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EPC EPC2012C | Demoboard EPC9052 Development Board

Class-E Wireless Power Amplifier

Overview

TopologyWireless Power Transfer
Input voltage7-12 V
Switching frequency15000 kHz
Output 11 A

Description

The EPC9052 is a high efficiency, differential mode Class-E amplifierdevelopment board that can operate up to 15 MHz. Higher frequencyoperation may be possible but is currently under evaluation. The purposeof this development board is to simplify the evaluation process of Class-Eamplifier technology using eGaN® FETs by allowing engineers to easilymount all the critical class-E components on a single board that can beeasily connected into an existing system.This board may also be used for applications where a low side switch isutilized. Examples include, and are not limited to, push-pull converters,current-mode Class D amplifiers, common source bi-directional switch,and generic high voltage narrow pulse width applications such as LiDAR.The amplifier board features the 200 V rated EPC2012C eGaN FET. Theamplifier is set to operate in differential mode and can be re-configured tooperate in single-ended mode and includes the gate driver and logicsupply regulator.For more information on the EPC2012C eGaN FETs please refer to thedatasheet available from EPC at www.epc-co.com. The datasheet shouldbe read in conjunction with this quick start guide.

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
C
Tol. C
VR(V (DC))
Size
Operating Temperature
Q(%)
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
Pins
Type
Mount
IR(A)
Working Voltage(V (AC))
IR(A)
PCB/Cable/Panel
Samples
WCAP-CSGP MLCCs 50 V(DC), 22 pF, ±5%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance22 pF
Capacitance±5% 
Rated Voltage50 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Q-Factor840 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 16 V(DC), 100 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 25 V(DC), 1 µF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WR-PHD Pin Header - Single, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
Length2.54 mm
PackagingBag 
Pins
TypeStraight 
MountTHT 
Rated Current3 A
Working Voltage250 V (AC)
WR-PHD Pin Header - Single, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
Length5.08 mm
PackagingBag 
Pins
TypeStraight 
MountTHT 
Rated Current3 A
Working Voltage250 V (AC)
WR-WTB 3.96 mm Male Header, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
Length7.92 mm
PackagingBag 
Pins
TypeVertical 
MountTHT 
Rated Current7 A
Working Voltage250 V (AC)
Rated Current7 A
PCB/Cable/PanelPCB