IC-Hersteller Texas Instruments

IC-Hersteller (103)

Texas Instruments TPS40077PWP-LFPAK-Stout

LFPAK, Point of Load, demonstration board

Details

TopologieAbwärtswandler
Eingangsspannung12 V
Ausgang 11.2 V / 25 A
Ausgang 23.3 V / 23 A
IC-Revision1

Beschreibung

The 25A LFPAK demonstration board is a single phase buck converter design to demonstrate the performance of NXP LFPAK MOSFETS in a small form factor point of load (POL) circuit. The very small 3.3 cm x 6.1 cm (1.3x2.4 inch), four layer board converts 12V nominal input to 1.2 V nominal output and is capable of output currents of 25 amps while maintaining case temperatures at or below 90 C with a minimal 200 LFM airflow at 25 C ambient. Efficiencies above 90% are achieved (12v in, 3.3v out), on this small demonstration board due to the superior level of on-resistance and thermal performance of the small S08 foot print NXP LFPAK devices.

Artikeldaten

Artikel Nr.
Daten­blatt
Simu­lation
Downloads
Status
Produktserie
L(µH)
IRP,40K(A)
ISAT,10%(A)
ISAT,30%(A)
RDC(mΩ)
fres(MHz)
Material
Muster
WE-HCI SMT-Hochstrominduktivität, 0.47 µH, 50.1 A
Simu­lation
Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.
Induktivität0.47 µH
Performance Nennstrom50.1 A
Sättigungsstrom 124 A
Sättigungsstrom @ 30%50 A
Gleichstromwiderstand0.9 mΩ
Eigenresonanzfrequenz95 MHz
MaterialWE-PERM