IC manufacturers STMicroelectronics

IC manufacturers (103)

STMicroelectronics STM32G474RE | Demoboard STEVAL-DPSC58C

32-bit Power Architecture MCU for High Performance Applications

Overview

TopologyOther Topology
IC revision1

Description

SPC58 N line MCU, based on Power Architecture® Technology, is designed for mission-critical automotive applications where most stringent safety standards and real-time performance really matters.SPC58 N line high performance and real time capabilities, combined with ISO26262 ASIL D functional safety compliance and embedded security, address high and mid powertrain applications, Electric vehicles.

Features

  • AEC-Q100 qualified
  • 32-bit Power Architecture VLE compliant CPU cores:
  • Five enhanced main e200z4256n3 cores, dual issue, two paired in lockstep
  • Floating Point, End-to-End Error Correction
  • 6576 KB (6288 KB code flash + 288 KB data flash) on-chip flash memory:
  • supports read during program and erase operations, and multiple blocks allowing EEPROM emulation
  • Supports read while read between the two code Flash partitions.
  • 128 KB on-chip general-purpose SRAM (in addition to 384 KB included in the CPUs)
  • 96-channel direct memory access controller (eDMA)
  • Comprehensive new generation ASIL-D safety concept
  • ASIL-D of ISO 26262
  • FCCU for collection and reaction to failure notifications
  • Memory Error Management Unit (MEMU) for collection and reporting of error events in memories
  • Cyclic redundancy check (CRC) unit
  • Junction temperature range -40 °C to 165 °C
  • Dual-channel FlexRay controller
  • Hardware Security Module (HSM)
  • GTM344 - generic timer module
  • Intelligent complex timer module
  • 144 channels (48 input and 96 output)
  • 5 programmable fine grain multi-threaded cores
  • 61 KB of dedicated RAM
  • 24-bit wide channels
  • Enhanced analog-to-digital converter system with:
  • 1 supervisor 12-bit SAR analog converter
  • 2 separate 10-bit SAR analog converter
  • 4 separate fast 12-bit SAR analog converters
  • 6 separate 16-bit Sigma-Delta analog converter with programmable decimation filters
  • SAR ADC Queued digital interfaces for individual channel ordering and command sequencing
  • Communication interfaces
  • 7 LINFlexD modules
  • 8 deserial serial peripheral interface (DSPI) modules
  • 7 modular controller area network (MCAN) modules, and one time-triggered controller area network (M-TTCAN), all supporting flexible data rate (ISO CAN-FD)
  • One Ethernet controller 10/100 Mbps, compliant IEEE 802.3-2008
  • Flexible Power Supply options:
  • External Regulators (1.2 V core, 3.3 V - 5 V IO)
  • Single internal SMPS regulator
  • Nexus development interface (NDI) per IEEEISTO 5001-2003 standard, with some support for 2010 standard
  • Boot assist Flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART

Typical applications

  • On Board Charger composed of a PFC totem pole interleaved + an interleaved resonant LLC

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
L(µH)
ISAT,10%(A)
ISAT,30%(A)
fres(MHz)
IRP,40K(A)
Mount
C
Tol. C
VR(V (DC))
Size
Operating Temperature
Q(%)
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
Z @ 100 MHz(Ω)
Zmax(Ω)
Test Condition Zmax
IR 2(mA)
RDC max.(mΩ)
Type
Samples
WE-MAIA SMT Power Inductor, 8.2 µH, 3.35 A
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Inductance8.2 µH
Saturation Current @ 10%3.35 A
Saturation Current @ 30%6.8 A
Self Resonant Frequency17 MHz
Performance Rated Current3.45 A
MountSMT 
Size4030 
Operating Temperature -40 °C up to +125 °C
Length4 mm
Width4 mm
Height3 mm
DC Resistance86 mΩ
WE-CBF SMT EMI Suppression Ferrite Bead, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
MountSMT 
Size0402 
Operating Temperature -55 °C up to +125 °C
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Impedance @ 100 MHz470 Ω
Maximum Impedance1200 Ω
Maximum Impedance300 MHz 
Rated Current 2620 mA
DC Resistance450 mΩ
TypeHigh Speed 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance6.8 pF
Capacitance±0.5pF 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor536 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance470 nF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance1.1 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance470 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size1206 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3 %
Insulation Resistance1.1 GΩ
Ceramic TypeX7R Class II 
Length3.2 mm
Width1.6 mm
Height1.6 mm
Pad Dimension0.6 mm
Packaging7" Tape & Reel