IC manufacturers NXP

IC manufacturers (103)

NXP MCXW727 | Demoboard MCXW72-LOC

Localization Board for MCX W72 Bluetooth Channel Sounding MCU

Overview

TopologyOther Topology
Input voltage1.8-3.6 V
IC revision1.0

Description

The Localization Board with MCX W72 is an evaluation kit for demonstrating Bluetooth® Channel Sounding for IoT applications. This board consists of two monopole on-board PCB antennas and an RF switch supporting antenna diversity, an integrated programmer/debugger and a mikroBUS™ header to easily add expansion boards. It provides the most suitable development and evaluation platform for the Bluetooth LE Channel Sounding feature, as it supports Antenna Switching by default.This Localization Board is based on the MCX W72 IoT multiprotocol MCU, and is ready for production channel sounding designs. The MCX W72 MCU is qualified against the Bluetooth Core 6.0 specification.

Features

ProcessorMCXW72-LOC evaluation board includes MCX W72 consisting of a 96 MHz Arm Cortex-M33 CPURadio controller based on Arm Cortex-M33 called Narrow Band Unit (NBU)Radio transceiver operates in the 2.4 GHz frequency bandSupporting GFSK modulations for Bluetooth Low Energy (LE) 6.0Bluetooth LE controller stackTransceiverConnectivityCAN connectivity supportLIN connectivity supportArduino shield socketmikroBUS socketDebugJTAG with SWDPower ManagementSupports all DC-DC configurationsWireless2.4 GHz Antenna SMT 5.0 X 2.0 X 1.1 (2450AT42A100)

Typical applications

  • Building I/O Controller, Building Safety Detectors, Building Security and Surveillance, Smart Lighting, Smart Lock, Smart Power Socket

Products

Order Code
Data­sheet
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Product series
C
Tol. C
VR(V (DC))
Size
Operating Temperature
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RISO
Ceramic Type
L(mm)
W(mm)
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Working Voltage(V (AC))
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Type
SamplesAvailability & Sample
SPECWCAP-CSGP MLCCs 50 V(DC), 4.7 nF, ±10%
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance4.7 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
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SPECWCAP-CSGP MLCCs 16 V(DC), 100 nF, ±10%
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
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SPECWCAP-CSGP MLCCs 10 V(DC), 4.7 µF, ±20%
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance4.7 µF
Capacitance±20% 
Rated Voltage10 V (DC)
Size0603 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Insulation Resistance0.02 GΩ
Ceramic TypeX5R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
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SPECWE-CBF SMT EMI Suppression Ferrite Bead, –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Size0603 
Operating Temperature -55 °C up to +125 °C
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.3 mm
MountSMT 
Rated Current800 mA
Impedance @ 100 MHz600 Ω
Maximum Impedance800 Ω
Maximum Impedance200 MHz 
Rated Current 21000 mA
DC Resistance0.2 Ω
TypeHigh Current 
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SPECWR-PHD Pin Header, –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Product seriesWR-PHD Pin Header
Operating Temperature -40 °C up to +105 °C
Insulation Resistance500 MΩ
Length6.35 mm
PackagingBox 
Pins10 
MountTHT 
Rated Current1000 mA
Working Voltage100 V (AC)
TypeStraight 
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