IC manufacturers Texas Instruments

IC manufacturers (103)

Texas Instruments TPS65214 | Demoboard TIDA-010973

100Mbps industrial ethernet communication module reference design for multiprotocol applications

Overview

TopologyLAN / POE
IC revisionDecember 2025

Description

This reference design accelerates development of multiprotocol 100Mbps industrial Ethernet nodes. The design allows engineers to quickly prototype and deploy EtherCAT®, PROFINET®, EtherNet/IP, and Modbus® Transmission Control Protocol (TCP) on AM261x with Integrated Industrial Communication Subsystem (ICSS). The approach cuts hardware spins, simplifies clocking and power, and delivers deterministic, time-synchronized factory automation performance.

Features

Supports multiple industrial Ethernet protocols: EtherCAT®, PROFINET® Real-Time (RT) and Isochronous Real-Time (IRT), EtherNet/IP®, and Modbus® TCPICSS enabling software-selectable multiprotocol operationSynchronize and latch real-time Ethernet signals for precise timing controlFlexible Host Port Interface (HPI) for connection to an external application processor or for use with a daughter cardEffective reference design for reduced bill of materials (BOM) and compact form factorElectromagnetic Compatibility (EMC) and Electromagnetic Interference (EMI) compatible PCB layout

Typical applications

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
C
Tol. C
VR(V (DC))
Size
Operating Temperature
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
L(µH)
IR(mA)
ISAT1(A)
ISAT2(A)
fres(MHz)
Z @ 100 MHz(Ω)
Zmax(Ω)
Test Condition Zmax
IR 2(mA)
RDC max.(Ω)
Type
Samples
WCAP-CSGP MLCCs 25 V(DC), 100 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0201 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Insulation Resistance0.5 GΩ
Ceramic TypeX5R Class II 
Length0.6 mm
Width0.3 mm
Height0.3 mm
Pad Dimension0.15 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 16 V(DC), 2.2 µF, ±20%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 µF
Capacitance±20% 
Rated Voltage16 V (DC)
Size0603 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Insulation Resistance0.05 GΩ
Ceramic TypeX5R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 10 V(DC), 22 µF, ±20%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance22 µF
Capacitance±20% 
Rated Voltage10 V (DC)
Size0805 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Insulation Resistance0.005 GΩ
Ceramic TypeX5R Class II 
Length2 mm
Width1.25 mm
Height1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
WE-CBF SMT EMI Suppression Ferrite Bead, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size0402 
Operating Temperature -55 °C up to +125 °C
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Rated Current500 mA
Impedance @ 100 MHz120 Ω
Maximum Impedance200 Ω
Maximum Impedance600 MHz 
Rated Current 21100 mA
DC Resistance0.2 Ω
TypeWide Band 
WE-PMCI Power Molded Chip Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size160808 
Operating Temperature -40 °C up to +125 °C
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.3 mm
Inductance0.47 µH
Rated Current3950 mA
Saturation Current 11.5 A
Saturation Current 23.35 A
Self Resonant Frequency120 MHz
Rated Current 21500 mA
DC Resistance0.075 Ω