IC manufacturers STMicroelectronics
IC manufacturers (103)
- All manufacturers
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (28)
- Ablic (23)
- Acco Semiconductor (1)
- Advanced Power (4)
- Allegro Microsystems (100)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (204)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (46)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (259)
- Divimath (8)
- Elmos AG (1)
- EPC (136)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (8)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- IKON (1)
- Indie Semiconductor (8)
- Innovision Semiconductor Inc (2)
- Intel (68)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (3)
- Kinetic Technology (8)
- Lattice semiconductor Corporation (38)
- Littelfuse (1)
- Lumissil Microsystems (8)
- M3 Technology (M3Tek) (7)
- Macnica (22)
- Marvell Semiconductor (1)
- MaxLinear (181)
- Menlo Micro (1)
- MikroE (25)
- MindCet (2)
- Monolithic Power Systems (980)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (266)
- Nisshinbo Micro Device Inc. (10)
- Novosense Micro (1)
- NXP (333)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (117)
- Powermat (1)
- Pulsiv (19)
- Qorvo (96)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (297)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (86)
- SG-Micro (54)
- SiFive (2)
- Silanna Semiconductor (9)
- Silergy Corporation (33)
- Silicon Laboratory Inc. (108)
- Silicontent Technology (59)
- Silvertel (59)
- Skycore Semiconductors (1)
- Skyworks (33)
- Southchip (14)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (31)
- Wise Integration (3)
- Wolfspeed (23)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
STMicroelectronics STWLC38 | Demoboard STWLC38 in Rx and RTx
Qi-compliant dual mode wireless power receiver for up to 15W applications
Overview
| Topology | Wireless Power Transfer |
| Input voltage | 5-12 V |
| Output 1 | 12 V / 1.25 A |
| IC revision | 1 |
Description
The STWLC38 is an integrated Wireless Power Receiver suitable for wearable/hearable and smart phone applications and can supply up to 15 W of outputpower. The chip has been designed to support Qi 1.3 specifications for inductive communication protocol, 5W Baseline Power Profile and 15W Extended PowerProfile. STWLC38 shows excellent efficiency performance thanks to the integrated low-losssynchronous rectifier and the low drop-out linear regulator: both elements are dynamically managed by the digital core to minimize the overall power dissipation over a wide range of output load conditions.
Features
- Up to 15 W output power
- Up to 5W output power in Tx mode
- Qi 1.3 inductive wireless standard communication protocol compliant
- High efficiency (98% typical) synchronous rectifier operating up to 800 kHz
- Low drop-out linear regulator with output current limit and input voltage control loop
- Adaptive Rectifier Configuration (ARC) Mode for enhanced spatial freedom
- 4 V to 12 V programmable output voltage
- Above 85% overall system efficiency
- 32-bit, 64 MHz ARM Cortex M0+ core with 32kB RRAM,16 kB SRAM,64kB ROM
- 10-bit A/D Converter
- Configurable GPIOs
- I2C Slave interface
- Multi-level ASK modulator, Enhanced FSK demodulator
- Output Over-Voltage clamping protection
- Accurate voltage/current measurement for Foreign Object Detection (FOD)
- On-chip thermal management and protections
- Flip chip 40 bumps (2.12mm x 3.32mm)
Typical applications
- Wearable/Hearables TWS
- Medical and healthcare equipment
- Smartphones
More information
Products
Order Code | Datasheet | Simulation | Downloads | Status | Product series | C | Tol. C | VR(V (DC)) | Operating Temperature | DF(%) | RISO | Ceramic Type | L(mm) | W(mm) | H(mm) | Fl(mm) | Packaging | Compliance | Size | L(µH) | IR(A) | RDC max.(mΩ) | fres(MHz) | Q(%) | P(W) | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSGP MLCCs 25 V(DC), 1 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | Capacitance1 nF | Capacitance±10% | Rated Voltage25 V (DC) | Operating Temperature -55 °C up to +125 °C | Dissipation Factor3.5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | – | Size0402 | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), 1.5 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 50 V(DC) | Capacitance1.5 nF | Capacitance±10% | Rated Voltage50 V (DC) | Operating Temperature -55 °C up to +125 °C | Dissipation Factor2.5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1.6 mm | Width0.8 mm | Height0.8 mm | Pad Dimension0.4 mm | Packaging7" Tape & Reel | – | Size0603 | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), 3.3 