IC manufacturers STMicroelectronics

IC manufacturers (103)

STMicroelectronics STSPIN32F0251 | Demoboard EVSPIN32F0251S1

250 V three-phase controller with MCU

Overview

TopologyPositive to Negative Converter
Input voltage20-120 V
IC revision1

Description

The STSPIN32F025x system-in-package is an extremely integrated solution for driving three-phase applications, helping designers to reduce PCB area and overall bill-of-material.It embeds an STM32F031x6x7 featuring an ARM® 32-bit Cortex®-M0 CPU and a 250 V triple half-bridge gate driver, able to drive N-channel power MOSFETs or IGBTs.A comparator featuring advanced smartSD function is integrated, ensuring fast and effective protection against overload and overcurrent.The high-voltage bootstrap diodes are also integrated, as well as anti cross-conduction, deadtime and UVLO protection on both the lower and upper driving sections, which prevents the power switches from operating in low efficiency or dangerous conditions. Matched delays between low and high-side sections guarantee no cycle distortion.The integrated MCU allows performing FOC, 6-step sensorless and other advanced driving algorithms including the speed control loop.

Features

  • Input voltage from 20 V to 120 V DC/AC
  • STD17NF25 MOSFETs power stage featuring:
  • VDS = 250 V
  • RDS(on) max.= 0.165 Ω
  • Overcurrent threshold set to 16 Apeak
  • Dual footprint for IGBT/MOSFET package:
  • DPAK
  • PowerFlat 6x5
  • Single-shunt current sensing, suitable for:
  • Sensored or sensorless 6 steps algorithm
  • Single-shunt vector (FOC) algorithm
  • Smart shutdown overcurrent protection
  • Digital Hall sensors and encoder input
  • Bus voltage sensing
  • 15 V VCC and 3.3 V VDD supplies
  • Embedded ST-LINK/V2-1
  • Easy user interface with buttons and trimmer
  • RoHS compliant

Typical applications

  • Battery operated and 110 Vac supplied power and garden tools
  • Industrial fans and pumps
  • Home appliances
  • Industrial and home automation

