IC-Hersteller STMicroelectronics
IC-Hersteller (103)
- Alle Hersteller
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (28)
- Ablic (23)
- Acco Semiconductor (1)
- Advanced Power (4)
- Allegro Microsystems (100)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (204)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (46)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (259)
- Divimath (8)
- Elmos AG (1)
- EPC (140)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (8)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- IKON (1)
- Indie Semiconductor (8)
- Innovision Semiconductor Inc (2)
- Intel (68)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (3)
- Kinetic Technology (8)
- Lattice semiconductor Corporation (38)
- Littelfuse (1)
- Lumissil Microsystems (8)
- M3 Technology (M3Tek) (7)
- Macnica (22)
- Marvell Semiconductor (1)
- MaxLinear (181)
- Menlo Micro (1)
- MikroE (25)
- MindCet (2)
- Monolithic Power Systems (980)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (267)
- Nisshinbo Micro Device Inc. (10)
- Novosense Micro (1)
- NXP (336)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (117)
- Powermat (1)
- Pulsiv (19)
- Qorvo (97)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (297)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (86)
- SG-Micro (57)
- SiFive (2)
- Silanna Semiconductor (9)
- Silergy Corporation (33)
- Silicon Laboratory Inc. (108)
- Silicontent Technology (59)
- Silvertel (59)
- Skycore Semiconductors (1)
- Skyworks (33)
- Southchip (14)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (31)
- Wise Integration (3)
- Wolfspeed (23)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
Details
| Topologie | Gegentaktwandler (Vollbrücken) |
| IC-Revision | 1.0 |
Beschreibung
The device is a full bridge motor driver intended for a wide range of automotive applications. The device incorporates a dual monolithic high-side driver and two low-side switches. All switches are designed using STMicroelectronics® well known and proven proprietary VIPower® M0 technology that allows to efficiently integrate on the same die a true Power MOSFET with an intelligent signal/protection circuitry. The three dice are assembled in a PowerSSO-36 package equipped with three exposed islands for optimized dissipation performances. This package is specifically designed for the harsh automotive environment and offers improved thermal performance thanks to exposed die pads. A Multisense_EN pin is available to enable the MultiSense diagnostic. The input signals INA and INB can directly interface the microcontroller to select the motor direction and the brake condition. Two selection pins (SEL0 and SEL1) are available to address to the microcontroller the information available on the Multisense. The Multisense pin allows to monitor the motor current by delivering a current proportional to the motor current value and provides also the diagnostic feedback according to the implemeted truth table. When MultiSense_EN pin is driven low, MultiSense pin is in high impedance condition. The PWM, up to 20 KHz, allows to control the speed of the motor in all possible conditions. In all cases, a low level state on the PWM pin turns off both the LSA and LSB switches.
