IC manufacturers STMicroelectronics

IC manufacturers (103)

STMicroelectronics MP23DB02MMTR | Demoboard X-STM32MP-MSP01

STM32MP expansion board for motion MEMS, environmental, ToF, and ALS sensor applications

Overview

TopologyOther Topology
IC revision2

Description

The X-STM32MP-MSP01 is a multisensor evaluation board that embeds motion MEMS, environmental, ambient light and Time-of-Flight sensors, a digital microphone, and an NFC tag. This board works with the STM32MPU discovery kit. It can be used with the X-LINUX-MSP1 to read the sensors. The X-STM32MP-MSP01 main devices are the ISM330DHCX 3-axis accelerometer and gyroscope, the IIS2MDC 3-axis magnetometer, and the LPS22HH MEMS nano pressure sensor. The board also includes the STTS22H digital temperature sensor, the VD6283TX ambient light sensor, the IIS2DLPC 3-axis accelerometer, the VL53L5CX multizone ranging sensor, and the MP23DB02MM digital MEMS microphone. The on-board dynamic NFC/RFID tag IC can work with a dual interface for the I²C, through a 13.56 MHz RFID reader, or via an NFC phone. The X-STM32MP-MSP01 interfaces with the STM32MP1Dev via a 40-pin GPIO connector pins using I²C, SPI, and general GPIO pins. It is compatible with STM32MP157F-DK2 and a Raspberry Pi GPIO connector layout.

Features

  • ISM330DHCX: 3-axis accelerometer and 3-axis gyroscope
  • IIS2MDC: 3-axis digital magnetometer (±50 gausses)
  • IIS2DLPC: 3-axis accelerometer for industrial applications (±2/±4/±8/±16 g)
  • STTS22H: digital temperature sensor (-40 to +125°C)
  • LPS22HH: nano pressure sensor (260 - 1260 hPa)
  • VD6283TX: ambient light sensor
  • VL53L5CX: Time-of-Flight (ToF) multizone ranging sensor
  • Dynamic NFC/RFID tag
  • Digital microphone
  • Standard DIL 24 pin socket for adapter boards
  • Compatible with STM32MP157F-DK2 and Raspberry Pi

Typical applications

  • Industrial robots

More information

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
L(mm)
Ti
λDom typ.(nm)
Emitting Color
λPeak typ.(nm)
IV typ.(mcd)
VF typ.(V)
Chip Technology
50% typ.(°)
C
Tol. C
VR(V (DC))
Size
Operating Temperature
Q(%)
RISO
Ceramic Type
W(mm)
H(mm)
Fl(mm)
Packaging
Z @ 100 MHz(Ω)
Zmax(Ω)
Test Condition Zmax
IR 2(mA)
RDC max.(Ω)
Type
Samples
WL-SMCW SMT Mono-color Chip LED Waterclear, 1.6 mm, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Dominant Wavelength [typ.]625 nm
Emitting ColorRed 
Peak Wavelength [typ.]630 nm
Luminous Intensity [typ.]250 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Size0603 
Operating Temperature -40 °C up to +85 °C
Width0.8 mm
Height0.7 mm
PackagingTape and Reel 
WL-SMCW SMT Mono-color Chip LED Waterclear, 1.6 mm, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Dominant Wavelength [typ.]525 nm
Emitting ColorGreen 
Peak Wavelength [typ.]515 nm
Luminous Intensity [typ.]430 mcd
Forward Voltage [typ.]3.2 V
Chip TechnologyInGaN 
Viewing Angle Phi 0° [typ.]140 °
Size0603 
Operating Temperature -40 °C up to +85 °C
Width0.8 mm
Height0.7 mm
PackagingTape and Reel 
WCAP-CSGP MLCCs 16 V(DC), 1.6 mm, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Capacitance100 pF
Capacitance±5% 
Rated Voltage16 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WE-CBF SMT EMI Suppression Ferrite Bead, 2 mm, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length2 mm
Size0805 
Operating Temperature -55 °C up to +125 °C
Width1.2 mm
Height0.9 mm
Pad Dimension0.5 mm
Impedance @ 100 MHz600 Ω
Maximum Impedance3000 Ω
Maximum Impedance180 MHz 
Rated Current 2900 mA
DC Resistance0.5 Ω
TypeHigh Speed 
WA-SNTE Snap-In Stop Spacer for Printed Circuit Boards, –, M3
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Inner ThreadM3 
Operating Temperature -30 °C up to +85 °C
Height2.4 mm
PackagingBag