Topology | FPGA |
IC revision | Plus |
Easy-to-use, low cost breakout board for evaluation and development – Enables the broadest capability for development and uses the 36-ball WLCSP highest I/O package, high-density silicon iCE5LP4K.Rapid prototyping of user functions – Each I/O is made available via a header to facilitate rapid prototyping of user functions, and the board combines an RGB LED, a high current torch LED and an infrared LED for easy evaluation and development of LED functions.Effortless connectivity and simple programming – the board is powered and programmed via a simple USB mini cable, and comes preloaded with RGB LED demonstration code and a software GUI. Diamond programmer software can be used to reprogram the on-board SPI Flash with your customized code. The iCEcube2 software can be used to develop your own design. Both Diamond Programmer and iCEcube2 are available for free download.
Order Code | Datasheet | Simulation | |
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![]() | 150060BS75000 | SPEC | |
![]() | 150060GS75000 | SPEC | |
![]() | 150060YS75000 | SPEC | |
![]() | 150060SS75000 | SPEC | |
![]() | 742792651 | SPEC | |
![]() | 150141M173100 | SPEC | – |
![]() | 885012005058 | SPEC | |
![]() | 885012105010 | SPEC | |
![]() | 885012105012 | SPEC | |
![]() | 885012105016 | SPEC | |
![]() | 885012206048 | SPEC | |
![]() | 885012208093 | SPEC | |
![]() | 62101021921 | SPEC | – |
![]() | 62102021921 | SPEC | – |
![]() | 61001021121 | SPEC PCN pendingDue to a pending PCN, a modification of the component will be implemented soon. Please find the PCN below. If you have further questions please get in contact with our sales staff. | – |
![]() | 62000311121 | SPEC | – |
![]() | 65100516121 | SPEC | – |
Samples |
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Order Code | Datasheet | Simulation | Downloads | Status | Product series | λDom typ. (nm) | Emitting Color | λPeak typ. (nm) | λPeak B typ. (nm) | λPeak G typ. (nm) | λPeak R typ. (nm) | λDom B typ. (nm) | λDom G typ. (nm) | λDom R typ. (nm) | IV typ. (mcd) | IV B typ. (mcd) | IV G typ. (mcd) | IV R typ. (mcd) | VF typ. (V) | VF B typ. (V) | VF G typ. (V) | VF R typ. (V) | Chip Technology | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Size | Operating Temperature | Q (%) | DF (%) | RISO | Ceramic Type | L (mm) | W (mm) | Fl (mm) | Application | Interface Type | Mount | IR (mA) | Working Voltage (V (AC)) | Z @ 100 MHz (Ω) | Zmax (Ω) | Test Condition Zmax | IR 2 (mA) | RDC max. (Ω) | Type | Pins (pcs) | Rows | H (mm) | Gender | IR (mA) | Packaging | Samples |
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