IC manufacturers Texas Instruments

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Texas Instruments TPS40077PWP-LFPAK-Stout

LFPAK, Point of Load, demonstration board

Overview

TopologyBuck Converter
Input voltage12 V
Output 11.2 V / 25 A
Output 23.3 V / 23 A
IC revision1

Description

The 25A LFPAK demonstration board is a single phase buck converter design to demonstrate the performance of NXP LFPAK MOSFETS in a small form factor point of load (POL) circuit. The very small 3.3 cm x 6.1 cm (1.3x2.4 inch), four layer board converts 12V nominal input to 1.2 V nominal output and is capable of output currents of 25 amps while maintaining case temperatures at or below 90 C with a minimal 200 LFM airflow at 25 C ambient. Efficiencies above 90% are achieved (12v in, 3.3v out), on this small demonstration board due to the superior level of on-resistance and thermal performance of the small S08 foot print NXP LFPAK devices.

Parts approved by Texas Instruments

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Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
L(µH)
IRP,40K(A)
ISAT,10%(A)
ISAT,30%(A)
RDC(mΩ)
fres(MHz)
Material
Qty.
SamplesAvailability & Sample
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SPECWE-HCI SMT Flat Wire High Current Inductor, 0.47 µH, 50.1 A

PCN pending

Due to a pending PCN, a modification of the component will be implemented soon. Please find the PCN below. If you have further questions please get in contact with our sales staff.

Simu­lation
Availability
Status
ActiveProduction is active. Expected lifetime: >10 years.
iProduction is active. Expected lifetime: >10 years.
Inductance0.47 µH
Performance Rated Current50.1 A
Saturation Current @ 10%24 A
Saturation Current @ 30%50 A
DC Resistance0.9 mΩ
Self Resonant Frequency95 MHz
MaterialWE-PERM 
Packaging Unit400 
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