IC manufacturers Texas Instruments

IC manufacturers (103)

Texas Instruments PTH08080WAZT | Demoboard TIDA-01606 Power Card

10kW 3-Phase 3-Level Grid Tie Inverter Reference Design for Solar String Inverter

Overview

TopologyOther Topology
Input voltage12 V
Output 19 V
IC revisionE4

Description

This verified reference design provides an overview on how to implement a three-level three-phase SiC based DC:AC grid-tie inverter stage.Higher switching frequency of 50KHz reduces the size of magnetics for the filter design and enables higher power density. The use of SiC MOSFETs with switching loss ensures higher DC bus voltages of up to 1000V and lower switching losses with a peak efficiency of 99 percent. This design is configurable to work as a two-level or three-level inverter.The system is controlled by a single C2000 microcontroller (MCU), TMS320F28379D, which generates PWM waveforms for all power electronic switching devices under all operating modes.

Features

  • Rated Nominal and Max Input Voltage at 800-V and 1000-V DC
  • Max 10-kW/10-kVA Output Power at 400-V AC 50- or 60-Hz Grid-Tie Connection
  • Operating Power Factor Range From 0.7 Lag to 0.7 Lead
  • High-Voltage (1200-V) SiC MOSFET-Based FullBridge Inverter for Peak Efficiency of 98.5%
  • Compact Output Filter by Switching Inverter at 50 kHz
  • <2% Output Current THD at Full Load
  • Isolated Driver ISO5852S With Reinforced Isolation for Driving High-Voltage SiC MOSFET and UCC5320S for Driving Middle Si IGBT
  • Isolated Current Sensing Using AMC1301 for Load Current Monitoring
  • TMS320F28379D Control Card for Digital Control

Typical applications

  • Telecommunications
  • Instumentation

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
λDom typ.(nm)
Emitting Color
λPeak typ.(nm)
IV typ.(mcd)
VF typ.(V)
Chip Technology
50% typ.(°)
C
VR(V (DC))
Endurance(h)
IRIPPLE(mA)
Z(mΩ)
ILeak(µA)
DF(%)
Ø D(mm)
L(mm)
Packaging
Z @ 100 MHz(Ω)
Zmax(Ω)
Test Condition Zmax
IR(A)
Z @ 1 GHz(Ω)
H(mm)
Type
Samples
WL-SMCD SMT Mono-color Chip LED Diffused, 573 nm, Bright Green
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]573 nm
Emitting ColorBright Green 
Peak Wavelength [typ.]575 nm
Luminous Intensity [typ.]60 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Length1.6 mm
PackagingTape and Reel 
Height0.4 mm
WE-MPSB EMI Multilayer Power Suppression Bead, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length3.2 mm
Impedance @ 100 MHz110 Ω
Maximum Impedance118 Ω
Maximum Impedance150 MHz 
Rated Current5.4 A
Impedance @ 1 GHz44 Ω
Height1.1 mm
TypeHigh Current 
WCAP-ASLL Aluminum Electrolytic Capacitors, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 µF
Rated Voltage50 V (DC)
Endurance 5000
Ripple Current350 mA
Impedance340 mΩ
Leakage Current50 µA
Dissipation Factor12 %
Diameter8 mm
Length10.5 mm
Packaging15" Tape & Reel