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Texas Instruments TMS320F2800157 | Demoboard LAUNCHXL-F2800157
C2000™ real-time MCU F2800157 LaunchPad™ development kit
Details
| Topologie | FPGA |
| IC-Revision | A |
Beschreibung
LAUNCHXL-F2800157 is a low-cost development board for TI C2000™ real-time microcontrollers series of F280015x devices. Ideal for initial evaluation and prototyping, it provides a standardized and easy to use platform to develop your next application. This extended version LaunchPad™ developement kit offers extra pins for development and supports the connection of two BoosterPack™ plug-in modules. As part of the vast TI MCU LaunchPad ecosystem, it is also cross-compatible with a broad range of plug-in modules.
Eigenschaften
TMS320F2800157: 120 MHz C28x CPU with FPU and TMU, 256 KB Flash, 2x 12-bit ADC, 14x PWM channels, CAN (DCAN), 2x encoder modules (eQEP), UART, and moreOn-board XDS110 debug probe for real-time debug and flash programming80-pin LaunchPad leveraging the BoosterPack ecosystemPower domain isolation for real-time debug and flash programmingOn-board CAN transceiver and connectorTwo encoder interface (eQEP) connectorsHardware Files available below in "Design files" section
Typische Anwendungen
- UPS
- Mobile robot motor control
- Telecom & server powe
- Motor drives
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | Anwendung | f | Tol. f | Stabilität (ppm) | Cload (pF) | Betriebstemperatur | C | Tol. C | VR (V (DC)) | Bauform | Q (%) | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Pins (pcs) | Reihen | H (mm) | Gender | IR (mA) | Verpackung | Farbe | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 150080SS75000 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | 630 | Superrot | 645 | 60 | 1.9 | AlInGaP | 140 | – | – | – | – | – | -40 °C up to +85 °C | – | – | – | 0805 | – | – | – | – | 2 | 1.25 | – | – | – | – | – | – | – | – | – | 0.7 | – | – | Tape and Reel | – | ||
 | 742792063 | SPEC | 10 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-CBF SMT-Ferrit | – | – | – | – | – | – | – | – | – | – | – | – | -55 °C up to +125 °C | – | – | – | 0805 | – | – | – | – | 2 | 1.2 | 0.5 | 60 | 90 | 500 MHz | 3000 | 0.025 | High Current | – | – | 0.9 | – | 2000 | – | – | ||
| 742792022 | SPEC | 10 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-CBF SMT-Ferrit | – | – | – | – | – | – | – | – | – | – | – | – | -55 °C up to +125 °C | – | – | – | 0805 | – | – | – | – | 2 | 1.2 | 0.5 | 220 | 330 | 300 MHz | 2000 | 0.05 | High Current | – | – | 0.9 | – | 1500 | – | – | ||
 | 885012005063 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | -55 °C up to +125 °C | 220 pF | ±5% | 50 | 0402 | 1000 | – | 10 GΩ | NP0 Klasse I | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | 0.5 | – | – | 7" Tape & Reel | – | ||
| 885012205018 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | -55 °C up to +125 °C | 100 nF | ±10% | 10 | 0402 | – | 5 | 5 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | 0.5 | – | – | 7" Tape & Reel | – | ||
| 885012205050 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | -55 °C up to +125 °C | 10 nF | ±10% | 25 | 0402 | – | 3.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | 0.5 | – | – | 7" Tape & Reel | – | ||
| 885012205061 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | -55 °C up to +125 °C | 1 nF | ±10% | 50 | 0402 | – | 2.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | 0.5 | – | – | 7" Tape & Reel | – | ||
| 885012205064 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | -55 °C up to +125 °C | 3.3 nF | ±10% | 50 | 0402 | – | 2.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | 0.5 | – | – | 7" Tape & Reel | – | ||
| 885012105012 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | -55 °C up to +85 °C | 1 µF | ±20% | 10 | 0402 | – | 15 | 0.05 GΩ | X5R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | 0.5 | – | – | 7" Tape & Reel | – | ||
 | 61301221121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Dual Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | – | – | – | – | 1000 MΩ | – | 15.24 | – | – | – | – | – | – | – | Gerade | 12 | Dual | – | Pin Header | 3000 | Beutel | – | |
 | 60900213421 | SPEC | – | 3 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm Multi-Jumper Jumper with Test Point | – | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +125 °C | – | – | – | – | – | – | 1000 MΩ | – | 2.44 | – | – | – | – | – | – | – | – | 1 | – | – | Jumper | 3000 | Beutel | Schwarz | |
 | 61300211121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | – | – | – | – | 1000 MΩ | – | 5.08 | – | – | – | – | – | – | – | Gerade | 2 | Single | – | Pin Header | 3000 | Beutel | – | |
 | 61300311121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | – | – | – | – | 1000 MΩ | – | 7.62 | – | – | – | – | – | – | – | Gerade | 3 | Single | – | Pin Header | 3000 | Beutel | – | |
 | 61300411121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | – | – | – | – | 1000 MΩ | – | 10.16 | – | – | – | – | – | – | – | Gerade | 4 | Single | – | Pin Header | 3000 | Beutel | – | |
 | 61300421121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Dual Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | – | – | – | – | 1000 MΩ | – | 5.08 | – | – | – | – | – | – | – | Gerade | 4 | Dual | – | Pin Header | 3000 | Beutel | – | |
 | 61300511121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | – | – | – | – | 1000 MΩ | – | 12.7 | – | – | – | – | – | – | – | Gerade | 5 | Single | – | Pin Header | 3000 | Beutel | – | |
 | 830064296 | SPEC | 5 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-XTAL Schwingquarz | – | – | – | – | – | – | – | Processor, CAN, Bluetooth | 16 MHz | ±20ppm | 20 | 8 | -10 °C up to +70 °C | – | – | – | CFPX-180 | – | – | – | – | 3.2 | 2.5 | – | – | – | – | – | – | – | – | – | 0.8 | – | – | – | – | ||
| 830108207209 | SPEC | 5 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-XTAL Schwingquarz | – | – | – | – | – | – | – | Processor, CAN, USB, Ethernet, Wi-Fi | 20 MHz | ±10ppm | 20 | 8 | -40 °C up to +85 °C | – | – | – | CFPX-180 | – | – | – | – | 3.2 | 2.5 | – | – | – | – | – | – | – | – | – | 0.8 | – | – | – | – |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | Anwendung | f | Tol. f | Stabilität (ppm) | Cload (pF) | Betriebstemperatur | C | Tol. C | VR (V (DC)) | Bauform | Q (%) | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Pins (pcs) | Reihen | H (mm) | Gender | IR (mA) | Verpackung | Farbe | Muster |
|---|
