| Topology | Buck Converter |
| Input voltage | 12 V |
| Output 1 | 1.2 V / 25 A |
| Output 2 | 3.3 V / 23 A |
| IC revision | 1 |
The 25A LFPAK demonstration board is a single phase buck converter design to demonstrate the performance of NXP LFPAK MOSFETS in a small form factor point of load (POL) circuit. The very small 3.3 cm x 6.1 cm (1.3x2.4 inch), four layer board converts 12V nominal input to 1.2 V nominal output and is capable of output currents of 25 amps while maintaining case temperatures at or below 90 C with a minimal 200 LFM airflow at 25 C ambient. Efficiencies above 90% are achieved (12v in, 3.3v out), on this small demonstration board due to the superior level of on-resistance and thermal performance of the small S08 foot print NXP LFPAK devices.
Order Code | Datasheet | Simulation | Downloads | Status | Product series | L(µH) | IRP,40K(A) | ISAT,10%(A) | ISAT,30%(A) | RDC(mΩ) | fres(MHz) | Material | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | WE-HCI SMT Flat Wire High Current Inductor, 0.47 µH, 50.1 A | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWE-HCI SMT Flat Wire High Current Inductor | Inductance0.47 µH | Performance Rated Current50.1 A | Saturation Current @ 10%24 A | Saturation Current @ 30%50 A | DC Resistance0.9 mΩ | Self Resonant Frequency95 MHz | MaterialWE-PERM |