IC manufacturers STMicroelectronics
IC manufacturers (103)
- All manufacturers
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (28)
- Ablic (23)
- Acco Semiconductor (1)
- Advanced Power (4)
- Allegro Microsystems (100)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (204)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (46)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (259)
- Divimath (8)
- Elmos AG (1)
- EPC (136)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (8)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- IKON (1)
- Indie Semiconductor (8)
- Innovision Semiconductor Inc (2)
- Intel (68)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (3)
- Kinetic Technology (8)
- Lattice semiconductor Corporation (38)
- Littelfuse (1)
- Lumissil Microsystems (8)
- M3 Technology (M3Tek) (7)
- Macnica (22)
- Marvell Semiconductor (1)
- MaxLinear (181)
- Menlo Micro (1)
- MikroE (25)
- MindCet (2)
- Monolithic Power Systems (980)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (266)
- Nisshinbo Micro Device Inc. (10)
- Novosense Micro (1)
- NXP (333)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (117)
- Powermat (1)
- Pulsiv (19)
- Qorvo (96)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (297)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (86)
- SG-Micro (54)
- SiFive (2)
- Silanna Semiconductor (9)
- Silergy Corporation (33)
- Silicon Laboratory Inc. (108)
- Silicontent Technology (59)
- Silvertel (59)
- Skycore Semiconductors (1)
- Skyworks (33)
- Southchip (14)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (31)
- Wise Integration (3)
- Wolfspeed (23)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
STMicroelectronics TCPP02-M18 | Demoboard X-NUCLEO-SRC1M1
USB Type-C Power Delivery source expansion board based on TCPP02-M18 for STM32 Nucleo
Overview
| Topology | USB |
| IC revision | 2 |
Description
The X-NUCLEO-SRC1M1 expansion board allows evaluating the features of the TCPP02-M18 for the USB Type-C™ and theprotections for VBUS and CC lines suitable for source applications.The expansion board is designed to be stacked on top of any STM32 Nucleo-64 development board with Power Delivery(UCPD) peripheral embedded in the microcontroller.You can also stack it on top of any other STM32 Nucleo-64 development board not supporting the UCPD peripheral for 5V, source only, to demonstrate the USB Type-C™ basic operations (attach, detach and 5 V power supply current capabilityinformation).When using an STM32 Nucleo-64 development board with a Power Delivery peripheral, data functionalities as a host device or dual role data (DRD) are also allowed.The X-NUCLEO-SRC1M1 provides an effective demonstration of the source operation of the USB Type-C™ connector when an external compatible source is connected to the board. The integrated ST715PU33R LDO linear regulator can supply the connected STM32 Nucleo development board.The X-NUCLEO-SRC1M1 is compliant with the latest USB Type-C™ and Power Delivery specifications.The companion software package (X-CUBE-TCPP) contains the application examples for the development boards embeddingUCPD-based microcontrollers (for example, NUCLEO-G071RB, NUCLEO-G474RE, and NUCLEO-G0B1RE) and for those notsupporting the UCPD peripheral (NUCLEO-L412RB-P).
Features
- Supports all USB Type-C™ Power Delivery SPR profiles up to 100 W
- Manages source role data/power configuration
- Compliant with USB 2.0 dual role data according to STM32 USB data capability
- 8/20 μs surge and overcurrent protections, and discharge for VBUS
- Short to VBUS protection for configuration channel pins (CC1 and CC2)
- ESD protection (IEC61000-4-2 level 4 ± 8 kV contact discharge) for CC1, CC2, D+, and D-
- Overvoltage and overcurrent protections, and discharge for VCONN
- Common mode filter on D+/D- data lines
- Two power modes to optimize the current consumption
- Compliant with programmable power supplies (PPS)
- Free comprehensive development firmware library
- Compliant with STM32 Nucleo-64 boards featuring an STM32 with UCPD feature for Power Delivery and without UCPD feature for a 5 V solution only
- USB Type-C™ connector;
- the Power Delivery controller embedded in the STM32 (UCPD) on the STM32 Nucleo development board;
- the power supply.It also provides USB 2.0 data lines interface connection to the STM32 Nucleo MCU.
