IC-Hersteller (103)
- Alle Hersteller
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (27)
- Ablic (23)
- Acco Semiconductor (1)
- Advanced Power (4)
- Allegro Microsystems (96)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (184)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (47)
- Cambridge GaN Devices (22)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (239)
- Divimath (8)
- Elmos AG (1)
- EPC (128)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (8)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- Ikanos (3)
- IKON (1)
- Indie Semiconductor (8)
- Innovision Semiconductor Inc (2)
- Intel (80)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (3)
- Kinetic Technology (10)
- Lattice semiconductor Corporation (20)
- Littelfuse (1)
- Lumissil Microsystems (8)
- M3 Technology (M3Tek) (7)
- Macnica (22)
- Marvell Semiconductor (1)
- MaxLinear (178)
- Menlo Micro (1)
- MikroE (19)
- MindCet (2)
- Monolithic Power Systems (946)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (34)
- Nisshinbo Micro Device Inc. (10)
- Novosense Micro (1)
- NXP (321)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (114)
- Powermat (1)
- Pulsiv (19)
- Qorvo (95)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (297)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (90)
- SG-Micro (33)
- Silanna Semiconductor (9)
- Silergy Corporation (30)
- Silicon Laboratory Inc. (105)
- Silicontent Technology (59)
- Silvertel (60)
- Skycore Semiconductors (1)
- Skyworks (33)
- Southchip (8)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (30)
- Wise Integration (1)
- Wolfspeed (17)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
Details
| Topologie | LAN / POE |
| IC-Revision | B |
Beschreibung
10BASE-T1L is an Ethernet physical layer standard (IEEE 802.3cg-2019) that is dramatically changing the process and factory automation industry by providing seamless Ethernet connectivity to f ield-level devices including machines, controls, indicators, sensors, and actuators. 10BASE-T1L improves on existing standards such as 4 mA to 20 mA, HART, and FieldBus. Similar to conventional process automation networks, 10BASE-T1L allows both data and DC power to be transmitted over a single twisted pair via single-pair power over Ethernet (SPoE) or Ethernet advanced physical layer (APL).Compared to traditional methods, 10BASE-T1L offers higher power delivery, higher bandwidth, longer transmission distances, lowercost cabling in new installations, and reuse of 4 mA to 20 mA and RS485 wiring when retrofitting legacy installations. Ethernet supports PROFINET®, EtherCAT/IP, HART/IP, OPC UA™, Modbus®/TCP, and IoT protocols such as message queuing telemetry transport (MQTT). Ethernet also enables simple, centrally controlled software updates right down to the end nodes, which enables faster network commissioning and maintenance.The circuit shown in Figure 1 is a 10BASE-T1L MAC/PHY interface with SPoE for development of field devices and applications on a Raspberry Pi platform board. The SPoE powered device (PD) and isolated flyback regulator provide 5 V power to the platform board and attached application circuitry. SPoE Class 12 (8.4 W, 24 V nominal) and Class 13 (7.7 W, 55 V nominal) are supported.The MAC/PHY interfaces to the platform board via serial peripheral interface (SPI), allowing it to be used with microcontrollers and processors that lack an integrated media access control (MAC) layer. The circuit includes a digital temperature sensor, LEDs, and push button, which implement a basic field device example application. The example field device’s drivers are in the Linux industrial input/output (IIO) subsystem, providing a host of debug and development utilities, and cross-platform application programming interface (API) with Python, C, C#, and MATLAB® support.