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 50 V(DC) | Capacitance3.3 nF | Capacitance±10% | Rated Voltage50 V (DC) | Operating Temperature -55 °C up to +125 °C | Dissipation Factor2.5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1.6 mm | Width0.8 mm | Height0.8 mm | Pad Dimension0.4 mm | Packaging7" Tape & Reel | – | Size0603 | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 25 V(DC), 10 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | Capacitance10 nF | Capacitance±10% | Rated Voltage25 V (DC) | Operating Temperature -55 °C up to +125 °C | Dissipation Factor3.5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | – | Size0402 | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), 10 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 50 V(DC) | Capacitance10 nF | Capacitance±10% | Rated Voltage50 V (DC) | Operating Temperature -55 °C up to +125 °C | Dissipation Factor2.5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1.6 mm | Width0.8 mm | Height0.8 mm | Pad Dimension0.4 mm | Packaging7" Tape & Reel | – | Size0603 | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 25 V(DC), 22 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | Capacitance22 nF | Capacitance±10% | Rated Voltage25 V (DC) | Operating Temperature -55 °C up to +125 °C | Dissipation Factor3.5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | – | Size0402 | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), 22 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 50 V(DC) | Capacitance22 nF | Capacitance±10% | Rated Voltage50 V (DC) | Operating Temperature -55 °C up to +125 °C | Dissipation Factor2.5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1.6 mm | Width0.8 mm | Height0.8 mm | Pad Dimension0.4 mm | Packaging7" Tape & Reel | – | Size0603 | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 25 V(DC), 47 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | Capacitance47 nF | Capacitance±10% | Rated Voltage25 V (DC) | Operating Temperature -55 °C up to +125 °C | Dissipation Factor3.5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | – | Size0402 | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), 47 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 50 V(DC) | Capacitance47 nF | Capacitance±10% | Rated Voltage50 V (DC) | Operating Temperature -55 °C up to +125 °C | Dissipation Factor3 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1.6 mm | Width0.8 mm | Height0.8 mm | Pad Dimension0.4 mm | Packaging7" Tape & Reel | – | Size0603 | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), 100 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 50 V(DC) | Capacitance100 nF | Capacitance±10% | Rated Voltage50 V (DC) | Operating Temperature -55 °C up to +125 °C | Dissipation Factor3 % | Insulation Resistance5 GΩ | Ceramic TypeX7R Class II | Length1.6 mm | Width0.8 mm | Height0.8 mm | Pad Dimension0.4 mm | Packaging7" Tape & Reel | – | Size0603 | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 6.3 V(DC), 1 µF, ±20% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 6.3 V(DC) | Capacitance1 µF | Capacitance±20% | Rated Voltage6.3 V (DC) | Operating Temperature -55 °C up to +85 °C | Dissipation Factor15 % | Insulation Resistance0.1 GΩ | Ceramic TypeX5R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | – | Size0402 | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 16 V(DC), 1 µF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 16 V(DC) | Capacitance1 µF | Capacitance±10% | Rated Voltage16 V (DC) | Operating Temperature -55 °C up to +125 °C | Dissipation Factor10 % | Insulation Resistance0.1 GΩ | Ceramic TypeX7R Class II | Length1.6 mm | Width0.8 mm | Height0.8 mm | Pad Dimension0.4 mm | Packaging7" Tape & Reel | – | Size0603 | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 6.3 V(DC), 4.7 µF, ±20% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 6.3 V(DC) | Capacitance4.7 µF | Capacitance±20% | Rated Voltage6.3 V (DC) | Operating Temperature -55 °C up to +85 °C | Dissipation Factor20 % | Insulation Resistance0.01 GΩ | Ceramic TypeX5R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | – | Size0402 | – | – | – | – | – | – | |||||
 | WE-WPCC Wireless Power Transfer Receiver Coil, –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWE-WPCC Wireless Power Transfer Receiver Coil | – | – | – | Operating Temperature -20 °C up to +105 °C | – | – | – | Length15 mm | Width15 mm | Height0.6 mm | – | – | Complianceworks with Qi Rx IC's | SizeØ 15 x 0.6 mm | Inductance11.8 µH | Rated Current0.7 A | DC Resistance750 mΩ | Self Resonant Frequency22 MHz | Q-Factor13 % | Power Capability [1]5 W |