IC-Hersteller Intel

IC-Hersteller (96)

Intel PEF98030

Lantiq™ FALC™ ON FTTx System-on-Chip Family

Details

TopologieSonstige Topologie

Beschreibung

The Lantiq™ FALC™ ON FTTx family of GPON ONU ICs is a scalable, highly integrated, cost- optimized and low-power system-on-chip solution that can be used in all FTTx deployment scenarios. The ICs provide an intelligent and cost-effective solution for managing the optical interface. In fact, the overall optical system performance exceeds the levels defi ned by the ITU-T G.984.2 standard.The optical side of a FALC™ ON FTTx device directly connects to a Bi-Directional Optical Sub- Assembly (BiDi OSA/BOSA) component, a photonic IC, or an optical transceiver module. The client side provides up to four GE interfaces for data traffi c. Integrated 10/100/1000BASE-T Ethernet PHY modules on the SoC enable direct interfacing with standard magnetics for two 1000BASE-T or four 10/100BASE-T links. On-chip voice processing, used with external SLIC devices, allows up to four FXS ports to be enabled. The comprehensive SoC design includes a burst-mode laser driver, post amplifi er and clock and data recovery, as well as a GPON ONU MAC and an on-chip CPU.

Eigenschaften

  • System-on-Chip (SoC) for GPON Optical Network Termination (ONU)
  • ITU-T G.984-compliant GPON TC sublayer
  • Flexible optical interfaces for Bi-Directional Optical Sub-Assembly (BiDiOSA/BOSA) components or optical transceivermodules
  • Integrated burst-mode laser driver and APD/PIN receiver
  • Flexible L2-L4 packet processing engine with extensive traffi c management functionality, compliant with the BroadbandForum TR-156, G.984.4/G.988 and Metro Ethernet Forum Implementation Agreement #10 specifi cations
  • Real GPON wire-speed packet processing with throughput independent of packet size and CPU application processing
  • Four triple-speed Ethernet ports
  • Two integrated 10/100/1000BASE-T Ethernet PHY modules supporting Energy-Effi cient Ethernet (EEE)
  • SGMII interface operating at 1 Gbit/s or 2.5 Gbit/s
  • Dual RGMII/RMII or single GMII/MII/TMII interface
  • Up to four integrated voice codecs with SLIC™ interface

Typische Anwendungen

  • Cellular Backhaul Unit (CBU)
  • Small Business Unit (SBU)
  • Multi-Dwelling Unit (MDU
  • Single Family Unit (SFU)
  • Home Gateway Unit (HGU)

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads ProduktserieL
(µH)
IR
(A)
ISAT
(A)
fres
(MHz)
MontageartIRP,40K
(A)
ISAT1
(A)
ISAT,30%
(A)
RDC max.
(mΩ)
Q
(%)
Muster
74437349010SPEC
8 Dateien WE-LHMI SMT Speicherdrossel 1 51 SMT 13.4 13 25.8 6.5
744062100SPEC
8 Dateien WE-TPC SMT-Speicherdrossel 10 1.6 1.4 35 SMT 70
744032120SPEC
8 Dateien WE-LQ SMT-Induktivität 12 0.29 0.78 18 SMT 700 35
744043120SPEC
8 Dateien WE-TPC SMT-Speicherdrossel 12 1.12 0.95 30 SMT 125
744053220SPEC
8 Dateien WE-TPC SMT-Speicherdrossel 22 1.15 0.9 20 SMT 120
750510652SPEC
470 SMT
750311861SPEC
4 Dateien Filter 2500 0.8
Artikel Nr. Daten­blatt Simu­lation
74437349010SPEC
744062100SPEC
744032120SPEC
744043120SPEC
744053220SPEC
750510652SPEC
750311861SPEC
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads ProduktserieL
(µH)
IR
(A)
ISAT
(A)
fres
(MHz)
MontageartIRP,40K
(A)
ISAT1
(A)
ISAT,30%
(A)
RDC max.
(mΩ)
Q
(%)
Muster