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Details
| Topologie | Sonstige Topologie |
| IC-Revision | 1.0 |
Beschreibung
The X-NUCLEO-60K1A1 is a kit composed of two expansion boards, an X-NUCLEO-60L1A1 expansion board, and an X-NUCLEO-60R1A1 expansion board, working as a pair, which can be plugged onto most STM32 Nucleo board equipped with the Arduino R3 connectors. It provides a complete evaluation kit that allows you to learn, evaluate, and develop applications based on the ST60A3H1 transceiver, for contactless connectivity up to 480 Mbit/s.The ST60A3H1 is a full RF transceiver with a dual-linear-polarization integrated antenna, operating in half-duplex mode. It provides an optimized solution for a high-speed, low-power, short-range point to point 60 GHz RF link.The X-NUCLEO-60L1A1 expansion board, which hosts an ST60A3H1 configured as Local is the only board needing to be plugged onto an STM32 Nucleo development board (for example, NUCLEO-L476RG with ultralow power STM32 microcontroller). The other X-NUCLEO-60R1A1 expansion board, which hosts an ST60A3H1 configured as Remote is used in standalone. Any ST60A3H1 configuration is done from the X-NUCLEO-60L1A1 side.
Eigenschaften
60 GHz V-band contactless connectivity transceiver expansion board kit, based on the ST60A3H1 for STM32 Nucleo. The X-NUCLEO-60K1A1 kit is composed of two boards:X-NUCLEO-60L1A1 expansion board with an ST60A3H1 configured as LocalX-NUCLEO-60R1A1 expansion board with an ST60A3H1 configured as RemoteRange up to 3 cmeUSB2, UART, GPIO, or I²C RF tunnelingEmbedded eUSB2 repeaterBypassable USB2 hub on Remote ST60A3H1 sideCompatible with most STM32 Nucleo boardsEquipped with Arduino® UNO R3 connectorFree comprehensive development firmware library and examples for ST60A3H1, compatible with STM32CubeETSI certifiedRoHS, CE, and UKCA compliant
Typische Anwendungen
- Contactless connectivity up to 480 Mbit/s
Weiterführende Informationen
Artikeldaten
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR(V (DC)) | Bauform | Betriebstemperatur | RISO | Keramiktyp | L(mm) | B(mm) | Fl(mm) | Verpackung | Q(%) | DF(%) | Interface typ | Gender | Pins | Montageart | Leiterplattendicke(mm) | Arbeitsspannung(V (DC)) | Z @ 100 MHz(Ω) | Zmax(Ω) | Testbedingung Zmax | IR(mA) | Z @ 1 GHz(Ω) | H(mm) | Typ | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSRF High Frequency, 6.8 pF, ±0.1pF | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSRF High Frequency | Kapazität6.8 pF | Kapazität±0.1pF | Nennspannung50 V (DC) | Bauform0402 | Betriebstemperatur -55 °C up to +125 °C | Isolationswiderstand10 GΩ | KeramiktypNP0 Klasse I | Länge1 mm | Breite0.5 mm | Pad Dimension0.25 mm | Verpackung7" Tape & Reel | Güte536 % | – | – | – | – | – | – | – | – | – | – | – | – | Höhe0.5 mm | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), 100 pF, ±5% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | Kapazität100 pF | Kapazität±5% | Nennspannung50 V (DC) | Bauform0402 | Betriebstemperatur -55 °C up to +125 °C | Isolationswiderstand10 GΩ | KeramiktypNP0 Klasse I | Länge1 mm | Breite0.5 mm | Pad Dimension0.25 mm | Verpackung7" Tape & Reel | Güte1000 % | – | – | – | – | – | – | – | – | – | – | – | – | Höhe0.5 mm | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), 10 nF, ±10% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | Kapazität10 nF | Kapazität±10% | Nennspannung50 V (DC) | Bauform0402 | Betriebstemperatur -55 °C up to +125 °C | Isolationswiderstand10 GΩ | KeramiktypX7R Klasse II | Länge1 mm | Breite0.5 mm | Pad Dimension0.25 mm | Verpackung7" Tape & Reel | – | Verlustfaktor2.5 % | – | – | – | – | – | – | – | – | – | – | – | Höhe0.5 mm | – | |||||
| WCAP-CSGP MLCCs 16 V(DC), 100 nF, ±10% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 16 V(DC) | Kapazität100 nF | Kapazität±10% | Nennspannung16 V (DC) | Bauform0402 | Betriebstemperatur -55 °C up to +125 °C | Isolationswiderstand5 GΩ | KeramiktypX7R Klasse II | Länge1 mm | Breite0.5 mm | Pad Dimension0.25 mm | Verpackung7" Tape & Reel | – | Verlustfaktor5 % | – | – | – | – | – | – | – | – | – | – | – | Höhe0.5 mm | – | |||||
| WCAP-CSGP MLCCs 6.3 V(DC), 4.7 µF, ±20% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 6.3 V(DC) | Kapazität4.7 µF | Kapazität±20% | Nennspannung6.3 V (DC) | Bauform0402 | Betriebstemperatur -55 °C up to +85 °C | Isolationswiderstand0.01 GΩ | KeramiktypX5R Klasse II | Länge1 mm | Breite0.5 mm | Pad Dimension0.25 mm | Verpackung7" Tape & Reel | – | Verlustfaktor20 % | – | – | – | – | – | – | – | – | – | – | – | Höhe0.5 mm | – | |||||
 | WE-MPSB EMI Multilayer Power Suppression Bead, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWE-MPSB EMI Multilayer Power Suppression Bead | – | – | – | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | – | – | Länge1.6 mm | Breite0.8 mm | Pad Dimension0.3 mm | – | – | – | – | – | – | MontageartSMT | – | – | Impedanz @ 100 MHz26 Ω | Maximale Impedanz39 Ω | Maximale Impedanz515 MHz | Nennstrom6500 mA | Impedanz @ 1 GHz33 Ω | Höhe0.8 mm | TypHochstrom | ||||
 | WR-USB Type C Connectors, –, – | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWR-USB Type C Connectors | – | – | – | – | Betriebstemperatur -40 °C up to +105 °C | Isolationswiderstand1000 MΩ | – | – | – | – | VerpackungTape and Reel | – | – | Interface typType C | GenderBuchse | Pins24 | MontageartTHR | Leiterplattendicke1.6 mm | Arbeitsspannung48 V (DC) | – | – | – | Nennstrom5000 mA | – | – | TypHorizontal |