Eigenschaften
- AEC-Q100 qualified
- Output current: 35 A
- 3 V CMOS compatible inputs
- Undervoltage shutdown
- Overvoltage clamp
- Thermal shutdown
- Cross-conduction protection
- Current and power limitation
- Very low standby power consumption
- Protection against loss of ground and loss of VCC
- PWM operation up to 20 KHz
- Multisense monitoring functions
- Analog motor current feedback
- Chip temperature monitoring
- Battery voltage monitoring
- Multisense diagnostic functions
- Output short to ground detection
- Thermal shutdown indication
- OFF-state open-load detection
- High-side power limitation indication
- Low-side overcurrent shutdown indication
- Output short to VCC detection
- Output protected against short to ground and short to VCC
- Standby mode
- Half bridge operation
- Package: ECOPACK®
Weiterführende Informationen
Artikeldaten
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Pins | PCB/Kabel/Panel | Modularity | Typ | λDom typ.(nm) | Emittierte Farbe | λPeak typ.(nm) | λPeak V typ.(nm) | λPeak Y typ.(nm) | λDom V typ.(nm) | λDom Y typ.(nm) | IV typ.(mcd) | IV V typ.(mcd) | IV Y typ.(mcd) | VF typ.(V) | VF V typ.(V) | VF Y typ.(V) | Chiptechnologie | 2θ50% typ.(°) | C | Tol. C | VR(V (DC)) | Bauform | Betriebstemperatur | DF(%) | RISO | Keramiktyp | L(mm) | B(mm) | H(mm) | Fl(mm) | Verpackung | L(µH) | IR(A) | ISAT(A) | RDC max.(mΩ) | fres(MHz) | Montageart | Endurance(h) | IRIPPLE(mA) | Z(mΩ) | ILeak(µA) | Ø D(mm) | Version | Polarität | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | WE-PDF SMT-Speicherdrossel, 2, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWE-PDF SMT-Speicherdrossel | Pins2 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Bauform1064 | Betriebstemperatur -40 °C up to +150 °C | – | – | – | Länge10.2 mm | Breite10.2 mm | Höhe6.1 mm | – | – | Induktivität18 µH | Nennstrom5 A | Sättigungsstrom3.8 A | Gleichstromwiderstand34.4 mΩ | Eigenresonanzfrequenz18 MHz | MontageartSMT | – | – | – | – | – | VersionSMT | – | ||||
 | WR-TBL Serie 322 - 3.81 mm Horizontal PCB Header, 2, Stiftleiste | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWR-TBL Serie 322 - 3.81 mm Horizontal PCB Header | Pins2 | PCB/Kabel/PanelKabel | ModularityNein | TypStiftleiste | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Betriebstemperatur -40 °C up to +105 °C | – | – | – | Länge8.81 mm | – | – | – | VerpackungKarton | – | Nennstrom10.5 A | – | – | – | MontageartTHT | – | – | – | – | – | – | Polarität02 | |||
 | WR-WTB 2.54 mm Stiftleisten, 4, – | Simulation– | Downloads7 Dateien | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWR-WTB 2.54 mm Stiftleisten | Pins4 | PCB/Kabel/PanelPCB | – | TypVertikal | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Betriebstemperatur -40 °C up to +105 °C | – | Isolationswiderstand1000 MΩ | – | Länge10.16 mm | – | – | – | VerpackungBeutel | – | Nennstrom3 A | – | – | – | MontageartTHT | – | – | – | – | – | – | – | ||
 | WR-BHD 2.54 mm Wannenstiftleiste, 16, – | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWR-BHD 2.54 mm Wannenstiftleiste | Pins16 | PCB/Kabel/PanelPCB | – | TypGerade | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Betriebstemperatur -40 °C up to +105 °C | – | Isolationswiderstand1000 MΩ | – | Länge27.98 mm | – | – | – | VerpackungTray | – | Nennstrom3 A | – | – | – | MontageartTHT | – | – | – | – | – | VersionLow Profile | – | |||
 | WL-SMCW SMT Mono-color Chip LED Waterclear, –, – | Downloads27 Dateien Strahldaten
| Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWL-SMCW SMT Mono-color Chip LED Waterclear | – | – | – | – | dominante Wellenlänge [typ.]630 nm | Emittierte FarbeSuperrot | Spitzen-Wellenlänge [typ.]645 nm | – | – | – | – | Lichtstärke [typ.]60 mcd | – | – | Durchlassspannung [typ.]1.9 V | – | – | ChiptechnologieAlInGaP | Abstrahlwinkel Phi 0° [typ.]140 ° | – | – | – | Bauform0603 | Betriebstemperatur -40 °C up to +85 °C | – | – | – | Länge1.6 mm | Breite0.8 mm | Höhe0.7 mm | – | VerpackungTape and Reel | – | – | – | – | – | MontageartSMT | – | – | – | – | – | VersionSMT | – | |||
 | WCAP-ASLI Aluminium-Elektrolytkondensatoren, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-ASLI Aluminium-Elektrolytkondensatoren | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität220 µF | Kapazität±20% | Nennspannung50 V (DC) | Bauform10.0 x 10.5 | Betriebstemperatur -55 °C up to +105 °C | Verlustfaktor12 % | Isolationswiderstand0.454545 MΩ | – | Länge10.5 mm | Breite10.3 mm | – | – | Verpackung15" Tape & Reel | – | – | – | – | – | MontageartV-Chip SMT | Endurance 2000 | Rippelstrom650 mA | Impedanz230 mΩ | Leckstrom110 µA | Durchmesser10 mm | VersionSMT | – | ||||
 | WCAP-ASLL Aluminium-Elektrolytkondensatoren, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-ASLL Aluminium-Elektrolytkondensatoren | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität47 µF | Kapazität±20% | Nennspannung25 V (DC) | Bauform6.3 x 5.5 | Betriebstemperatur -55 °C up to +105 °C | Verlustfaktor14 % | Isolationswiderstand2.12766 MΩ | – | Länge5.5 mm | Breite6.6 mm | – | – | Verpackung15" Tape & Reel | – | – | – | – | – | MontageartV-Chip SMT | Endurance 2000 | Rippelstrom230 mA | Impedanz440 mΩ | Leckstrom11.8 µA | Durchmesser6.3 mm | VersionSMT | – | ||||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität100 pF | Kapazität±10% | Nennspannung50 V (DC) | Bauform0805 | Betriebstemperatur -55 °C up to +125 °C | Verlustfaktor2.5 % | Isolationswiderstand10 GΩ | KeramiktypX7R Klasse II | Länge2 mm | Breite1.25 mm | Höhe0.8 mm | Pad Dimension0.5 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität33 nF | Kapazität±10% | Nennspannung50 V (DC) | Bauform0805 | Betriebstemperatur -55 °C up to +125 °C | Verlustfaktor2.5 % | Isolationswiderstand10 GΩ | KeramiktypX7R Klasse II | Länge2 mm | Breite1.25 mm | Höhe0.8 mm | Pad Dimension0.5 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität100 nF | Kapazität±10% | Nennspannung50 V (DC) | Bauform0805 | Betriebstemperatur -55 °C up to +125 °C | Verlustfaktor2.5 % | Isolationswiderstand5 GΩ | KeramiktypX7R Klasse II | Länge2 mm | Breite1.25 mm | Höhe0.8 mm | Pad Dimension0.5 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität4.7 µF | Kapazität±10% | Nennspannung50 V (DC) | Bauform1210 | Betriebstemperatur -55 °C up to +125 °C | Verlustfaktor5 % | Isolationswiderstand0.02 GΩ | KeramiktypX7R Klasse II | Länge3.2 mm | Breite2.5 mm | Höhe2.5 mm | Pad Dimension0.6 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
 | WL-SBCD SMT Bi-color Chip LED Diffused, –, – | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWL-SBCD SMT Bi-color Chip LED Diffused | – | – | – | – | – | Emittierte FarbeGelb & Hellgrün | – | Spitzen-Wellenlänge (Hellgrün) [typ.]575 nm | Spitzen-Wellenlänge (Gelb) [typ.]591 nm | dominante Wellenlänge (Bright Green) [typ.]573 nm | dominante Wellenlänge (gelb) [typ.]589 nm | – | Lichtstärke (Bright Green) [typ.]60 mcd | Lichtstärke (Gelb) [typ.]130 mcd | – | Durchlassspannung (Hellgrün) [typ.]2 V | Durchlassspannung (Gelb) [typ.]2 V | ChiptechnologieAlInGaP | Abstrahlwinkel Phi 0° [typ.]130 ° | – | – | – | Bauform0606 | Betriebstemperatur -40 °C up to +85 °C | – | – | – | Länge1.6 mm | Breite1.5 mm | Höhe0.55 mm | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – |