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Texas Instruments LMG3522 | Demoboard PMP23069
3.6-kW single-phase totem-pole bridgeless PFC reference design with a > 180-W/in³ power density
Details
| Topologie | Leistungsfaktor-Korrektur |
| Eingangsspannung | 85-265 V |
| Ausgang 1 | 5 V / 0.4 A |
| Ausgang 2 | 380 V / 4.74 A |
| Ausgang 3 | 380 V / 9.47 A |
Beschreibung
This reference design is a GaN-based 3.6-kW single-phase continuous conduction mode (CCM) totem-pole power factor correction (PFC) converter targeting maximum power density. The power stage is followed by a baby boost converter, which helps to greatly reduce the size of the bulk capacitor. The LMG3522 top-side cooled GaN with integrated driver and protection enables higher efficiency and reduces power supply size and complexity. The F28004x or F28002x C2000 controller is used for all the advanced controls, including fast relay control, baby boost operation during AC drop-out event, reverse current flow protection and communication between PFC and house keeping controller. The PFC operates at a switching frequency of 65 kHz and achieves peak efficiency of 98.7%.
Eigenschaften
180W/in³ power density in an x-y dimension of less than 68-mm x 121-mm space and maximum height of 32 mm
- Peak efficiency of 98.7%
- Semiconductor relay increases power density and reliability
- GaN optimized with driver integratio
Typische Anwendungen
- Digital controlled industrial AC/DC, Network PSU with 48V output, Server PSU with 12V output & digital control (>1kW), Single digital controller with primary side control
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Produktserie | Anwendung | C | VR (V (AC)) | Sicherheitsklasse | dV/dt (V/µs) | DF @ 1 kHz (%) | RISO | Betriebstemperatur | Raster (mm) | L (mm) | W (mm) | H (mm) | Verpackung | Tol. C | Bauform | Betriebstemperatur | DF (%) | Keramiktyp | Fl (mm) | L (µH) | IRP,40K (A) | ISAT,30% (A) | RDC typ. (mΩ) | fres (MHz) | V (V) | Montageart | Vin | VOut1 (V (DC)) | IOut1 (A) | Isolierungstyp | fswitch (kHz) | ∫Udt (Vµs) | NPRI : NSEC | VT (V (AC)) | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 890334026034CS | SPEC | 8 Dateien | WCAP-FTXX Folienkondensatoren | Across the mains | 2.2 µF | 310 | X2 | 170 | 0.1 | 4.55 GΩ | -40 °C bis zu +105 °C | 22.5 | 26 | 15 | 25 | Karton | ±10% | Pitch 22.5 mm | -40 °C up to +105 °C | – | – | – | – | – | – | – | – | – | Boxed THT | – | – | – | – | – | – | – | – | ||
| 890334026030 | SPEC | 8 Dateien | WCAP-FTXX Folienkondensatoren | Across the mains | 1.5 µF | 310 | X2 | 140 | 0.1 | 6.67 GΩ | -40 °C bis zu +105 °C | 22.5 | 26 | 10 | 21 | Lose | ±10% | Pitch 22.5 mm | -40 °C up to +105 °C | – | – | – | – | – | – | – | – | – | Boxed THT | – | – | – | – | – | – | – | – | ||
 | 74438336022 | SPEC | 9 Dateien | WE-MAPI SMT-Speicherdrossel | – | – | – | – | – | – | – | – | – | 3 | 3 | 2 | – | – | 3020 | -40 °C up to +125 °C | – | – | – | 2.2 | 3.6 | 5.55 | 67 | 42 | 80 | SMT | – | – | – | – | – | – | – | – | ||
 | 885012206052 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 16 V(DC) | – | 1 µF | 16 | – | – | – | 0.1 GΩ | – | – | 1.6 | 0.8 | 0.8 | 7" Tape & Reel | ±10% | 0603 | -55 °C up to +125 °C | 10 | X7R Klasse II | 0.4 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
 | 760390014 | SPEC | – | 7 Dateien | WE-PPTI Push-Pull Transformers | – | – | – | – | – | – | – | -40 °C bis zu +125 °C | – | 6.73 | 10.2 | 4.19 | Tape and Reel | – | 1006 | -40 °C up to +125 °C | – | – | – | 475 | – | – | – | – | – | SMT | 5 V (DC) | 5 | 0.6 | Functional | 300 - 620 | 11 | 1:1.3 | 2500 |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 890334026034CS | SPEC | |
| 890334026030 | SPEC | |
| 74438336022 | SPEC | |
| 885012206052 | SPEC | |
| 760390014 | SPEC | – |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Produktserie | Anwendung | C | VR (V (AC)) | Sicherheitsklasse | dV/dt (V/µs) | DF @ 1 kHz (%) | RISO | Betriebstemperatur | Raster (mm) | L (mm) | W (mm) | H (mm) | Verpackung | Tol. C | Bauform | Betriebstemperatur | DF (%) | Keramiktyp | Fl (mm) | L (µH) | IRP,40K (A) | ISAT,30% (A) | RDC typ. (mΩ) | fres (MHz) | V (V) | Montageart | Vin | VOut1 (V (DC)) | IOut1 (A) | Isolierungstyp | fswitch (kHz) | ∫Udt (Vµs) | NPRI : NSEC | VT (V (AC)) | Muster |
|---|