IC manufacturers STMicroelectronics
IC manufacturers (103)
- All manufacturers
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (28)
- Ablic (23)
- Acco Semiconductor (1)
- Advanced Power (4)
- Allegro Microsystems (100)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (204)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (46)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (259)
- Divimath (8)
- Elmos AG (1)
- EPC (136)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (8)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- IKON (1)
- Indie Semiconductor (8)
- Innovision Semiconductor Inc (2)
- Intel (68)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (3)
- Kinetic Technology (8)
- Lattice semiconductor Corporation (38)
- Littelfuse (1)
- Lumissil Microsystems (8)
- M3 Technology (M3Tek) (7)
- Macnica (22)
- Marvell Semiconductor (1)
- MaxLinear (181)
- Menlo Micro (1)
- MikroE (25)
- MindCet (2)
- Monolithic Power Systems (980)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (266)
- Nisshinbo Micro Device Inc. (10)
- Novosense Micro (1)
- NXP (333)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (117)
- Powermat (1)
- Pulsiv (19)
- Qorvo (96)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (297)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (86)
- SG-Micro (54)
- SiFive (2)
- Silanna Semiconductor (9)
- Silergy Corporation (33)
- Silicon Laboratory Inc. (108)
- Silicontent Technology (59)
- Silvertel (59)
- Skycore Semiconductors (1)
- Skyworks (33)
- Southchip (14)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (31)
- Wise Integration (3)
- Wolfspeed (23)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
STMicroelectronics STWLC38 | Demoboard STDES-WLC38TWS
Qi-compatible wireless power receiver reference design for Qi 2.5W application
Overview
| Topology | Wireless Power Transfer |
| IC revision | 1 |
Description
The STDES-WLC38TWS reference design is based on STWLC38. It is designed for wireless power receiver application and it allows you to quickly start your 2.5 W Qi-BPP compatible wireless charging receiver projects.This reference design document provides sufficient information to develop a project for up to 2.5 W charging using baseline power profile (BPP).Through the I²C interface you can access and modify different configuration parameters, tailoring the operation of the device to the needs of custom applications. Using an on-board USB-to-I²C bridge, you can monitor and control the STWLC38 thanks to the STSW-WPSTUDIO graphical user interface (GUI).
Features
- Up to 15 W output power
- Up to 5W output power in Tx mode
- Qi 1.3 inductive wireless standard communication protocol compliant
- High efficiency (98% typical) synchronous rectifier operating up to 800 kHz
- Low drop-out linear regulator with output current limit and input voltage control loop
- Adaptive Rectifier Configuration (ARC) Mode for enhanced spatial freedom
- 4 V to 12 V programmable output voltage
- Above 85% overall system efficiency
- 32-bit, 64 MHz ARM Cortex M0+ core with 32kB RRAM,16 kB SRAM,64kB ROM
- 10-bit A/D Converter
- Configurable GPIOs
- I2C Slave interface
- Multi-level ASK modulator, Enhanced FSK demodulator
- Output Over-Voltage clamping protection
- Accurate voltage/current measurement for Foreign Object Detection (FOD)
- On-chip thermal management and protections
- Flip chip 40 bumps (2.12mm x 3.32mm)
Typical applications
- Wearable/Hearables TWS
- Smartphones
- Medical and healthcare equipment
More information
Products
Order Code | Datasheet | Simulation | Downloads | Status | Product series | C | Tol. C | VR(V (DC)) | Size | Operating Temperature | DF(%) | RISO | Ceramic Type | L(mm) | W(mm) | H(mm) | Fl(mm) | Packaging | Samples |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSGP MLCCs 25 V(DC), 1 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | Capacitance1 nF | Capacitance±10% | Rated Voltage25 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Dissipation Factor3.5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | ||||
| WCAP-CSGP MLCCs 25 V(DC), 10 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | Capacitance10 nF | Capacitance±10% | Rated Voltage25 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Dissipation Factor3.5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | ||||
| WCAP-CSGP MLCCs 25 V(DC), 22 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | Capacitance22 nF | Capacitance±10% | Rated Voltage25 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Dissipation Factor3.5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | ||||
| WCAP-CSGP MLCCs 25 V(DC), 47 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | Capacitance47 nF | Capacitance±10% | Rated Voltage25 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Dissipation Factor3.5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | ||||
| WCAP-CSGP MLCCs 25 V(DC), 100 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | Capacitance100 nF | Capacitance±10% | Rated Voltage25 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Dissipation Factor10 % | Insulation Resistance5 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging13" Tape & Reel | ||||
| WCAP-CSGP MLCCs 6.3 V(DC), 1 µF, ±20% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 6.3 V(DC) | Capacitance1 µF | Capacitance±20% | Rated Voltage6.3 V (DC) | Size0402 | Operating Temperature -55 °C up to +85 °C | Dissipation Factor15 % | Insulation Resistance0.1 GΩ | Ceramic TypeX5R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | ||||
| WCAP-CSGP MLCCs 6.3 V(DC), 4.7 µF, ±20% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 6.3 V(DC) | Capacitance4.7 µF | Capacitance±20% | Rated Voltage6.3 V (DC) | Size0402 | Operating Temperature -55 °C up to +85 °C | Dissipation Factor20 % | Insulation Resistance0.01 GΩ | Ceramic TypeX5R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel |