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Overview
| Topology | Other Topology |
Description
RSL10-COIN-GEVB is a coin cell operated ultra-low power Bluetooth beacon. The board incorporates a temperature sensor, NCT375, and RSL10, industry's lowest power Bluetooth 5 SoC. With the included CR2032 coin cell and an advertising packet being sent every 2 seconds, the device lasts over 6 years! The beacon follows Eddystone, an open beacon format from Google. A web URL and ambient temperature data embedded in the advertising packet can be read using Beacon Scanner or other freely available beacon scanning apps from the Android and iOS app stores.
Features
- Rx Sensitivity (Bluetooth Low Energy Mode, 1 Mbps): −94 dBm
- Data Rate: 62.5 to 2000 kbps
- Transmitting Power: −17 to +6 dBm
- Peak Rx Current = 5.6 mA (1.25 V VBAT)
- Peak Rx Current = 3.0 mA (3 V VBAT)
- Peak Tx Current (0 dBm) = 8.9 mA (1.25 V VBAT)
- Peak Tx Current (0 dBm) = 4.6 mA (3 V VBAT)
- Bluetooth 5 Certified with LE 2M PHY Support
- Arm Cortex−M3 Processor Clocked at up to 48 MHz
- LPDSP32 for Audio Codec
- Supply Voltage Range: 1.1 − 3.3 V
- Current Consumption (1.25 V VBAT):
- Deep Sleep, IO Wake−up: 50 nA
- Deep Sleep, 8 kB RAM Retention: 300 nA
- Audio Streaming at 7 kHz Audio BW: 1.8 mA RX, 1.8 mA TX
- Current Consumption (3 V VBAT):
- Deep Sleep, IO Wake−up: 25 nA
- Deep Sleep, 8 kB RAM Retention: 100 nA
- Audio Streaming at 7 kHz Audio BW: 0.9 mA RX, 0.9 mA TX
- 384 kB of Flash Memory
- Highly−integrated System−on−Chip (SoC)
- Supports FOTA (Firmware Over−The−Air) Updates
Typical applications
- IoT Edge-Node Applications / Bluetooth Low Energy Technology
- Energy Harvesting
- Wearables
More information
Products
Order Code | Datasheet | Simulation | Downloads | Status | Product series | C | Tol. C | VR(V (DC)) | Size | Operating Temperature | Q(%) | DF(%) | RISO | Ceramic Type | L(mm) | W(mm) | H(mm) | Fl(mm) | Packaging | L(µH) | IR(A) | ISAT1(A) | ISAT2(A) | RDC max.(mΩ) | fres(MHz) | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSGP MLCCs 10 V(DC), 100 pF, ±5% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 10 V(DC) | Capacitance100 pF | Capacitance±5% | Rated Voltage10 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Q-Factor1000 % | – | Insulation Resistance10 GΩ | Ceramic TypeNP0 Class I | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 10 V(DC), 10 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 10 V(DC) | Capacitance10 nF | Capacitance±10% | Rated Voltage10 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | – | Dissipation Factor5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 6.3 V(DC), 100 nF, ±20% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 6.3 V(DC) | Capacitance100 nF | Capacitance±20% | Rated Voltage6.3 V (DC) | Size0402 | Operating Temperature -55 °C up to +85 °C | – | Dissipation Factor10 % | Insulation Resistance1 GΩ | Ceramic TypeX5R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | – | – | – | – | – | – | |||||
 | WE-PMCI Power Molded Chip Inductor, –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWE-PMCI Power Molded Chip Inductor | – | – | – | Size201210 | Operating Temperature -40 °C up to +125 °C | – | – | – | – | Length2 mm | Width1.25 mm | Height1 mm | Pad Dimension0.5 mm | – | Inductance2.2 µH | Rated Current2 A | Saturation Current 11.2 A | Saturation Current 22.4 A | DC Resistance190 mΩ | Self Resonant Frequency45 MHz |