IC manufacturers STMicroelectronics

IC manufacturers (103)

STMicroelectronics L9963E | Demoboard AEK-POW-BMSCCTX

Overview

TopologyBattery Management System
IC revision2.0

Description

The AEK-POW-BMSCCTX is a packaged very compact battery management system (BMS) evaluation board that can handle from 1 to 31 BMS nodes.Each battery node manages from 4 to 14 battery cells. The total voltage of the chain may range between 48 and 800 V.The main advantage of this evaluation board is ensuring isolated connection to an external MCU, thanks to the embedded transceiver.The ability to easily integrate into a system, compact dimensions, and a wide range of applications make this compact BMS system ideal for any solution enhancing battery life, efficiency, and cost effectiveness during use and operation.The small size allows for greater flexibility in battery pack installation, addressing the challenges of using a BMS in confined spaces.Its compact design allows it to fit easily, enabling more batteries to be installed within the same volume.This increases the overall battery storage, providing robust performance without adding unnecessary weight. It emphasizes the growing trend of making energy solutions more accessible and effective across different applications.The board is based on the L9963E Li-ion battery monitoring and protection chip for high-reliability automotive applications and the L9963T general-purpose SPI to isolated SPI bidirectional transceiver.The main activity of the L9963E is monitoring the cells and battery node status through stack voltage measurement, cell voltage measurement, temperature measurement, and coulomb counting.Measurement and diagnostic tasks can be executed either on demand or periodically, with a programmable cycle interval.Measurement data are available for an external microcontroller to perform charge balancing and to compute the state of charge (SoC) and the state of health (SOH).The L9963T general-purpose SPI to isolated SPI bidirectional transceiver can transfer communication data incoming from a classical 4-wire based SPI interface to a 2-wire isolated interface (and vice versa). In our board, the transceiver is configured as a slave.The AEK-POW-BMSCCTX provides an elaborate monitoring network to sense the voltage of each cell.It is possible to sense the current of the entire battery pack. This sensing allows elaborating the SoC of each battery cell and, consequently, the state of charge of all battery packs.The SoC allows assessing the remaining battery capacity. For maintenance reasons, it is important to monitor the SoC estimation over time.According to our algorithm for the SoC calculation, the more the SoC differs from its nominal value (that is, its value when the batteries are new), the more a cell of the battery pack risks overdischarging.The SoC evolution overtime allows asserting the state of health (SOH) of a cell or a battery pack to spot early indications that a cell is at risk of overdischarge or overcharging.The SoC of a battery cell is required to maintain its safe operation and duration during charge, discharge, and storage.The SoC cannot be measured directly and is estimated from other measurements and known parameters (such as characterization curves or look-up tables). This information on the battery cells is necessary to determine how the voltage varies according to the current, the temperature, based on the battery chemical composition and production lot used.In the AutoDevKit ecosystem software package, we created an example to elaborate SoC and SOH, using Li-ion batteries. Battery packs may have different SOCs, and balancing is necessary to bring them all to the same charge level.After detecting the lowest charge in the battery pack, all the other battery nodes are discharged to reach its level. The demo explains how to activate the internal MOSFETs of the L9963E, which short-circuit the cell on an external dissipation resistor (resistors are already mounted on the board) to discharge it.Passive cell balancing is performed via the L9963E internal MOSFETs. The controller can either manually control the balancing drivers or start a balancing task with a fixed duration.In the second case, the balancing may be programmed to continue even when the IC enters a low-power mode called silent balancing, to avoid unnecessary current absorption from the battery pack.The balancing function is necessary to lengthen the battery capacity and its duration.Different MCUs can be used. In our demos, we used the AEK-MCU-C4MINI1 and other ASIL-B and ASIL-D microcontrollers of the SPC58 chorus family.

