IC manufacturers Renesas

IC manufacturers (104)

Renesas RZ/V2MA | Demoboard RZV2MA CPU_MODULE

Vision AI MPU With Renesas DRP-AI High-efficiency AI Accelerator and OpenCV Image Processing Accelerator Enabling Real-time Object Recognition

Overview

TopologyOther Topology
IC revision1.00

Description

This product is an evaluation kit equipped with Renesas Electronics MPU (RZ/V2MA). RZ/V2MA has a power-efficient AI accelerator (DRP-AI) and an OpenCV accelerator for AI pre- and post-processing. The evaluation kit is equipped with a microSD card slot, LPDDR4, eMMC, USB host peripherals, GigabitEthernet, etc., enabling the development of various embedded AIs that require image streaming through these interfaces. It is an open price.

Features

  • Vision and Artificial Intelligence
  • AI Accelerator; DRP-AI at 1.0 TOPS/W class
  • OpenCV Accelerator (DRP)
  • High Speed Interfaces
  • 1x Gigabit Ethernet
  • 1x USB3.1 Gen1 Host/Peripheral
  • 1x PCIe Gen 2 (2-lane)
  • 2x SDIO 3.0
  • 1x eMMC 4.5.1
  • CPU and DDR Memory Interfaces
  • 2x Cortex-A53 up to 1.0GHz
  • 32-bit LPDDR4-3200
  • Video and Graphics, Display
  • H.265/H.264 Multi Codec
  • Encoding; h.265 up to 2160p, h.264 up to 1080p
  • Decoding; h.265 up to 2160p, h.264 up to 1080p
  • Package: FCBGA, 15x15mm 0.5mm pitch

Typical applications

  • AI Accelerator: DRP-AI

Products

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Order Code
Data­sheet
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λDom typ.(nm)
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λPeak typ.(nm)
IV typ.(mcd)
VF typ.(V)
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50% typ.(°)
C
Tol. C
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RISO
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Z @ 100 MHz(Ω)
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IR 2(mA)
RDC max.(Ω)
Type
SamplesAvailability & Sample
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SPECWL-SMCC SMT Mono-color Chip LED Compact, 525 nm, Green
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]525 nm
Emitting ColorGreen 
Peak Wavelength [typ.]515 nm
Luminous Intensity [typ.]800 mcd
Forward Voltage [typ.]3.2 V
Chip TechnologyInGaN 
Viewing Angle Phi 0° [typ.]120 °
Size0402 
Operating Temperature -40 °C up to +85 °C
Length1 mm
Width0.5 mm
Height0.4 mm
PackagingTape and Reel 
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SPECWE-CBF SMT EMI Suppression Ferrite Bead, –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Size0402 
Operating Temperature -55 °C up to +125 °C
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Impedance @ 100 MHz10 Ω
Maximum Impedance15 Ω
Maximum Impedance800 MHz 
Rated Current 22000 mA
DC Resistance0.03 Ω
TypeHigh Current 
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SPECWCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
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SPECWCAP-CSGP MLCCs 6.3 V(DC), –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 µF
Capacitance±20% 
Rated Voltage6.3 V (DC)
Size0402 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor20 %
Insulation Resistance0.02 GΩ
Ceramic TypeX5R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
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