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Overview
| Topology | Other Topology |
| IC revision | 1.0 |
Description
The X-NUCLEO-60K1A1 is a kit composed of two expansion boards, an X-NUCLEO-60L1A1 expansion board, and an X-NUCLEO-60R1A1 expansion board, working as a pair, which can be plugged onto most STM32 Nucleo board equipped with the Arduino R3 connectors. It provides a complete evaluation kit that allows you to learn, evaluate, and develop applications based on the ST60A3H1 transceiver, for contactless connectivity up to 480 Mbit/s.The ST60A3H1 is a full RF transceiver with a dual-linear-polarization integrated antenna, operating in half-duplex mode. It provides an optimized solution for a high-speed, low-power, short-range point to point 60 GHz RF link.The X-NUCLEO-60L1A1 expansion board, which hosts an ST60A3H1 configured as Local is the only board needing to be plugged onto an STM32 Nucleo development board (for example, NUCLEO-L476RG with ultralow power STM32 microcontroller). The other X-NUCLEO-60R1A1 expansion board, which hosts an ST60A3H1 configured as Remote is used in standalone. Any ST60A3H1 configuration is done from the X-NUCLEO-60L1A1 side.
Features
60 GHz V-band contactless connectivity transceiver expansion board kit, based on the ST60A3H1 for STM32 Nucleo. The X-NUCLEO-60K1A1 kit is composed of two boards:X-NUCLEO-60L1A1 expansion board with an ST60A3H1 configured as LocalX-NUCLEO-60R1A1 expansion board with an ST60A3H1 configured as RemoteRange up to 3 cmeUSB2, UART, GPIO, or I²C RF tunnelingEmbedded eUSB2 repeaterBypassable USB2 hub on Remote ST60A3H1 sideCompatible with most STM32 Nucleo boardsEquipped with Arduino® UNO R3 connectorFree comprehensive development firmware library and examples for ST60A3H1, compatible with STM32CubeETSI certifiedRoHS, CE, and UKCA compliant
Typical applications
- Contactless connectivity up to 480 Mbit/s
More information
Products
Order Code | Datasheet | Simulation | Downloads | Status | Product series | C | Tol. C | VR(V (DC)) | Size | Operating Temperature | RISO | Ceramic Type | L(mm) | W(mm) | Fl(mm) | Packaging | Q(%) | DF(%) | Interface Type | Gender | Pins | Mount | PCB Thickness(mm) | Working Voltage(V (DC)) | Z @ 100 MHz(Ω) | Zmax(Ω) | Test Condition Zmax | IR(mA) | Z @ 1 GHz(Ω) | H(mm) | Type | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSRF High Frequency, 6.8 pF, ±0.1pF | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSRF High Frequency | Capacitance6.8 pF | Capacitance±0.1pF | Rated Voltage50 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Insulation Resistance10 GΩ | Ceramic TypeNP0 Class I | Length1 mm | Width0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | Q-Factor536 % | – | – | – | – | – | – | – | – | – | – | – | – | Height0.5 mm | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), 100 pF, ±5% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 50 V(DC) | Capacitance100 pF | Capacitance±5% | Rated Voltage50 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Insulation Resistance10 GΩ | Ceramic TypeNP0 Class I | Length1 mm | Width0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | Q-Factor1000 % | – | – | – | – | – | – | – | – | – | – | – | – | Height0.5 mm | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), 10 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 50 V(DC) | Capacitance10 nF | Capacitance±10% | Rated Voltage50 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | – | Dissipation Factor2.5 % | – | – | – | – | – | – | – | – | – | – | – | Height0.5 mm | – | |||||
| WCAP-CSGP MLCCs 16 V(DC), 100 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 16 V(DC) | Capacitance100 nF | Capacitance±10% | Rated Voltage16 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Insulation Resistance5 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | – | Dissipation Factor5 % | – | – | – | – | – | – | – | – | – | – | – | Height0.5 mm | – | |||||
| WCAP-CSGP MLCCs 6.3 V(DC), 4.7 µF, ±20% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 6.3 V(DC) | Capacitance4.7 µF | Capacitance±20% | Rated Voltage6.3 V (DC) | Size0402 | Operating Temperature -55 °C up to +85 °C | Insulation Resistance0.01 GΩ | Ceramic TypeX5R Class II | Length1 mm | Width0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | – | Dissipation Factor20 % | – | – | – | – | – | – | – | – | – | – | – | Height0.5 mm | – | |||||
 | WE-MPSB EMI Multilayer Power Suppression Bead, –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWE-MPSB EMI Multilayer Power Suppression Bead | – | – | – | Size0603 | Operating Temperature -55 °C up to +125 °C | – | – | Length1.6 mm | Width0.8 mm | Pad Dimension0.3 mm | – | – | – | – | – | – | MountSMT | – | – | Impedance @ 100 MHz26 Ω | Maximum Impedance39 Ω | Maximum Impedance515 MHz | Rated Current6500 mA | Impedance @ 1 GHz33 Ω | Height0.8 mm | TypeHigh Current | ||||
 | WR-USB Type C Connectors, –, – | Simulation– | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWR-USB Type C Connectors | – | – | – | – | Operating Temperature -40 °C up to +105 °C | Insulation Resistance1000 MΩ | – | – | – | – | PackagingTape and Reel | – | – | Interface TypeType C | GenderReceptacle | Pins24 | MountTHR | PCB Thickness1.6 mm | Working Voltage48 V (DC) | – | – | – | Rated Current5000 mA | – | – | TypeHorizontal |