- The BoM is optimized without compromising the protections for:
- VBUS line: overcurrent and surge protections;
- CC lines: overvoltage, overcurrent, and ESD protections;
- data lines: ESD protection and EMI filtering.As required by the Power Delivery protocol, the TCPP02-M18 features:
- CC lines switch matrix for VCONN;
- VBUS discharge;
- VCONN discharge.
Typical applications
- USB Type-C Power Delivery
More information
Products
Order Code | Datasheet | Simulation | Downloads | Status | Product series | Pins | PCB/Cable/Panel | Modularity | Type | Wire Section | λDom typ.(nm) | Emitting Color | λPeak typ.(nm) | IV typ.(mcd) | VF typ.(V) | Chip Technology | 2θ50% typ.(°) | C | Tol. C | VR(V (DC)) | Size | Operating Temperature | DF(%) | RISO | Ceramic Type | L(mm) | W(mm) | H(mm) | Fl(mm) | Packaging | Interface Type | Gender | Mount | PCB Thickness(mm) | IR(A) | Working Voltage(V (AC)) | G(mm) | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | WR-TBL Series 2109 - 2.54 mm Horiz. Entry, 2, Rising Cage Clamp | Simulation– | Downloads6 files | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWR-TBL Series 2109 - 2.54 mm Horiz. Entry | Pins2 | PCB/Cable/PanelPCB | ModularityNo | TypeHorizontal | Wire Section 30 to 18 (AWG) 0.2 to 0.75 (mm²) | – | – | – | – | – | – | – | – | – | – | – | Operating Temperature -40 °C up to +105 °C | – | – | – | Length5.48 mm | – | – | – | PackagingBox | – | – | MountTHT | – | Rated Current6 A | Working Voltage150 V (AC) | – | ||
 | WR-PHD Pin Header - Single, 3, – | Simulation– | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWR-PHD Pin Header - Single | Pins3 | – | – | TypeStraight | – | – | – | – | – | – | – | – | – | – | – | – | Operating Temperature -40 °C up to +105 °C | – | Insulation Resistance1000 MΩ | – | Length7.62 mm | – | – | – | PackagingBag | – | GenderPin Header | MountTHT | – | Rated Current3 A | Working Voltage250 V (AC) | – | |||
 | WR-PHD Pin Header - Dual, 4, – | Simulation– | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWR-PHD Pin Header - Dual | Pins4 | – | – | TypeStraight | – | – | – | – | – | – | – | – | – | – | – | – | Operating Temperature -40 °C up to +105 °C | – | Insulation Resistance1000 MΩ | – | Length5.08 mm | – | – | – | PackagingBag | – | GenderPin Header | MountTHT | – | Rated Current3 A | Working Voltage250 V (AC) | – | |||
 | WR-PHD Socket Header - Single, 6, – | Simulation– | Downloads7 files | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWR-PHD Socket Header - Single | Pins6 | – | – | TypeStraight | – | – | – | – | – | – | – | – | – | – | – | – | Operating Temperature -40 °C up to +105 °C | – | Insulation Resistance1000 MΩ | – | Length15.74 mm | – | – | – | PackagingTray | – | GenderSocket Header | MountTHT | – | Rated Current3 A | Working Voltage250 V (AC) | – | ||
 | WR-PHD Socket Header - Single, 8, – | Simulation– | Downloads7 files | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWR-PHD Socket Header - Single | Pins8 | – | – | TypeStraight | – | – | – | – | – | – | – | – | – | – | – | – | Operating Temperature -40 °C up to +105 °C | – | Insulation Resistance1000 MΩ | – | Length20.82 mm | – | – | – | PackagingTray | – | GenderSocket Header | MountTHT | – | Rated Current3 A | Working Voltage250 V (AC) | – | ||
