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Analog Devices ADM3055E | Demoboard EVAL-ADM3055E-ARDZ
5 kV rms/3 kV rms, Signal and Power Isolated, CAN Transceivers for CAN FD
Overview
| Topology | Other Topology |
Description
The ADM3055E/ADM3057E are 5 kV rms and 3 kV rms isolated controller area network (CAN) physical layer transceivers with integrated isolated dc-to-dc converters. The ADM3055E/ ADM3057E meet flexible data rate (CAN FD) requirements for operation to 5 Mbps and higher and comply with the ISO 11898-2: 2016 standard. The ADM3055E/ADM3057E are capable of supporting data rates as high as 12 Mbps. The devices employ Analog Devices, Inc., iCoupler® technology to combine a 3-channel isolator, a CAN transceiver, and an Analog Devices isoPower® dc-to-dc converter into a single, surfacemount, small outline integrated circuit (SOIC) package. The devices are powered by a single 5 V supply, realizing a fully isolated solution for CAN and CAN FD. Radiated emissions from the high frequency switching of the dc-to-dc convertors are kept below EN 55022 Class B limits by continuous adjustments to the switching frequency. The ADM3055E/ADM3057E provide complete isolation between the CAN controller and physical layer bus. Safety and regulatory approvals (pending) for 5 kV rms isolation voltage, 10 kV surge test, and 8.3 mm creepage and clearance ensure the ADM3055E meets application reinforced isolation requirements. The ADM3057E has an isolation voltage of 3 kV rms and 7.8 mm creepage in a 20-lead, wide body SOIC. Low propagation delays through the isolation support longer bus cables. Slope control mode is available for standard CAN at low data rates. Standby mode minimizes power consumption when the bus is idle or if the node goes offline. Silent mode allows the TXD input to be ignored for listen only mode. Dominant timeout functionality protects against bus lock up in a fault condition. The current limiting and thermal shutdown features protect against output short circuits. The devices are fully specified over an industrial temperature range of −40°C to +105°C.
Features
- Supports CAN Flexible Data rate (CAN FD) communications port with an integrated isolated dc-to-dc converter
- Auxiliary isolated digital channel for runtime configuration of the bus termination
- Reduced power standby state and remote wake-up request supported
- Form Factor Compatible with Arduino
Typical applications
- CANOpen, DeviceNet, and other CAN bus implementations, Industrial automation, Process control and building control, Transport and infrastructure
More information
Products
| Order Code | Datasheet | Simulation | Downloads | Product series | Application | PCB/Cable/Panel | Modularity | Wire Section | λDom typ. (nm) | Emitting Color | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chip Technology | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Size | DF (%) | RISO | Ceramic Type | L (mm) | W (mm) | Fl (mm) | Pins | Rows | H (mm) | Gender | Type | IR (A) | Packaging | Mount | Operating Temperature | Working Voltage (V (AC)) | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 691213710003 | SPEC | – | 6 files | WR-TBL Series 213 - 5.00 mm Horiz.l Entry Modular | Rising Cage Clamp | PCB | Yes | 26 to 16 (AWG) 0.5 to 1.5 (mm²) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 15 | – | – | 3 | – | – | – | Horizontal | 10 | Box | THT | -40 °C up to +105 °C | 250 | |
 | 150060GS75000 | SPEC | 25 files RAY files
| WL-SMCW SMT Mono-color Chip LED Waterclear | – | – | – | – | 525 | Green | 515 | 430 | 3.2 | InGaN | 140 | – | – | – | 0603 | – | – | – | 1.6 | 0.8 | – | – | – | 0.7 | – | – | – | Tape and Reel | SMT | -40 °C up to +85 °C | – | ||
 | 885012206014 | SPEC | 8 files | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | – | – | – | 10 nF | ±10% | 10 | 0603 | 5 | 10 GΩ | X7R Class II | 1.6 | 0.8 | 0.4 | – | – | 0.8 | – | – | – | 7" Tape & Reel | – | -55 °C up to +125 °C | – | ||
| 885012206046 | SPEC | 8 files | WCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | – | – | – | – | 100 nF | ±10% | 16 | 0603 | 3.5 | 5 GΩ | X7R Class II | 1.6 | 0.8 | 0.4 | – | – | 0.8 | – | – | – | 7" Tape & Reel | – | -55 °C up to +125 °C | – | ||
| 885012206073 | SPEC | 8 files | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | 220 nF | ±10% | 25 | 0603 | 3.5 | 2.3 GΩ | X7R Class II | 1.6 | 0.8 | 0.4 | – | – | 0.8 | – | – | – | 7" Tape & Reel | – | -55 °C up to +125 °C | – | ||
| 885012207026 | SPEC | 8 files | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | – | – | – | 10 µF | ±10% | 10 | 0805 | 10 | 0.01 GΩ | X7R Class II | 2 | 1.25 | 0.5 | – | – | 1.25 | – | – | – | 7" Tape & Reel | – | -55 °C up to +125 °C | – | ||
| 885012207090 | SPEC | 8 files | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | 4.7 nF | ±10% | 50 | 0805 | 2.5 | 10 GΩ | X7R Class II | 2 | 1.25 | 0.5 | – | – | 0.8 | – | – | – | 7" Tape & Reel | – | -55 °C up to +125 °C | – | ||
 | 618009231221 | SPEC | – | 6 files | WR-DSUB 8.08 mm Male Angled PCB Connector w. Hex Screw | – | PCB | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 5000 MΩ | – | 30.8 | – | – | 9 | – | – | Male | Angled | 3 | Tray | – | -55 °C up to +105 °C | 125 | |
 | 61300211121 | SPEC | – | 6 files | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1000 MΩ | – | 5.08 | – | – | 2 | Single | – | Pin Header | Straight | 3 | Bag | THT | -40 °C up to +105 °C | 250 | |
| 61300311121 | SPEC | – | 6 files | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1000 MΩ | – | 7.62 | – | – | 3 | Single | – | Pin Header | Straight | 3 | Bag | THT | -40 °C up to +105 °C | 250 | |
 | 61300821121 | SPEC | – | 6 files | WR-PHD 2.54 mm THT Dual Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1000 MΩ | – | 10.16 | – | – | 8 | Dual | – | Pin Header | Straight | 3 | Bag | THT | -40 °C up to +105 °C | 250 |
| Samples |
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| Order Code | Datasheet | Simulation | Downloads | Product series | Application | PCB/Cable/Panel | Modularity | Wire Section | λDom typ. (nm) | Emitting Color | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chip Technology | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Size | DF (%) | RISO | Ceramic Type | L (mm) | W (mm) | Fl (mm) | Pins | Rows | H (mm) | Gender | Type | IR (A) | Packaging | Mount | Operating Temperature | Working Voltage (V (AC)) | Samples |
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