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Overview
| Topology | Other Topology |
| IC revision | 1 |
Description
The HF board includes the ICeGaN, the half-bridge gate driver IC, current transformers, and the heatsink which is mounted on the top side of the ICeGaN.
Features
The PCB thickness of this HF daughterboard is 1.6 mm, with 2 oz copper thickness. A thinner PCB is not recommended asit could bend, leading to poor thermal connection hence an increase in the operating temperature of the ICeGaN devices.
More information
Products
| Order Code | Datasheet | Simulation | Downloads | Status | Product series | C | Tol. C | VR (V (DC)) | Size | Operating Temperature | Q (%) | RISO | Ceramic Type | L (mm) | W (mm) | H (mm) | Fl (mm) | Packaging | Z @ 100 MHz (Ω) | Zmax (Ω) | Test Condition Zmax | IR 2 (mA) | RDC max. (Ω) | Type | L (µH) | n | IR (mA) | ∫Udt (µVs) | VT (V (AC)) | RDC 1 (mΩ) | RDC 2 (Ω) | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 885012006057 | SPEC | 9 files | Active i| Production is active. Expected lifetime: >10 years. | WCAP-CSGP MLCCs 50 V(DC) | 100 pF | ±5% | 50 | 0603 | -55 °C up to +125 °C | 1000 | 10 GΩ | NP0 Class I | 1.6 | 0.8 | 0.8 | 0.4 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
 | 742792096 | SPEC | 9 files | Active i| Production is active. Expected lifetime: >10 years. | WE-CBF SMT EMI Suppression Ferrite Bead | – | – | – | 0805 | -55 °C up to +125 °C | – | – | – | 2 | 1.2 | 0.9 | 0.5 | – | 1000 | 1000 | 100 MHz | 1000 | 0.3 | High Current | – | – | 800 | – | – | – | – | ||
 | 749251100 | SPEC | – | 9 files | Active i| Production is active. Expected lifetime: >10 years. | WE-CST Current Sense Transformer | – | – | 80 | EE5 | -40 °C up to +125 °C | – | – | – | 7.7 | 6.9 | 5.33 | – | – | – | – | – | – | – | – | 2000 | 1:100 | 20000 | 50 | 500 | 0.75 | 5.5 |
| Samples |
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| Order Code | Datasheet | Simulation | Downloads | Status | Product series | C | Tol. C | VR (V (DC)) | Size | Operating Temperature | Q (%) | RISO | Ceramic Type | L (mm) | W (mm) | H (mm) | Fl (mm) | Packaging | Z @ 100 MHz (Ω) | Zmax (Ω) | Test Condition Zmax | IR 2 (mA) | RDC max. (Ω) | Type | L (µH) | n | IR (mA) | ∫Udt (µVs) | VT (V (AC)) | RDC 1 (mΩ) | RDC 2 (Ω) | Samples |
|---|
