IC manufacturers NXP

IC manufacturers (103)

NXP MPC5775B | Demoboard MPC5775E-EVB

MPC5775B/E low-cost BMS and Inverter Development Board

Overview

TopologyBattery Management System
Input voltage12 V
IC revisionB1

Description

The MPC5775B-EVB and MPC5775E-EVB are low-cost development boards engineered for battery management and inverter applications.Based on the 32-bit Power Architecture® MPC5775B/E ultra-reliable microcontrollers and the MC3377x battery cell controller, the MPC5775B/E-EVBs are highly-integrated development boards that help speed development.

Features

Microcontroller (MCU)32-bit Power Architecture®MPC5775B/E ultra-reliable microcontrollersSystem Basis Chip (SBC)FS6500: Grade 1 and Grade 0 safety power system basis chip with CAN flexible data transceiverTransceiversTJA1145: High-speed CAN transceiver for partial networkingTJA1100HN: IEEE 100BASE-T1 compliant Automotive Ethernet PHY TransceiverMC33664: Isolated Network High-Speed Transceiver (MPC5775B-EVB only)InterfacesOnboard interfaces for CAN and LINOnboard interfaces for Ethernet, USB, UART, DSPIOnboard interfaces for eMIOS, ADC, DSPI, and eTPU (MPC5775E-EVB only)ConnectorsPCIe X4 style edge connector for motor control interfacesDebug selectable between external debug connection via JTAG or on-board OpenSDA (JTAG to USB interface)PowerRequires 12V external DC power supply (included with boards)

Typical applications

  • Battery Management System (BMS)
  • Motorcycle Engine Control Unit (ECU) and Small Engine Control
  • Diesel Engine Management
  • Motor Drives

More information

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
λDom typ.(nm)
Emitting Color
λPeak typ.(nm)
IV typ.(mcd)
VF typ.(V)
Chip Technology
50% typ.(°)
C
Tol. C
VR(V (DC))
Size
Operating Temperature
Q(%)
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
L(µH)
IRP,40K(A)
ISAT,10%(A)
ISAT,30%(A)
RDC max.(mΩ)
fres(MHz)
Mount
Interface Type
Type
Gender
Pins
PCB Thickness(mm)
IR(A)
Working Voltage(V (AC))
Samples
WL-SMCW SMT Mono-color Chip LED Waterclear, 570 nm, Bright Green
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]570 nm
Emitting ColorBright Green 
Peak Wavelength [typ.]572 nm
Luminous Intensity [typ.]40 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Size0603 
Operating Temperature -40 °C up to +85 °C
Length1.6 mm
Width0.8 mm
Height0.7 mm
PackagingTape and Reel 
MountSMT 
WL-SMCW SMT Mono-color Chip LED Waterclear, 630 nm, Super Red
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]630 nm
Emitting ColorSuper Red 
Peak Wavelength [typ.]645 nm
Luminous Intensity [typ.]60 mcd
Forward Voltage [typ.]1.9 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Size0603 
Operating Temperature -40 °C up to +85 °C
Length1.6 mm
Width0.8 mm
Height0.7 mm
PackagingTape and Reel 
MountSMT 
WE-LHMI SMT Power Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size7050 
Operating Temperature -40 °C up to +125 °C
Length7.3 mm
Width6.6 mm
Height4.8 mm
Inductance22 µH
Performance Rated Current2.75 A
Saturation Current @ 10%4.15 A
Saturation Current @ 30%8.5 A
DC Resistance170 mΩ
Self Resonant Frequency8 MHz
MountSMT 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance22 pF
Capacitance±5% 
Rated Voltage50 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Q-Factor840 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance4.7 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±20% 
Rated Voltage25 V (DC)
Size0402 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Insulation Resistance5 GΩ
Ceramic TypeX5R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.1 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WR-PHD Pin Header - Single, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
Length81.28 mm
PackagingBag 
MountTHT 
TypeStraight 
GenderPin Header 
Pins32 
Rated Current3 A
Working Voltage250 V (AC)
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
Length15.24 mm
PackagingBag 
MountTHT 
TypeStraight 
GenderPin Header 
Pins12 
Rated Current3 A
Working Voltage250 V (AC)
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
Length45.72 mm
PackagingBag 
MountTHT 
TypeStraight 
GenderPin Header 
Pins36 
Rated Current3 A
Working Voltage250 V (AC)
WR-PHD Pin Header - Single, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
Length2.54 mm
PackagingBag 
MountTHT 
TypeStraight 
GenderPin Header 
Pins
Rated Current3 A
Working Voltage250 V (AC)
WR-PHD Pin Header - Single, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
Length5.08 mm
PackagingBag 
MountTHT 
TypeStraight 
GenderPin Header 
Pins
Rated Current3 A
Working Voltage250 V (AC)
WR-PHD Pin Header - Single, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
Length7.62 mm
PackagingBag 
MountTHT 
TypeStraight 
GenderPin Header 
Pins
Rated Current3 A
Working Voltage250 V (AC)
WR-PHD Pin Header - Single, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
Length10.16 mm
PackagingBag 
MountTHT 
TypeStraight 
GenderPin Header 
Pins
Rated Current3 A
Working Voltage250 V (AC)
WR-PHD Pin Header - Dual, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
Length5.08 mm
PackagingBag 
MountTHT 
TypeStraight 
GenderPin Header 
Pins
Rated Current3 A
Working Voltage250 V (AC)
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
Length15.24 mm
PackagingBag 
MountTHT 
TypeStraight 
GenderPin Header 
Pins
Rated Current3 A
Working Voltage250 V (AC)
WR-PHD Pin Header - Dual, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
Length25.4 mm
PackagingBag 
MountTHT 
TypeStraight 
GenderPin Header 
Pins20 
Rated Current3 A
Working Voltage250 V (AC)
WR-USB Mini/Micro Connectors, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +85 °C
Insulation Resistance1000 MΩ
PackagingTape and Reel 
MountSMT 
Interface TypeType AB 
TypeHorizontal 
GenderReceptacle 
Pins
PCB Thickness1.2 mm
Rated Current1.8 A
Working Voltage30 V (AC)