Features

Hosts the L9963E AEC-Q100 qualified automotive multicell battery monitoring and balancing ICHosts the L9963T AEC-Q100 qualified automotive general-purpose SPI to isolated SPI bidirectional transceiverVoltage monitoring of up to 14 battery cellsCurrent sensing of the entire battery node5 configurable GPIOs, pluggable with NTCs for temperature measurementsSPI interface to communicate with an MCUISO SPI interface to communicate with an optional AEK-POW-BMSCC node, creating a BMS chainP1 connector that interfaces directly to an MCU board for control and diagnostic functionsPassive cell balancingPackaged and very compact size: 70 x 45 mmIncluded in the AutoDevKit ecosystem

Typical applications

  • Electro-mobility

Products

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λDom typ.(nm)
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λPeak typ.(nm)
IV typ.(mcd)
VF typ.(V)
Chip Technology
50% typ.(°)
Gender
Pins
Type
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Contact Plating
IR(A)
Working Voltage(V (AC))
Contact Resistance(mΩ)
Packaging
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Stranded Wire Section (AWG)
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C
Tol. C
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Q(%)
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L(mm)
W(mm)
H(mm)
Fl(mm)
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VCE max.(V)
IF max.(mA)
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CTR min.(%)
CTR max.(%)
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PCB/Cable/Panel
Samples
WL-SMCW SMT Mono-color Chip LED Waterclear, 470 nm, Blue
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]470 nm
Emitting ColorBlue 
Peak Wavelength [typ.]465 nm
Luminous Intensity [typ.]145 mcd
Forward Voltage [typ.]3.2 V
Chip TechnologyInGaN 
Viewing Angle Phi 0° [typ.]140 °
PackagingTape and Reel 
Packaging Unit4000 pcs
Size1206 
Operating Temperature -40 °C up to +85 °C
Length3.2 mm
Width1.6 mm
Height0.68 mm
MountSMT 
WL-SMCW SMT Mono-color Chip LED Waterclear, 525 nm, Green
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]525 nm
Emitting ColorGreen 
Peak Wavelength [typ.]515 nm
Luminous Intensity [typ.]450 mcd
Forward Voltage [typ.]3.2 V
Chip TechnologyInGaN 
Viewing Angle Phi 0° [typ.]140 °
PackagingTape and Reel 
Packaging Unit4000 pcs
Size1206 
Operating Temperature -40 °C up to +85 °C
Length3.2 mm
Width1.6 mm
Height0.68 mm
MountSMT 
WL-SMCW SMT Mono-color Chip LED Waterclear, 590 nm, Yellow
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]590 nm
Emitting ColorYellow 
Peak Wavelength [typ.]595 nm
Luminous Intensity [typ.]120 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
PackagingTape and Reel 
Packaging Unit4000 pcs
Size1206 
Operating Temperature -40 °C up to +85 °C
Length3.2 mm
Width1.6 mm
Height0.68 mm
MountSMT 
WL-SMCW SMT Mono-color Chip LED Waterclear, 605 nm, Amber
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]605 nm
Emitting ColorAmber 
Peak Wavelength [typ.]610 nm
Luminous Intensity [typ.]140 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
PackagingTape and Reel 
Packaging Unit4000 pcs
Size1206 
Operating Temperature -40 °C up to +85 °C
Length3.2 mm
Width1.6 mm
Height0.68 mm
MountSMT 
WL-SMCW SMT Mono-color Chip LED Waterclear, 625 nm, Red
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]625 nm
Emitting ColorRed 
Peak Wavelength [typ.]630 nm
Luminous Intensity [typ.]150 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
PackagingTape and Reel 
Packaging Unit4000 pcs
Size1206 
Operating Temperature -40 °C up to +85 °C
Length3.2 mm
Width1.6 mm
Height0.68 mm
MountSMT 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit4000 pcs
Capacitance22 pF
Capacitance±5% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor840 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit4000 pcs
Capacitance33 pF
Capacitance±5% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit4000 pcs
Capacitance2.2 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit4000 pcs
Capacitance4.7 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit4000 pcs
