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reference design2EDF7275F | Demoboard EVAL_10KW_3LANPC_SIC

Infineon Technologies 2EDF7275F | Demoboard EVAL_10KW_3LANPC_SIC

Virtual evaluation board for ANPC 3-level topology using 400 V CoolSiC™ MOSFET

Overview

TopologyOther Topology
Output 1625 V / 16 A
IC revision1.0

Description

This virtual design for 3L-ANPC topologies features a 3-phase, 3-level inverter board and isolated power supply board. The optimized layout minimizes commutation loop inductance, reducing switching losses and voltage overshoot. It is ideal for engineers and researchers to experiment, validate, and optimize 3L-ANPC systems for industrial motor drives and photovoltaic string inverters.

Features

Test platform for 3L-ANPC topology3-phase, 3-level ANPC power boardIsolated power supply: AUX power supplyXMC4400 Drive card interfaceHigh precision coreless current sensorCoolSiC™ 400 V - heat-sink free design

Typical applications

  • Industrial motor drives and controls; Photovoltaic; 1-phase string inverter solutions; Uninterruptible power supplies (UPS)

More information

Products

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Pins
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PCB/Cable/Panel
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691311500102
SPECWR-TBL Series 311 - 5.08 mm Close Vertical PCB Header, 2, PCB Header
Availability
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Downloads7 files

Status Activei| Production is active. Expected lifetime: >10 years.
Product seriesWR-TBL Series 311 - 5.08 mm Close Vertical PCB Header
Pins2 
ApplicationPCB Header 
PCB/Cable/PanelPCB 
ModularityNo 
TypeClosed Vertical Plug entry 
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Rated Current15 A
PackagingBox 
MountTHT 
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7461383
SPECWP-SHFU REDCUBE PRESS-FIT with external thread, full plain, 16, –
Availability
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Downloads7 files

Status Activei| Production is active. Expected lifetime: >10 years.
Product seriesWP-SHFU REDCUBE PRESS-FIT with external thread, full plain
Pins16 
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Outer ThreadM5 
Width9 mm
Height12.5 mm
Thread Length8 mm
PCB Thickness min.1.6 mm
PCB Thickness max.3.2 mm
SurfaceTin 
Rated Current180 A
PackagingTray 
MountPress-Fit 
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