Typische Anwendungen
- Ethernet MAC-PHY w/ sPOE RPI Hat
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Anwendung | PCB/Kabel/Panel | Modularity | Wire Section | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Qmin. | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Betriebstemperatur | Q (%) | Vin | VOut1 (V) | IOut1 (A) | L (µH) | n | IR 1 (A) | ISAT (A) | LS (µH) | VT (V (AC)) | IC-Referenz | Technische Artikelnummer | VDC (V) | VBR (V) | IPeak (A) | PDiss (W) | VClamp max. (V) | Pins (pcs) | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 691210910003 | SPEC | – | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-TBL Series 2109 - 2.54 mm Horiz. Entry | Rising Cage Clamp | PCB | Nein | 30 to 18 (AWG) 0.2 to 0.75 (mm²) | – | – | – | – | -40 °C bis zu +105 °C | – | – | – | – | 8.02 | – | – | -40 °C up to +105 °C | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 3 | – | – | – | Horizontal | 6 | Karton | |
 | 885012005056 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | 15 pF | ±5% | 50 | 0402 | – | – | – | 10 GΩ | NP0 Klasse I | 1 | 0.5 | 0.25 | -55 °C up to +125 °C | 700 | – | – | – | – | – | – | – | – | – | – | NP00402150J050DFCT10000 | – | – | – | – | – | – | – | 0.5 | – | – | – | 7" Tape & Reel | ||
| 885012205037 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | 100 nF | ±10% | 16 | 0402 | – | – | 5 | 5 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | -55 °C up to +125 °C | – | – | – | – | – | – | – | – | – | – | – | X7R0402104K016DFCT10000 | – | – | – | – | – | – | – | 0.5 | – | – | – | 7" Tape & Reel | ||
| 885012206025 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | 680 nF | ±10% | 10 | 0603 | – | – | 10 | 0.2 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | -55 °C up to +125 °C | – | – | – | – | – | – | – | – | – | – | – | X7R0603684K010DFCT10000 | – | – | – | – | – | – | – | 0.8 | – | – | – | 7" Tape & Reel | ||
 | 824520511 | SPEC | – | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-TVSP Power TVS Diode | – | – | – | – | – | – | – | DO-214AA | – | – | – | – | – | 4.32 | 3.62 | – | -65 °C up to +150 °C | – | – | – | – | – | – | – | – | – | – | – | SMBJ51A | 51 | 59.7 | 7.3 | 600 | 82.4 | – | – | 2.4 | – | – | – | – | |
 | 62000311121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.00 mm THT Pin Header | – | – | – | – | – | – | – | – | -40 °C bis zu +105 °C | – | – | 1000 MΩ | – | 6 | – | – | -40 °C up to +105 °C | – | – | – | – | – | – | 2 | – | – | – | – | – | – | – | – | – | – | 3 | Single | – | Pin Header | Gerade | 2 | Beutel | |
 | 750315125 | SPEC | 10 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-FLYLT Flyback Transformers for Linear Technology | – | – | – | – | – | – | – | EP13 | -40 °C bis zu +125 °C; including temp rise | – | – | – | – | 13.46 | 17.75 | – | -40 °C up to +125 °C | – | 18 - 72 V (DC) | 5 | 4.5 | 40 | 6:1 | – | 3.8 | 2 | 1500 | LT8304 | – | – | – | – | – | – | – | – | 12.7 | – | – | – | Tape and Reel | ||
| 885012206118 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 100 V(DC) | – | – | – | – | 47 nF | ±10% | 100 | 0603 | -55 °C bis zu +125 °C | – | 2.5 | 2.1 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | -55 °C up to +125 °C | – | – | – | – | – | – | – | – | – | – | – | X7R0603473K100DFCT10000 | – | – | – | – | – | – | – | 0.8 | – | – | – | 7" Tape & Reel | ||
 | 885342008011 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSMH Mid and High Voltage | – | – | – | – | 100 pF | ±5% | 2000 | 1206 | -55 °C bis zu +125 °C | 1000 | – | 10 GΩ | NP0 Klasse I | 3.2 | 1.6 | 0.6 | -55 °C up to +125 °C | 1000 | – | – | – | – | – | – | – | – | – | – | NP01206101JB00DFCT10000 | – | – | – | – | – | – | – | 1.25 | – | – | – | 7" Tape & Reel | ||
| 885342211008 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSMH Mid and High Voltage | – | – | – | – | 4.7 nF | ±10% | 2000 | 1812 | -55 °C bis zu +125 °C | – | 2.5 | 10 GΩ | X7R Klasse II | 4.5 | 3.2 | 0.5 | -55 °C up to +125 °C | – | – | – | – | – | – | – | – | – | – | – | X7R1812472KB00DFCT10000 | – | – | – | – | – | – | – | 2 | – | – | – | 7" Tape & Reel | ||
| 885012206120 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 100 V(DC) | – | – | – | – | 100 nF | ±10% | 100 | 0603 | -55 °C bis zu +125 °C | – | 5 | 1 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | -55 °C up to +125 °C | – | – | – | – | – | – | – | – | – | – | – | X7R0603104K100DFCT10000 | – | – | – | – | – | – | – | 0.8 | – | – | – | 7" Tape & Reel | ||
| 885012205085 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | 100 nF | ±10% | 25 | 0402 | – | – | 10 | 5 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | -55 °C up to +125 °C | – | – | – | – | – | – | – | – | – | – | – | X7R0402104K025DFCT10000 | – | – | – | – | – | – | – | 0.5 | – | – | – | 7" Tape & Reel |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Anwendung | PCB/Kabel/Panel | Modularity | Wire Section | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Qmin. | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Betriebstemperatur | Q (%) | Vin | VOut1 (V) | IOut1 (A) | L (µH) | n | IR 1 (A) | ISAT (A) | LS (µH) | VT (V (AC)) | IC-Referenz | Technische Artikelnummer | VDC (V) | VBR (V) | IPeak (A) | PDiss (W) | VClamp max. (V) | Pins (pcs) | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster |
|---|