Capacitance6.8 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit4000 pcs
Capacitance10 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit4000 pcs
Capacitance47 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit4000 pcs
Capacitance68 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3 %
Insulation Resistance7.4 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit3000 pcs
Capacitance2.2 µF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.05 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Height1.25 mm
Pad Dimension0.5 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit3000 pcs
Capacitance1 µF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.1 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Height1.25 mm
Pad Dimension0.5 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit2000 pcs
Capacitance4.7 µF
Capacitance±10% 
Rated Voltage50 V (DC)
Size1206 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.02 GΩ
Ceramic TypeX7R Class II 
Length3.2 mm
Width1.6 mm
Height1.6 mm
Pad Dimension0.5 mm
WR-WTB 2.00 mm Female Dual Row Terminal Housing w. positive locking, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
GenderFemale 
Pins28 
TypeTerminal Housing 
PackagingBag 
Operating Temperature -25 °C up to +85 °C
Insulation Resistance1000 MΩ
Length31.4 mm
PCB/Cable/PanelCable 
WR-WTB 2.00 mm Female Dual Row Terminal Housing w. positive locking, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
GenderFemale 
Pins30 
TypeTerminal Housing 
PackagingBag 
Operating Temperature -25 °C up to +85 °C
Insulation Resistance1000 MΩ
Length33.4 mm
PCB/Cable/PanelCable 
WR-WTB 2.00 mm Male Header, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
GenderMale 
Pins28 
TypeHorizontal 
Contact PlatingTin 
Rated Current3 A
Working Voltage250 V (AC)
Contact Resistance20 mΩ
PackagingTube 
Operating Temperature -25 °C up to +85 °C
Insulation Resistance1000 MΩ
Length31.4 mm
MountTHT 
Rated Current3 A
PCB/Cable/PanelPCB 
WR-WTB 2.00 mm Male Header, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
GenderMale 
Pins30 
TypeHorizontal 
Contact PlatingTin 
Rated Current3 A
Working Voltage250 V (AC)
Contact Resistance20 mΩ
PackagingTube 
Operating Temperature -25 °C up to +85 °C
Insulation Resistance1000 MΩ
Length33.4 mm
MountTHT 
Rated Current3 A
PCB/Cable/PanelPCB 
WR-WTB 2.00 mm Female Dual Row Crimp Contact, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
GenderFemale 
TypeCrimp Terminal 
Wire Section 28 to 22 (AWG) 0.081 to 0.326 (mm²)
Contact PlatingTin 
Rated Current3 A
Working Voltage250 V (AC)
Contact Resistance20 mΩ
PackagingBig Reel 
Packaging Unit10000 pcs
Stranded Wire Section (AWG)28 to 22 (AWG) 
Stranded Wire Section (Metric)0.081 to 0.326 (mm²) 
Operating Temperature -25 °C up to +85 °C
Rated Current3 A
PCB/Cable/PanelCable 
WCAP-CSGP MLCCs 100 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit4000 pcs
Capacitance100 pF
Capacitance±10% 
Rated Voltage100 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
WCAP-CSGP MLCCs 100 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Capacitance100 nF
Capacitance±10% 
Rated Voltage100 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance1 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
WCAP-CSGP MLCCs 100 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Capacitance2.2 µF
Capacitance±10% 
Rated Voltage100 V (DC)
Size1210 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance0.05 GΩ
Ceramic TypeX7R Class II 
Length3.2 mm
Width2.5 mm
Height2.5 mm
Pad Dimension0.75 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Capacitance220 nF
Capacitance±5% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance2.3 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
WL-OCPT SOP-4, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Product seriesWL-OCPT SOP-4
Forward Voltage [typ.]1.24 V
TypeOptocoupler Phototransistor 
SizeSOP4 
Operating Temperature -55 °C up to +110 °C
Length4.4 mm
Width3.6 mm
Height2 mm
PackageSOP 4 
InputDC 
Collector Emitter Voltage35 V
Forward Current60 mA
IF = 5 mA
VCE = 5 V
Current Transfer Ratio [min.]200 %
Current Transfer Ratio [max.]400 %
Isolation Voltage3750 V (RMS)
MountSMT