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STMicroelectronics STM32G474RE | Demoboard STEVAL-DPSC58C
32-bit Power Architecture MCU for High Performance Applications
Details
| Topologie | Sonstige Topologie |
| IC-Revision | 1 |
Beschreibung
SPC58 N line MCU, based on Power Architecture® Technology, is designed for mission-critical automotive applications where most stringent safety standards and real-time performance really matters.SPC58 N line high performance and real time capabilities, combined with ISO26262 ASIL D functional safety compliance and embedded security, address high and mid powertrain applications, Electric vehicles.
Eigenschaften
- AEC-Q100 qualified
- 32-bit Power Architecture VLE compliant CPU cores:
- Five enhanced main e200z4256n3 cores, dual issue, two paired in lockstep
- Floating Point, End-to-End Error Correction
- 6576 KB (6288 KB code flash + 288 KB data flash) on-chip flash memory:
- supports read during program and erase operations, and multiple blocks allowing EEPROM emulation
- Supports read while read between the two code Flash partitions.
- 128 KB on-chip general-purpose SRAM (in addition to 384 KB included in the CPUs)
- 96-channel direct memory access controller (eDMA)
- Comprehensive new generation ASIL-D safety concept
- ASIL-D of ISO 26262
- FCCU for collection and reaction to failure notifications
- Memory Error Management Unit (MEMU) for collection and reporting of error events in memories
- Cyclic redundancy check (CRC) unit
- Junction temperature range -40 °C to 165 °C
- Dual-channel FlexRay controller
- Hardware Security Module (HSM)
- GTM344 - generic timer module
- Intelligent complex timer module
- 144 channels (48 input and 96 output)
- 5 programmable fine grain multi-threaded cores
- 61 KB of dedicated RAM
- 24-bit wide channels
- Enhanced analog-to-digital converter system with:
- 1 supervisor 12-bit SAR analog converter
- 2 separate 10-bit SAR analog converter
- 4 separate fast 12-bit SAR analog converters
- 6 separate 16-bit Sigma-Delta analog converter with programmable decimation filters
- SAR ADC Queued digital interfaces for individual channel ordering and command sequencing
- Communication interfaces
- 7 LINFlexD modules
- 8 deserial serial peripheral interface (DSPI) modules
- 7 modular controller area network (MCAN) modules, and one time-triggered controller area network (M-TTCAN), all supporting flexible data rate (ISO CAN-FD)
- One Ethernet controller 10/100 Mbps, compliant IEEE 802.3-2008
- Flexible Power Supply options:
- External Regulators (1.2 V core, 3.3 V - 5 V IO)
- Single internal SMPS regulator
- Nexus development interface (NDI) per IEEEISTO 5001-2003 standard, with some support for 2010 standard
- Boot assist Flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART
Typische Anwendungen
- On Board Charger composed of a PFC totem pole interleaved + an interleaved resonant LLC
Weiterführende Informationen
Artikeldaten
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | L(µH) | ISAT,10%(A) | ISAT,30%(A) | fres(MHz) | IRP,40K(A) | Montageart | C | Tol. C | VR(V (DC)) | Bauform | Betriebstemperatur | Q(%) | DF(%) | RISO | Keramiktyp | L(mm) | B(mm) | H(mm) | Fl(mm) | Verpackung | Z @ 100 MHz(Ω) | Zmax(Ω) | Testbedingung Zmax | IR 2(mA) | RDC max.(mΩ) | Typ | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | WE-MAIA SMT Speicherdrossel, 8.2 µH, 3.35 A | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWE-MAIA SMT Speicherdrossel | Induktivität8.2 µH | Sättigungsstrom 13.35 A | Sättigungsstrom @ 30%6.8 A | Eigenresonanzfrequenz17 MHz | Performance Nennstrom3.45 A | MontageartSMT | – | – | – | Bauform4030 | Betriebstemperatur -40 °C up to +125 °C | – | – | – | – | Länge4 mm | Breite4 mm | Höhe3 mm | – | – | – | – | – | – | Gleichstromwiderstand86 mΩ | – | ||||
 | WE-CBF SMT-Ferrit, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWE-CBF SMT-Ferrit | – | – | – | – | – | MontageartSMT | – | – | – | Bauform0402 | Betriebstemperatur -55 °C up to +125 °C | – | – | – | – | Länge1 mm | Breite0.5 mm | Höhe0.5 mm | Pad Dimension0.25 mm | – | Impedanz @ 100 MHz470 Ω | Maximale Impedanz1200 Ω | Maximale Impedanz300 MHz | Nennstrom 2620 mA | Gleichstromwiderstand450 mΩ | TypHochgeschwindigkeit | ||||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | Kapazität6.8 pF | Kapazität±0.5pF | Nennspannung50 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | Güte536 % | – | Isolationswiderstand10 GΩ | KeramiktypNP0 Klasse I | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 16 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | Kapazität100 nF | Kapazität±10% | Nennspannung16 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor3.5 % | Isolationswiderstand5 GΩ | KeramiktypX7R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 25 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | Kapazität470 nF | Kapazität±10% | Nennspannung25 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor10 % | Isolationswiderstand1.1 GΩ | KeramiktypX7R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | Kapazität470 nF | Kapazität±10% | Nennspannung50 V (DC) | Bauform1206 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor3 % | Isolationswiderstand1.1 GΩ | KeramiktypX7R Klasse II | Länge3.2 mm | Breite1.6 mm | Höhe1.6 mm | Pad Dimension0.6 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – |