WP-SHFU REDCUBE PRESS-FIT with external thread, full plain
Applications
- High current Wire-To-Board Connections up to 500 A
- Mounting of copper bars on PCBs
- Installation of laminated fuses
- Suitable for rough environmental conditions
| General Information | |
|---|---|
| Operating Temperature | -55 °C up to +150 °C |
| Material | Brass |
| Surface | Tin |
| Execution | Press-Fit |
| Packaging Properties | |
|---|---|
| Packaging | Bulk; Tray |
Application Notes
Products
Order Code | Datasheet | Downloads | Status | To | W(mm) | H(mm) | Tl(mm) | PCB Thickness min.(mm) | PCB Thickness max.(mm) | Surface | IR(A) | Packaging | Mount | Design Kit | SamplesAvailability & Sample | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 7461100 | SPECM10, 16 mm, 24 mm PCN pendingDue to a pending PCN there will be a new datasheet revision issued for this order code soon. Please find the actual as well based on valid PCN date the new revision datasheet below. If you have further questions please get in contact with our sales staff. | Availability – | Status Activei| Production is active. Expected lifetime: >10 years. | Outer ThreadM10 | Width16 mm | Height24 mm | Thread Length16 mm | PCB Thickness min.1.6 mm | PCB Thickness max.3.2 mm | SurfaceTin | Rated Current350 A | PackagingBulk | MountPress-Fit | Design Kit – | –Check availability | |
 | 7461094 | SPECM3, 7 mm, 7.5 mm | Availability – | Status Activei| Production is active. Expected lifetime: >10 years. | Outer ThreadM3 | Width7 mm | Height7.5 mm | Thread Length5 mm | PCB Thickness min.1.6 mm | PCB Thickness max.3.2 mm | SurfaceTin | Rated Current130 A | PackagingBulk | MountPress-Fit | Design Kit – | –Check availability | |
 | 7461096 | SPECM4, 7 mm, 9 mm | Availability – | Status Activei| Production is active. Expected lifetime: >10 years. | Outer ThreadM4 | Width7 mm | Height9 mm | Thread Length6 mm | PCB Thickness min.1.6 mm | PCB Thickness max.3.2 mm | SurfaceTin | Rated Current130 A | PackagingBulk | MountPress-Fit | Design Kit | –Check availability | |
 | 7461001 | SPECM5, 7 mm, 12 mm | Availability – | Status Activei| Production is active. Expected lifetime: >10 years. | Outer ThreadM5 | Width7 mm | Height12 mm | Thread Length8 mm | PCB Thickness min.1.6 mm | PCB Thickness max.3.2 mm | SurfaceTin | Rated Current130 A | PackagingBulk | MountPress-Fit | Design Kit – | –Check availability | |
 | 7461383 | SPECM5, 9 mm, 12.5 mm | Availability – | Status Activei| Production is active. Expected lifetime: >10 years. | Outer ThreadM5 | Width9 mm | Height12.5 mm | Thread Length8 mm | PCB Thickness min.1.6 mm | PCB Thickness max.3.2 mm | SurfaceTin | Rated Current180 A | PackagingTray | MountPress-Fit | Design Kit – | –Check availability | |
 | 7461098 | SPECM6, 13 mm, 15.5 mm | Availability – | Status Activei| Production is active. Expected lifetime: >10 years. | Outer ThreadM6 | Width13 mm | Height15.5 mm | Thread Length10 mm | PCB Thickness min.1.6 mm | PCB Thickness max.3.2 mm | SurfaceTin | Rated Current250 A | PackagingTray | MountPress-Fit | Design Kit | –Check availability | |
 | 7460719 | SPECM8, 13 mm, 20.5 mm | Availability – | Status Activei| Production is active. Expected lifetime: >10 years. | Outer ThreadM8 | Width13 mm | Height20.5 mm | Thread Length13 mm | PCB Thickness min.1.6 mm | PCB Thickness max.3.2 mm | SurfaceTin | Rated Current250 A | PackagingTray | MountPress-Fit | Design Kit – | –Check availability |
| Expected Availability | Opening inventory | Quantity |
|---|---|---|
| Current Availability | – | – |
REDCUBE Terminals - 4power!
REDCUBE Terminals - 4power!
REDCUBE terminals are the most reliable high-power contacts on the PCB level. Low contact resistance guarantees minimum self-heating. Four different designs cover all leading processing technologies and offer a wide range of applications.
Characteristic:
- Flexibility in processing and connection technologies
- Highest current ratings up to 500 A
- Board-to-Board and Wire-to-Board solutions
- Extremely low self-heating
- Robust mechanical connection
REDCUBE PRESS-FIT
Applications, Performance & Press-Fit Process
Applications
The current rating of REDCUBE PRESS-FIT is impressive. With the same ampacity, REDCUBE PRESS-FIT has the lowest heat development compared to other parts that supply power for PCBs.
- High current Wire-to-Board & Board-to-Board
- Mounting of copper bars
- Angled assembling of cable, PCB and housing
- Mounting of IGBT modules
Remarkable Performance
With the lowest Failure-In-Time value, REDCUBE PRESS-FIT is the most reliable technology on PCB. The FIT value is up to 30 times better than that of a SMD solder joint. REDCUBE PRESS-FIT is suitable for two-side mounting and allows very compact design of modules.
- Simple & quick processing
- No cold solder joints
- High process safety
- Low self heating
- Two-sided mounting of PCBs
PRESS-FIT Process
Pressing the pins into the PCB, a high friction between pin and plated through-hole generates a homogeneous cold-welding between materials. No other technology transfers power up to 500 A at this low heat development.
- Homogeneous material transition between pin and through-hole plating
- Contact resistance less than 200 μΩ
- Gastight electrical and mechanical connection
- Extremely strong mechanical connection
Assortments
Articles from this product series can be found in the following assortments:
Videos
#askLorandt explains: REDCUBE PRESS-FIT Process
Videos
Würth Elektronik Webinar: REDCUBE - Everything about high currents on the printed circuit board
Videos
Würth Elektronik Webinar: REDCUBE HighPower Terminals for ampacity of 50-500 A