IC manufacturers STMicroelectronics

IC manufacturers (103)

STMicroelectronics Teseo-LIV4FTR | Demoboard X-STM32MP-GNSS2

Overview

TopologyOther Topology
Input voltage3-3.63 V
IC revision1.0

Description

X-STM32MP-GNSS2 is an STM32 MPU expansion board with Teseo-LIV4F module for Low Power Multi-Constellation GNSS positioning using various sensors for data accuracy.The X-STM32MP-GNSS2 interfaces with the STM32MP microprocessor via 40 pin GPIO connector pins using I2C, UART, GPIO connections for various components. It is compatible with both STM32MP157F-DK2 and Raspberry Pi’s GPIO connector layout.Teseo-LIV4F is a global navigation satellite system (GNSS) standalone low power module. It embeds the Teseo IV positioning receiver IC working simultaneously on multiple constellations (GPS/Galileo/Glonass/BeiDou/QZSS/IRNSS).iNEMO inertial module ISM330DHCX has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps.QVAR Embedded ILPS22QS functions as a digital output barometer, supporting dual full-scale up to 4060 hPa.The IIS2MDC is a high-accuracy, ultra-low-power 3-axis digital magnetic sensor having dynamic range up to ±50 gauss.

Features

Teseo-LIV4F GNSS ReceiverOn board iNEMO inertial module for accelerometer and gyroscopeQVAR embedded pressure sensor for altitude measurementMagnetometer for position accuracyLEDs for PPS, power, userKeys for reset, wakeup and userEEPROM for automatic GPIO setup and driver setupCompatible with both STM32MP157F-DK2 and Raspberry Pi’s GPIO connector

Typical applications

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
L(mm)
Ti
λDom typ.(nm)
Emitting Color
λPeak typ.(nm)
IV typ.(mcd)
VF typ.(V)
Chip Technology
50% typ.(°)
C
Tol. C
VR(V (DC))
Size
Operating Temperature
DF(%)
RISO
Ceramic Type
W(mm)
H(mm)
Fl(mm)
Packaging
Pins
Type
Mount
IR(A)
Working Voltage(V (AC))
Color
Gender
Samples
WL-SMCW SMT Mono-color Chip LED Waterclear, 1.6 mm, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Dominant Wavelength [typ.]625 nm
Emitting ColorRed 
Peak Wavelength [typ.]630 nm
Luminous Intensity [typ.]250 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Size0603 
Operating Temperature -40 °C up to +85 °C
Width0.8 mm
Height0.7 mm
PackagingTape and Reel 
MountSMT 
WL-SMCW SMT Mono-color Chip LED Waterclear, 1.6 mm, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Dominant Wavelength [typ.]590 nm
Emitting ColorYellow 
Peak Wavelength [typ.]595 nm
Luminous Intensity [typ.]120 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Size0603 
Operating Temperature -40 °C up to +85 °C
Width0.8 mm
Height0.7 mm
PackagingTape and Reel 
MountSMT 
WL-SMCW SMT Mono-color Chip LED Waterclear, 1.6 mm, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Dominant Wavelength [typ.]525 nm
Emitting ColorGreen 
Peak Wavelength [typ.]515 nm
Luminous Intensity [typ.]430 mcd
Forward Voltage [typ.]3.2 V
Chip TechnologyInGaN 
Viewing Angle Phi 0° [typ.]140 °
Size0603 
Operating Temperature -40 °C up to +85 °C
Width0.8 mm
Height0.7 mm
PackagingTape and Reel 
MountSMT 
WCAP-CSGP MLCCs 16 V(DC), 1.6 mm, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Capacitance100 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 16 V(DC), 1.6 mm, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Capacitance220 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance2.3 GΩ
Ceramic TypeX7R Class II 
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 16 V(DC), 1.6 mm, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Capacitance1 µF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.1 GΩ
Ceramic TypeX7R Class II 
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 50 V(DC), 1.6 mm, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Capacitance10 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 25 V(DC), 1.6 mm, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Capacitance10 µF
Capacitance±20% 
Rated Voltage25 V (DC)
Size0603 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor20 %
Insulation Resistance0.01 GΩ
Ceramic TypeX5R Class II 
Width0.8 mm
Height0.8 mm
Pad Dimension0.35 mm
Packaging7" Tape & Reel 
WR-PHD Jumper, 2.44 mm, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Product seriesWR-PHD Jumper
Length2.44 mm
Operating Temperature -40 °C up to +125 °C
Insulation Resistance1000 MΩ
PackagingBag 
Pins
Rated Current3 A
Working Voltage250 V (AC)
ColorBlack 
GenderJumper 
WR-PHD Pin Header - Single, 5.08 mm, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length5.08 mm
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
PackagingBag 
Pins
TypeStraight 
MountTHT 
Rated Current3 A
Working Voltage250 V (AC)
GenderPin Header 
WA-SNTE Snap-In Stop Spacer for Printed Circuit Boards, –, M3
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Inner ThreadM3 
Operating Temperature -30 °C up to +85 °C
Height2.4 mm
PackagingBag 
ColorNatural