IC-Hersteller STMicroelectronics

IC-Hersteller (96)

STMicroelectronics STWBC-MC | Demoboard STEVAL-ISB047V1

Qi 3-coil 15W wireless charger TX evaluation kit based on STWBC-MC

Details

TopologieDrahtlose Energieübertragung
Eingangsspannung5-20 V
IC-Revision1

Beschreibung

The STEVAL-ISB047V1 wireless battery charger TX evaluation kit consists of the STEVAL-ISB047V1T evaluation board and STEVAL-WBCDNGV1 USB-UART dongle. The kit id designed for charging devices such as smartphones or tablets where high power levels are required.The evaluation board supports wireless battery charging of Qi-compliant devices up to 15 W. It also supports proprietary fast charging modes up to 10 W.The STEVAL-ISB047V1 transmitter is based on the STWBC-MC and features a costeffective half bridge topology, offering external interface via UART.The STEVAL-ISB047V1 evaluation kit is a full solution, complete with boards, firmware, a GUI for debugging, schematics, layout files and bill of materials.Tools for STEVAL-ISB047V1 are available on www.st.com, and allow users to access runtime information such as power delivered, regulation error and protocol status. Parameters can also be adjusted with these tools.

Eigenschaften

  • STWBC-MC digital controller
  • MP-A15 3-coil array
  • 15 W potential power
  • Flexible input voltage: 5 to 20 V from USB-C or DC jack
  • 5 W mode when connected to 5 V USB input or DC jack
  • Fixed frequency operation
  • WPC Qi1.2.4 standard certified
  • Robust demodulation algorithm, with triple path (V, I, f)
  • Foreign object detection (FOD)
  • Active presence detection
  • UART protocol to control and monitor the system
  • Complete reference design (evaluation board, schematics, PCB layout, firmware and tools)
  • 2-layer PCB
  • Low standby power consumption
  • Flash memory based
  • CE certified
  • RoHS compliant
  • WEEE compliant

