| Topology | Other Topology |
| IC revision | 1 |
The HF board includes the ICeGaN, the half-bridge gate driver IC, current transformers, and the heatsink which is mounted on the top side of the ICeGaN.
The PCB thickness of this HF daughterboard is 1.6 mm, with 2 oz copper thickness. A thinner PCB is not recommended asit could bend, leading to poor thermal connection hence an increase in the operating temperature of the ICeGaN devices.
Order Code | Datasheet | Simulation | Downloads | Status | Product series | C | Tol. C | VR(V (DC)) | Size | Operating Temperature | Q(%) | DF(%) | RISO | Ceramic Type | L(mm) | W(mm) | H(mm) | Fl(mm) | Packaging | Z @ 100 MHz(Ω) | Zmax(Ω) | Test Condition Zmax | IR 2(mA) | RDC max.(Ω) | Type | L(µH) | n | IR(mA) | ∫Udt(µVs) | VT(V (AC)) | RDC 1(mΩ) | RDC 2(Ω) | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSGP MLCCs 50 V(DC), 100 pF, ±5% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 50 V(DC) | Capacitance100 pF | Capacitance±5% | Rated Voltage50 V (DC) | Size0603 | Operating Temperature -55 °C up to +125 °C | Q-Factor1000 % | – | Insulation Resistance10 GΩ | Ceramic TypeNP0 Class I | Length1.6 mm | Width0.8 mm | Height0.8 mm | Pad Dimension0.4 mm | Packaging7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 25 V(DC), 100 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | Capacitance100 nF | Capacitance±10% | Rated Voltage25 V (DC) | Size0603 | Operating Temperature -55 °C up to +125 °C | – | Dissipation Factor3.5 % | Insulation Resistance5 GΩ | Ceramic TypeX7R Class II | Length1.6 mm | Width0.8 mm | Height0.8 mm | Pad Dimension0.4 mm | Packaging7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 25 V(DC), 100 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | Capacitance100 nF | Capacitance±10% | Rated Voltage25 V (DC) | Size0805 | Operating Temperature -55 °C up to +125 °C | – | Dissipation Factor3.5 % | Insulation Resistance5 GΩ | Ceramic TypeX7R Class II | Length2 mm | Width1.25 mm | Height0.8 mm | Pad Dimension0.5 mm | Packaging7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
![]() | WE-CBF SMT EMI Suppression Ferrite Bead, –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWE-CBF SMT EMI Suppression Ferrite Bead | – | – | – | Size0805 | Operating Temperature -55 °C up to +125 °C | – | – | – | – | Length2 mm | Width1.2 mm | Height0.9 mm | Pad Dimension0.5 mm | – | Impedance @ 100 MHz1000 Ω | Maximum Impedance1000 Ω | Maximum Impedance100 MHz | Rated Current 21000 mA | DC Resistance0.3 Ω | TypeHigh Current | – | – | Rated Current800 mA | – | – | – | – | ||||
![]() | WE-CST Current Sense Transformer, –, – | Simulation– | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWE-CST Current Sense Transformer | – | – | Rated Voltage80 V (DC) | SizeEE5 | Operating Temperature -40 °C up to +125 °C | – | – | – | – | Length7.7 mm | Width6.9 mm | Height5.33 mm | – | – | – | – | – | – | – | – | Inductance2000 µH | Turns Ratio1:100 | Rated Current20000 mA | Voltage-µSecond50 µVs | Insulation Test Voltage500 V (AC) | DC Resistance 10.75 mΩ | DC Resistance 25.5 Ω |