| Topologie | Abwärtswandler |
| Eingangsspannung | 12 V |
| Ausgang 1 | 1.2 V / 25 A |
| Ausgang 2 | 3.3 V / 23 A |
| IC-Revision | 1 |
The 25A LFPAK demonstration board is a single phase buck converter design to demonstrate the performance of NXP LFPAK MOSFETS in a small form factor point of load (POL) circuit. The very small 3.3 cm x 6.1 cm (1.3x2.4 inch), four layer board converts 12V nominal input to 1.2 V nominal output and is capable of output currents of 25 amps while maintaining case temperatures at or below 90 C with a minimal 200 LFM airflow at 25 C ambient. Efficiencies above 90% are achieved (12v in, 3.3v out), on this small demonstration board due to the superior level of on-resistance and thermal performance of the small S08 foot print NXP LFPAK devices.
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | L(µH) | IRP,40K(A) | ISAT,10%(A) | ISAT,30%(A) | RDC(mΩ) | fres(MHz) | Material | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | WE-HCI SMT-Hochstrominduktivität, 0.47 µH, 50.1 A | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWE-HCI SMT-Hochstrominduktivität | Induktivität0.47 µH | Performance Nennstrom50.1 A | Sättigungsstrom 124 A | Sättigungsstrom @ 30%50 A | Gleichstromwiderstand0.9 mΩ | Eigenresonanzfrequenz95 MHz | MaterialWE-PERM |