Typische Anwendungen

  • Cell phones and smartphones / Tablets and phablets / Charging accessories

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads ProduktserieλDom typ.
(nm)
FarbeλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie50% typ.
(°)
CTol. CVR
(V (DC))
BetriebstemperaturDF
(%)
RISOKeramiktypL
(mm)
W
(mm)
Fl
(mm)
L
(µH)
ISAT
(A)
RDC
(mΩ)
AnwendungInterface typLeiterplattendicke
(mm)
MontageartIR 1
(mA)
Arbeitsspannung
(V (AC))
Z @ 100 MHz
(Ω)
Zmax
(Ω)
Testbedingung ZmaxIR 2
(mA)
RDC max.
(Ω)
TypL1
(µH)
L2
(µH)
IR 1
(mA)
ISAT 1
(A)
RDC1 typ
(Ω)
RDC2 typ
(Ω)
RDC1 max
(Ω)
RDC2 max
(Ω)
fres
(MHz)
ComplianceBauformL1
(µH)
L2
(µH)
L3
(µH)
IR DC1
(A)
IR DC2
(A)
IR DC3
(A)
RDC1 max.
(Ω)
RDC2 max.
(mΩ)
RDC3 max.
(mΩ)
fres 1
(MHz)
fres 2
(MHz)
fres 3
(MHz)
PinsReihenH
(mm)
G
(mm)
GenderIR
(mA)
Verpackung Muster
155124VS73200SPEC
6 Dateien WL-SMSW SMT Mono-color Side View Waterclear 573 Hellgrün 575 50 2 AlInGaP 120 -40 °C up to +85 °C 3.2 1.5 SMT 1204 1 Tape and Reel
155124RS73200SPEC
6 Dateien WL-SMSW SMT Mono-color Side View Waterclear 624 Rot 632 130 2 AlInGaP 120 -40 °C up to +85 °C 3.2 1.5 SMT 1204 1 Tape and Reel
74279262SPEC
9 Dateien WE-CBF SMT-Ferrit -55 °C up to +125 °C 1.6 0.8 0.3 SMT 500 120 200 510 MHz 1350 0.3 Breitband 500 0603 0.3 0.8 500
74404054022SPEC
8 Dateien WE-LQS SMT-Speicherdrossel -40 °C up to +125 °C 5 5 2.2 5.3 19 5040 4 3800
744871004SPEC
8 Dateien WE-DD SMT-Doppeldrossel -40 °C up to +125 °C 12.5 12.5 4.7 8 3000 0.028 4.7 4.7 3000 8 0.023 0.023 0.028 0.028 20 1260 20 6.5 3000
885012108021SPEC
8 Dateien WCAP-CSGP MLCCs 25 V(DC)10 µF ±20% 25 -55 °C up to +85 °C 100.01 GΩ X5R Klasse II 3.2 1.6 0.6 1206 1.6 7" Tape & Reel
885012109014SPEC
8 Dateien WCAP-CSGP MLCCs 25 V(DC)22 µF ±20% 25 -55 °C up to +85 °C 50.005 GΩ X5R Klasse II 3.2 2.5 0.6 1210 2.5 7" Tape & Reel
61302011121SPEC
6 Dateien WR-PHD 2.54 mm THT Pin Header -40 °C up to +105 °C1000 MΩ 50.8 THT 250 Gerade 20 Single Pin Header 3000 Beutel
629105150521SPEC
6 Dateien WR-COM Micro USB 2.0 SMT Type B Horizontal 5 Contacts High Current -40 °C up to +85 °C1000 MΩ Micro USB 2.0 Type B SMT 3000 30 Horizontal 5 Receptacle 3000 Tape and Reel
632723300011SPEC
6 Dateien WR-COM USB 3.1 Type C Receptacle Horizontal THR / SMT -40 °C up to +105 °C1000 MΩ USB 3.1 Type C 1.6 THR 20 Horizontal 24 1.9 Receptacle 5000 Tape and Reel
61300311121SPEC
6 Dateien WR-PHD 2.54 mm THT Pin Header -40 °C up to +105 °C1000 MΩ 7.62 THT 250 Gerade 3 Single Pin Header 3000 Beutel
61300411121SPEC
6 Dateien WR-PHD 2.54 mm THT Pin Header -40 °C up to +105 °C1000 MΩ 10.16 THT 250 Gerade 4 Single Pin Header 3000 Beutel
61400416021SPEC
6 Dateien WR-COM USB 2.0 Type A Horizontal -40 °C up to +105 °C1000 MΩ USB 2.0 Type A THT 1500 30 Horizontal 4 Receptacle 1500 Tray
760308103147SPEC
7 Dateien WE-WPCC Wireless Power Array -20 °C up to +105 °C 100 55 THT 9000 18 MP-A8 3-coil array 100 x 55 x 5.2 mm 8.5 7.5 8.5 9 10 9 0.056 56 56 11 11 11 5.2
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads ProduktserieλDom typ.
(nm)
FarbeλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie50% typ.
(°)
CTol. CVR
(V (DC))
BetriebstemperaturDF
(%)
RISOKeramiktypL
(mm)
W
(mm)
Fl
(mm)
L
(µH)
ISAT
(A)
RDC
(mΩ)
AnwendungInterface typLeiterplattendicke
(mm)
MontageartIR 1
(mA)
Arbeitsspannung
(V (AC))
Z @ 100 MHz
(Ω)
Zmax
(Ω)
Testbedingung ZmaxIR 2
(mA)
RDC max.
(Ω)
TypL1
(µH)
L2
(µH)
IR 1
(mA)
ISAT 1
(A)
RDC1 typ
(Ω)
RDC2 typ
(Ω)
RDC1 max
(Ω)
RDC2 max
(Ω)
fres
(MHz)
ComplianceBauformL1
(µH)
L2
(µH)
L3
(µH)
IR DC1
(A)
IR DC2
(A)
IR DC3
(A)
RDC1 max.
(Ω)
RDC2 max.
(mΩ)
RDC3 max.
(mΩ)
fres 1
(MHz)
fres 2
(MHz)
fres 3
(MHz)
PinsReihenH
(mm)
G
(mm)
GenderIR
(mA)
Verpackung Muster