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
Pins
PCB/Cable/Panel
Modularity
Type
Wire Section
λDom typ.(nm)
Emitting Color
λPeak typ.(nm)
IV typ.(mcd)
VF typ.(V)
Chip Technology
50% typ.(°)
C
VR(V (AC))
Safety Class
dV/dt(V/µs)
DF @ 1 kHz(%)
RISO
Pitch(mm)
L(mm)
W(mm)
Packaging
Tol. C
Size
Operating Temperature
Q(%)
DF(%)
Ceramic Type
Fl(mm)
Endurance(h)
IRIPPLE(mA)
ILeak(µA)
Ø D(mm)
Interface Type
Variant
Gender
Mount
IR(A)
Working Voltage(V (AC))
G(mm)
H(mm)
Operation Force(g)
Electrical Life(Cycles)
Actuator Color
Washable
Vaporphase process
Samples
WR-TBL Series 2135 - 5.08 mm Horizontal Entry Modular w. Rising Cage Clamp, 2, Rising Cage Clamp
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pins
PCB/Cable/PanelPCB 
ModularityYes 
TypeHorizontal 
Wire Section 14 to 30 (AWG) 2.08 to 0.0509 (mm²)
Pitch5.08 mm
Length10.16 mm
PackagingBox 
Operating Temperature -30 °C up to +120 °C
MountTHT 
Rated Current14 A
Working Voltage250 V (AC)
WR-PHD Pin Header - Single, 2, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pins
TypeStraight 
Insulation Resistance1000 MΩ
Pitch2.54 mm
Length5.08 mm
PackagingBag 
Operating Temperature -40 °C up to +105 °C
GenderPin Header 
MountTHT 
Rated Current3 A
Working Voltage250 V (AC)
WR-TBL Series 2135 - 5.08 mm Horizontal Entry Modular w. Rising Cage Clamp, 3, Rising Cage Clamp
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pins
PCB/Cable/PanelPCB 
ModularityYes 
TypeHorizontal 
Wire Section 14 to 30 (AWG) 2.08 to 0.0509 (mm²)
Pitch5.08 mm
Length15.24 mm
PackagingBox 
Operating Temperature -30 °C up to +120 °C
MountTHT 
Rated Current14 A
Working Voltage250 V (AC)
WR-PHD Pin Header - Single, 3, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pins
TypeStraight 
Insulation Resistance1000 MΩ
Pitch2.54 mm
Length7.62 mm
PackagingBag 
Operating Temperature -40 °C up to +105 °C
GenderPin Header 
MountTHT 
Rated Current3 A
Working Voltage250 V (AC)
WR-PHD Pin Header - Single, 4, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pins
TypeStraight 
Insulation Resistance1000 MΩ
Pitch2.54 mm
Length10.16 mm
PackagingBag 
Operating Temperature -40 °C up to +105 °C
GenderPin Header 
MountTHT 
Rated Current3 A
Working Voltage250 V (AC)
WR-PHD Pin Header - Single, 5, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pins
TypeStraight 
Insulation Resistance1000 MΩ
Pitch2.54 mm
Length12.7 mm
PackagingBag 
Operating Temperature -40 °C up to +105 °C
GenderPin Header 
MountTHT 
Rated Current3 A
Working Voltage250 V (AC)
WR-USB Mini/Micro Connectors, 5, Mini USB 2.0
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pins
TypeHorizontal 
Insulation Resistance1000 MΩ
PackagingTape and Reel & Mylar 
Operating Temperature -40 °C up to +105 °C
Interface TypeType B 
Variantwith Pads & Pegs 
GenderReceptacle 
MountSMT 
Rated Current1 A
Working Voltage30 V (AC)
WCAP-FTXX Film Capacitors, –, Across the mains
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 nF
Rated Voltage310 V (AC)
Safety ClassX2 
Rate of Voltage Rise500 V/µs
Dissipation Factor0.1 %
Insulation Resistance30 GΩ
Pitch10 mm
Length13 mm
Width5 mm
PackagingBulk 
Capacitance±10% 
SizePitch 10 mm 
Operating Temperature -40 °C up to +105 °C
MountBoxed THT 
Pin length18 mm
Height11 mm
WL-SMCW SMT Mono-color Chip LED Waterclear, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]625 nm
Emitting ColorRed 
Peak Wavelength [typ.]630 nm
Luminous Intensity [typ.]250 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Length1.6 mm
Width0.8 mm
PackagingTape and Reel 
Size0603 
Operating Temperature -40 °C up to +85 °C
MountSMT 
Height0.7 mm
WL-SMCW SMT Mono-color Chip LED Waterclear, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]590 nm
Emitting ColorYellow 
Peak Wavelength [typ.]595 nm
Luminous Intensity [typ.]120 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Length1.6 mm
Width0.8 mm
PackagingTape and Reel 
Size0603 
Operating Temperature -40 °C up to +85 °C
MountSMT 
Height0.7 mm
WL-SMCW SMT Mono-color Chip LED Waterclear, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]525 nm
Emitting ColorGreen 
Peak Wavelength [typ.]515 nm
Luminous Intensity [typ.]450 mcd
Forward Voltage [typ.]3.2 V
Chip TechnologyInGaN 
Viewing Angle Phi 0° [typ.]140 °
Length2 mm
Width1.25 mm
PackagingTape and Reel 
Size0805 
Operating Temperature -40 °C up to +85 °C
MountSMT 
Height0.7 mm
WCAP-ASLU Aluminum Electrolytic Capacitors, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance22 µF
Rated Voltage25 V (AC)
Insulation Resistance4.54545 MΩ
Length5.5 mm
Width5.3 mm
Packaging15" Tape & Reel 
Capacitance±20% 
Size5.0 x 5.5 
Operating Temperature -40 °C up to +85 °C
Dissipation Factor16 %
Endurance 1000
Ripple Current42 mA
Leakage Current1.1 µA
Diameter5 mm
MountV-Chip SMT 
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 pF
Rated Voltage10 V (AC)
Insulation Resistance10 GΩ
Length1.6 mm
Width0.8 mm
Packaging7" Tape & Reel 
Capacitance±5% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor600 %
Ceramic TypeNP0 Class I 
Pad Dimension0.4 mm
Height0.8 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance33 pF
Rated Voltage25 V (AC)
Insulation Resistance10 GΩ
Length1.6 mm
Width0.8 mm
Packaging7" Tape & Reel 
Capacitance±5% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Ceramic TypeNP0 Class I 
Pad Dimension0.4 mm
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance4.7 pF
Rated Voltage50 V (AC)
Insulation Resistance10 GΩ
Length1.6 mm
Width0.8 mm
Packaging7" Tape & Reel 
Capacitance±0.5pF 
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor494 %
Ceramic TypeNP0 Class I 
Pad Dimension0.4 mm
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 pF
Rated Voltage50 V (AC)
Insulation Resistance10 GΩ
Length1.6 mm
Width0.8 mm
Packaging7" Tape & Reel 
Capacitance±5% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor600 %
Ceramic TypeNP0 Class I 
Pad Dimension0.4 mm
Height0.8 mm
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 nF
Rated Voltage10 V (AC)
Insulation Resistance10 GΩ
Length1.6 mm
Width0.8 mm
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Height0.8 mm
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Rated Voltage10 V (AC)
Insulation Resistance0.1 GΩ
Length1.6 mm
Width0.8 mm
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Height0.8 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 nF
Rated Voltage25 V (AC)
Insulation Resistance10 GΩ
Length1.6 mm
Width0.8 mm
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Height0.8 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance3.3 nF
Rated Voltage25 V (AC)
Insulation Resistance10 GΩ
Length1.6 mm
Width0.8 mm
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Height0.8 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance4.7 nF
Rated Voltage25 V (AC)
Insulation Resistance10 GΩ
Length1.6 mm
Width0.8 mm
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Height0.8 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 nF
Rated Voltage25 V (AC)
Insulation Resistance10 GΩ
Length1.6 mm
Width0.8 mm
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Height0.8 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance47 nF
Rated Voltage25 V (AC)
Insulation Resistance10 GΩ
Length1.6 mm
Width0.8 mm
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Height0.8 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Rated Voltage25 V (AC)
Insulation Resistance5 GΩ
Length1.6 mm
Width0.8 mm
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Height0.8 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance220 nF
Rated Voltage25 V (AC)
Insulation Resistance2.3 GΩ
Length1.6 mm
Width0.8 mm
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 nF
Rated Voltage50 V (AC)
Insulation Resistance10 GΩ
Length1.6 mm
Width0.8 mm
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Rated Voltage50 V (AC)
Insulation Resistance5 GΩ
Length1.6 mm
Width0.8 mm
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Height0.8 mm
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance4.7 µF
Rated Voltage10 V (AC)
Insulation Resistance0.02 GΩ
Length2 mm
Width1.25 mm
Packaging7" Tape & Reel 
Capacitance±10% 
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Ceramic TypeX7R Class II 
Pad Dimension0.5 mm
Height1.25 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Rated Voltage50 V (AC)
Insulation Resistance5 GΩ
Length2 mm
Width1.25 mm
Packaging7" Tape & Reel 
Capacitance±10% 
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.5 mm
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Rated Voltage50 V (AC)
Insulation Resistance0.1 GΩ
Length2 mm
Width1.25 mm
Packaging7" Tape & Reel 
Capacitance±10% 
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Ceramic TypeX7R Class II 
Pad Dimension0.5 mm
Height1.25 mm
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 µF
Rated Voltage10 V (AC)
Insulation Resistance0.01 GΩ
Length3.2 mm
Width1.6 mm
Packaging7" Tape & Reel 
Capacitance±10% 
Size1206 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Ceramic TypeX7R Class II 
Pad Dimension0.6 mm
Height1.6 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance4.7 µF
Rated Voltage50 V (AC)
Insulation Resistance0.02 GΩ
Length3.2 mm
Width1.6 mm
Packaging7" Tape & Reel 
Capacitance±10% 
Size1206 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Ceramic TypeX7R Class II 
Pad Dimension0.5 mm
Height1.6 mm
WS-TASV J-Bend SMT Washable Tact Switch 6x6 mm, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Rated Voltage12 V (AC)
Insulation Resistance100 MΩ
PackagingTape and Reel 
Operating Temperature -40 °C up to +85 °C
Rated Current0.05 A
Height2.5 mm
Operation Force160 g
Electrical Life1000000 Cycles
Actuator ColorBlack 
WashableYes 
Vaporphase processnot specified