IC manufacturers Infineon Technologies

IC manufacturers (103)

Infineon Technologies IRSM505-084 | Demoboard EVAL-M1-05-84D

EVAL-M1-05-84D User Manual iMOTION™ Modular Application Design Kit

Overview

TopologyOther Topology
IC revision2.1

Description

The EVAL-M1-05-84D evaluation board is a part of the iMOTION™ Modular Application Design Kit for drives (iMOTION™ MADK). The MADK-platform is intended to use various power stages with different control boards. These boards can easily be interfaced through the 20 pin iMOTION™ MADK-M1 interface connector. This evaluation board is designed to give comprehensible solutions of a power stage featuring CIPOS™ Micro. The board is equipped with all assembly groups for sensor less field oriented control (FOC). It provides a singlephase AC-connector, rectifier, DC-link and 3-phase output for power. It contains emitter-shunts for current sensing and a voltage divider for DC-link voltage measurement. The EVAL-M1-05-84D evaluation board is available from Infineon. The features of this board are described in the design feature chapter of this document, whereas the remaining paragraphs provide information to enable the customers to copy, modify and qualify the design for production according to their own specific requirements. Environmental conditions were considered in the design of the EVAL-M1-05-84D. The design was tested as described in this document but not qualified regarding safety requirements or manufacturing and operation over the whole operating temperature range or lifetime. The boards provided by Infineon are subject to functional testing only. Evaluation boards are not subject to the same procedures as regular products regarding Returned Material Analysis (RMA), Process Change Notification (PCN) and Product Discontinuation (PD). Evaluation boards are intended to be used under laboratory conditions by specialists only.

Features

  • 3-phase inverter including high voltage gate drivers
  • Integrated bootstrap functionality
  • Trench FREDFET with RDS(on) of 0.45 Ω @ 25°C
  • Under voltage lockout for all channels
  • Matched propagation delay for all channels
  • Temperature feedback via NTC applicable for IRSM505-084
  • Optimized dV/dt for loss and EMI trade off
  • 3.3 V logic compatible and advanced input filter
  • Possibility to choose single shunt or leg shunt current sensing
  • Driver tolerant to negative transient voltage
  • Isolation 1900 Vrms, 1min
  • Certified by UL file number E252584

Typical applications

  • Fans and pumps
  • Dishwasher / Refrigerator / Housing Appliance

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
Pins
PCB/Cable/Panel
Modularity
Type
Wire Section
λDom typ.(nm)
Emitting Color
λPeak typ.(nm)
IV typ.(mcd)
VF typ.(V)
Chip Technology
50% typ.(°)
C
VR(V (AC))
Safety Class
dV/dt(V/µs)
DF @ 1 kHz(%)
RISO
Pitch(mm)
L(mm)
W(mm)
H(mm)
Packaging
Tol. C
Size
Operating Temperature
Q(%)
DF(%)
Ceramic Type
Fl(mm)
Endurance(h)
IRIPPLE(mA)
ILeak(µA)
Ø D(mm)
Mount
G(mm)
IR(A)
Working Voltage(V (AC))
Samples
WR-TBL Series 2165S - 5.08 mm Horizontal Entry Modular w. Rising Cage Clamp, 3, Rising Cage Clamp
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pins
PCB/Cable/PanelPCB 
ModularityYes 
TypeHorizontal 
Wire Section 12 to 30 (AWG) 3.31 to 0.0509 (mm²)
Pitch5.08 mm
Length15.24 mm
PackagingBox 
Operating Temperature -30 °C up to +120 °C
MountTHT 
Rated Current24 A
Working Voltage250 V (AC)
WR-TBL Series 2169 - 7.50 mm Horizontal Entry Modular w. Rising Cage Clamp, 3, Rising Cage Clamp
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pins
PCB/Cable/PanelPCB 
ModularityYes 
TypeHorizontal 
Wire Section 12 to 30 (AWG) 3.31 to 0.0509 (mm²)
Pitch7.5 mm
Length22.5 mm
PackagingBox 
Operating Temperature -30 °C up to +120 °C
MountTHT 
Rated Current24 A
Working Voltage750 V (AC)
WR-PHD Socket Header - Dual, 20, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pins20 
TypeAngled 
Insulation Resistance1000 MΩ
Pitch2.54 mm
Length25.9 mm
PackagingTray 
Operating Temperature -40 °C up to +105 °C
MountTHT 
Rated Current3 A
Working Voltage250 V (AC)
WCAP-FTX2 Film Capacitors, –, Across the mains
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Rated Voltage275 V (AC)
Safety ClassX2 
Rate of Voltage Rise300 V/µs
Dissipation Factor0.1 %
Insulation Resistance30 GΩ
Pitch15 mm
Length18 mm
Width6 mm
Height12 mm
PackagingCarton 
Capacitance±10% 
SizePitch 15 mm 
Operating Temperature -40 °C up to +105 °C
MountBoxed THT 
Pin length4 mm
WL-TMRW THT Mono-color Round Waterclear, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]621 nm
Emitting ColorRed 
Peak Wavelength [typ.]628 nm
Luminous Intensity [typ.]2600 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]30 °
Length3 mm
Width3 mm
Height5.3 mm
PackagingBulk 
Size3 mm 
Operating Temperature -40 °C up to +85 °C
MountTHT 
WCAP-ATG5 Aluminum Electrolytic Capacitors, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance220 µF
Rated Voltage35 V (AC)
Pitch3.5 mm
Length11.5 mm
PackagingAmmopack 
Capacitance±20% 
Dissipation Factor12 %
Endurance 2000
Ripple Current255 mA
Leakage Current77 µA
Diameter8 mm
WCAP-ATG5 Aluminum Electrolytic Capacitors, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 µF
Rated Voltage400 V (AC)
Pitch7.5 mm
Length31.5 mm
PackagingAmmopack 
Capacitance±20% 
Dissipation Factor15 %
Endurance 2000
Ripple Current520 mA
Leakage Current1200 µA
Diameter16 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 nF
Rated Voltage50 V (AC)
Insulation Resistance10 GΩ
Length2 mm
Width1.25 mm
Height0.8 mm
Packaging7" Tape & Reel 
Capacitance±5% 
Size0805 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Ceramic TypeNP0 Class I 
Pad Dimension0.5 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 nF
Rated Voltage50 V (AC)
Insulation Resistance10 GΩ
Length2 mm
Width1.25 mm
Height0.8 mm
Packaging7" Tape & Reel 
Capacitance±5% 
Size0805 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Ceramic TypeNP0 Class I 
Pad Dimension0.5 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Rated Voltage25 V (AC)
Insulation Resistance0.5 GΩ
Length2 mm
Width1.25 mm
Height1.25 mm
Packaging7" Tape & Reel 
Capacitance±10% 
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Ceramic TypeX7R Class II 
Pad Dimension0.5 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Rated Voltage50 V (AC)
Insulation Resistance5 GΩ
Length2 mm
Width1.25 mm
Height0.8 mm
Packaging7" Tape & Reel 
Capacitance±10% 
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.5 mm
WCAP-CSGP MLCCs 6.3 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 µF
Rated Voltage6.3 V (AC)
Insulation Resistance0.01 GΩ
Length2 mm
Width1.25 mm
Height1.25 mm
Packaging7" Tape & Reel 
Capacitance±20% 
Size0805 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor15 %
Ceramic TypeX5R Class II 
Pad Dimension0.5 mm