IC manufacturers Texas Instruments

IC manufacturers (103)

Texas Instruments TPS61178RNWR | Demoboard TIDA-010057

Ultrasound smart probe power supply reference design

Overview

TopologyOther Topology

Description

Significant technological advancements and high degree of integration in Medical imaging, especially hand-held ultrasound smart probes, are pushing engineers to come up with highly-efficient, noise immune power solutions in a small size. This reference design documents end to end power and data solution for our high performance 128-channel Tx/64-channel Rx ultrasound smart probe solution with TX7332 transmit chip and AFE5832LP receive chip. The power tree includes a single-stage transformer-less HV generation (up to +/- 80V & height <5mm) for transmit and the point-of-load LV for the AFEs & FPGA from a 5V USB Type-C™ input. This design enables low-noise (<10mV ripple) efficient rails and better thermal performance (< 10°C temp rise) achieving system efficiency ~80%, receive data SNR > 55dB and ultra-compact size (90mm x 45mm x 20mm). All power rails can be synchronized to an external clock using our integrated buffer-divider CDCE949. This design also supports 1S battery input with a normal ultrasound operation of up to 2 hours.

Features

  • Transformer less dual rail HV (±80V @ 25 mA) generation from 5V USB in single stage implementation to meet component height requirement of < 5mm
  • Low ripple and LV supply for the front end and FPGA from a 5V USB Type-C input
  • Compact board size (< 90mm x 45 mm x 20mm)
  • End to End System Efficiency ~80% running at full load
  • SNR > 55dB (Noise Floor below -90dB)
  • EN/DISABLE supplies for power optimization and all rails can be synchronized to external clock
  • Accurate real time power consumption measurement using high performance instrumentation amplifiers INA231
  • High speed data acquisition over USB Type C up to 4.2 Gbps

Typical applications

  • Ultrasound smart probe

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
IR(mA)
RDC(Ω)
C
Tol. C
VR(V (DC))
Size
Operating Temperature
Q(%)
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
Fl(mm)
Packaging
L(µH)
IR(mA)
ISAT(mA)
fres(MHz)
Mount
Interface Type
Gender
Pins
PCB Thickness(mm)
Working Voltage(V (DC))
H(mm)
Operation Force(g)
Electrical Life(Cycles)
Actuator Color
Washable
Vaporphase process
Z @ 100 MHz(Ω)
Zmax(Ω)
Test Condition Zmax
IR 2(mA)
RDC max.(Ω)
Type
Samples
WE-CBF SMT EMI Suppression Ferrite Bead, 2000 mA, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Rated Current2000 mA
Size0603 
Operating Temperature -55 °C up to +125 °C
Length1.6 mm
Width0.8 mm
Pad Dimension0.3 mm
Rated Current2000 mA
MountSMT 
Height0.8 mm
Impedance @ 100 MHz30 Ω
Maximum Impedance40 Ω
Maximum Impedance1000 MHz 
Rated Current 23000 mA
DC Resistance0.04 Ω
TypeHigh Current 
WE-CBA SMT EMI Suppression Ferrite Bead, 1000 mA, 0.2 Ω
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Rated Current1000 mA
DC Resistance0.2 Ω
Size0603 
Operating Temperature -55 °C up to +125 °C
Length1.6 mm
Width0.8 mm
Pad Dimension0.3 mm
MountSMT 
Height0.8 mm
Impedance @ 100 MHz600 Ω
Maximum Impedance660 Ω
Maximum Impedance190 MHz 
TypeHigh Current 
WE-PMI Power Multilayer Inductor, –, 0.2 Ω
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
DC Resistance0.2 Ω
Size0805 
Operating Temperature -40 °C up to +125 °C
Q-Factor25 %
Length2 mm
Width1.2 mm
Inductance3.3 µH
Rated Current700 mA
Saturation Current280 mA
Self Resonant Frequency30 MHz
MountSMT 
Pins
Height1 mm
Rated Current 21000 mA
DC Resistance0.25 Ω
TypeLow RDC 
WE-LQS SMT Power Inductor, 2000 mA, 0.086 Ω
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Rated Current2000 mA
DC Resistance0.086 Ω
Size5040 
Operating Temperature -40 °C up to +125 °C
Length5 mm
Width5 mm
Inductance15 µH
Saturation Current2200 mA
Self Resonant Frequency22 MHz
MountSMT 
Height4 mm
WE-LQS SMT Power Inductor, 1200 mA, 0.29 Ω
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Rated Current1200 mA
DC Resistance0.29 Ω
Size8040 
Operating Temperature -40 °C up to +125 °C
Length8 mm
Width8 mm
Inductance100 µH
Saturation Current1500 mA
Self Resonant Frequency6.4 MHz
MountSMT 
Height4.2 mm
WE-TPC SMT Tiny Power Inductor, 140 mA, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Rated Current140 mA
Size4828 
Operating Temperature -40 °C up to +125 °C
Length4.8 mm
Width4.8 mm
Inductance1000 µH
Saturation Current80 mA
Self Resonant Frequency2.3 MHz
MountSMT 
Pins
Height2.8 mm
DC Resistance7 Ω
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 pF
Capacitance±5% 
Rated Voltage50 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Height0.5 mm
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Height0.5 mm
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance220 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance2.3 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Height0.8 mm
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.1 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Height0.8 mm
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 µF
Capacitance±10% 
Rated Voltage10 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.01 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Height1.25 mm
WS-TASV J-Bend SMT Tact Switch 3.5x2.9 mm, 50 mA, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Rated Current50 mA
Rated Voltage12 V (DC)
Operating Temperature -40 °C up to +85 °C
Insulation Resistance100 MΩ
PackagingTape and Reel 
Height1.7 mm
Operation Force350 g
Electrical Life200000 Cycles
Actuator ColorBlue 
WashableNo 
Vaporphase processnot specified 
WR-USB Type C Connectors, 5000 mA, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Rated Current5000 mA
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
PackagingTape and Reel 
MountTHR 
Interface TypeType C 
GenderReceptacle 
Pins24 
PCB Thickness1.6 mm
Working Voltage48 V (DC)
TypeHorizontal