSE connectorx8 M12 IO-Link ports with fault protectionPrecision current monitoring with onboard INA253x16 individually addressable LEDs
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | Muster | |
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![]() | 150060VS75000 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | 570 | Hellgrün | 572 | 40 | 2 | AlInGaP | 140 | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | 1.6 | 0.8 | 0.7 | – | Tape and Reel | ||
![]() | 150060RS55040 | SPEC | 25 Dateien Strahldaten
| Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCD SMT Mono-color Chip LED Diffused | 624 | Rot | 632 | 90 | 2 | AlInGaP | 140 | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | 1.6 | 0.8 | 0.4 | – | Tape and Reel | ||
![]() | 885012205050 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | 10 nF | ±10% | 25 | 0402 | -55 °C up to +125 °C | 3.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | ||
![]() | 885012105012 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | 1 µF | ±20% | 10 | 0402 | -55 °C up to +85 °C | 15 | 0.05 GΩ | X5R Klasse II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | ||
![]() | 885012105018 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | 100 nF | ±20% | 25 | 0402 | -55 °C up to +85 °C | 10 | 5 GΩ | X5R Klasse II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | ||
![]() | 885012207079 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | 2.2 µF | ±10% | 25 | 0805 | -55 °C up to +125 °C | 10 | 0.05 GΩ | X7R Klasse II | 2 | 1.25 | 1.25 | 0.5 | 7" Tape & Reel | ||
![]() | 885012207103 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 1 µF | ±10% | 50 | 0805 | -55 °C up to +125 °C | 10 | 0.1 GΩ | X7R Klasse II | 2 | 1.25 | 1.25 | 0.5 | 7" Tape & Reel |
Artikel Nr. | Datenblatt | Simulation | |
---|---|---|---|
![]() | 150060VS75000 | SPEC | |
![]() | 150060RS55040 | SPEC | |
![]() | 885012205050 | SPEC | |
![]() | 885012105012 | SPEC | |
![]() | 885012105018 | SPEC | |
![]() | 885012207079 | SPEC | |
![]() | 885012207103 | SPEC |
Muster |
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Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | Muster |
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