 | Simulation– | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWR-PHD Pin Header - Dual | Pins8 | – | – | TypeStraight | – | – | – | – | – | – | – | – | – | – | – | – | Operating Temperature -40 °C up to +105 °C | – | Insulation Resistance1000 MΩ | – | Length10.16 mm | – | – | – | PackagingBag | – | GenderPin Header | MountTHT | – | Rated Current3 A | Working Voltage250 V (AC) | – | ||||
 | WR-PHD Socket Header - Single, 10, – | Simulation– | Downloads7 files | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWR-PHD Socket Header - Single | Pins10 | – | – | TypeStraight | – | – | – | – | – | – | – | – | – | – | – | – | Operating Temperature -40 °C up to +105 °C | – | Insulation Resistance1000 MΩ | – | Length25.9 mm | – | – | – | PackagingTray | – | GenderSocket Header | MountTHT | – | Rated Current3 A | Working Voltage250 V (AC) | – | ||
 | WR-USB Type C Connectors, 24, USB 3.1 | Simulation– | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWR-USB Type C Connectors | Pins24 | – | – | TypeHorizontal | – | – | – | – | – | – | – | – | – | – | – | – | Operating Temperature -40 °C up to +105 °C | – | Insulation Resistance1000 MΩ | – | – | – | – | – | PackagingTape and Reel | Interface TypeType C | GenderReceptacle | MountTHR | PCB Thickness1.6 mm | Rated Current5 A | Working Voltage48 V (AC) | Pin length1.9 mm | |||
 | WL-SMCW SMT Mono-color Chip LED Waterclear, –, – | Downloads27 files RAY files
| Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWL-SMCW SMT Mono-color Chip LED Waterclear | – | – | – | – | – | Dominant Wavelength [typ.]470 nm | Emitting ColorBlue | Peak Wavelength [typ.]465 nm | Luminous Intensity [typ.]145 mcd | Forward Voltage [typ.]3.2 V | Chip TechnologyInGaN | Viewing Angle Phi 0° [typ.]140 ° | – | – | – | Size0603 | Operating Temperature -40 °C up to +85 °C | – | – | – | Length1.6 mm | Width0.8 mm | Height0.7 mm | – | PackagingTape and Reel | – | – | MountSMT | – | – | – | – | |||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Capacitance330 pF | Capacitance±10% | Rated Voltage50 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Dissipation Factor2.5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 6.3 V(DC), –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 6.3 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Capacitance470 nF | Capacitance±20% | Rated Voltage6.3 V (DC) | Size0402 | Operating Temperature -55 °C up to +85 °C | Dissipation Factor10 % | Insulation Resistance0.2 GΩ | Ceramic TypeX5R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Capacitance100 nF | Capacitance±10% | Rated Voltage50 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Dissipation Factor10 % | Insulation Resistance0.5 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | – | – | – | – | – | – | – | |||||
 | WL-SMCW SMT Mono-color Chip LED Waterclear, –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWL-SMCW SMT Mono-color Chip LED Waterclear | – | – | – | – | – | Dominant Wavelength [typ.]525 nm | Emitting ColorGreen | Peak Wavelength [typ.]515 nm | Luminous Intensity [typ.]700 mcd | Forward Voltage [typ.]3.2 V | Chip TechnologyInGaN | Viewing Angle Phi 0° [typ.]140 ° | – | – | – | Size0603 | Operating Temperature -40 °C up to +85 °C | – | – | – | Length1.6 mm | Width0.8 mm | Height0.25 mm | – | – | – | – | MountSMT | – | – | – | – | ||||
| WCAP-CSGP MLCCs 25 V(DC), –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Capacitance100 nF | Capacitance±10% | Rated Voltage25 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Dissipation Factor10 % | Insulation Resistance5 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | – | – | – | – | – | – | – |