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Texas Instruments UCC21710 | Demoboard TIDA-010054
Bi-directional, dual active bridge reference design for level 3 electric vehicle charging stations
Details
| Topologie | Gegentaktwandler (Halbbrücken) |
| Eingangsspannung | 700-800 V |
| Ausgang 1 | 500 V / 26 A |
| IC-Revision | April 2024 |
Beschreibung
This reference design provides an overview on the implementation of a single-phase dual active bridge (DAB) DC/DC converter. DAB topology offers advantages like soft-switching commutations, a decreased number of devices and high efficiency. The design is beneficial where power density, cost, weight, galvanic isolation, high voltage conversion ratio and reliability are critical factors, making it ideal for EV charging stations and energy storage applications. Modularity and symmetrical structure in DAB allow for stacking converters to achieve high power throughput and facilitate a bidirectional mode of operation to support battery charging and discharging applications.
Eigenschaften
Smart Gate driver UCC21710 providing integrated protection for SiC MOSFETs
TMS320F280039 controller for implementation of digital controlPrimary voltage of 700V to 800V DC, secondary voltage of 350V to 500V DC (SPS) 250V to 500V (EPS)Achieves peak efficiency of 98.7% and full load efficiency of 98%PWM switching frequency of 100kHz and reduced transformer size enabled by planar magneticsMaximum power output of 10kW
Typische Anwendungen
- Hybrid, electric and powertrain systems
- Power conversion system (PCS)
- DC fast charging power module
- DC fast charging station
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | Fl (mm) | Verpackung | Gender | Arbeitsspannung (V (AC)) | Raster (mm) | Reihen | W (mm) | H (mm) | IR 1 (A) | Ti | Tl (mm) | Pins (pcs) | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR (mA) | Z @ 1 GHz (Ω) | Typ | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 150060VS75000 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | 570 | Hellgrün | 572 | 40 | 2 | AlInGaP | 140 | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | 1.6 | – | Tape and Reel | – | – | – | – | 0.8 | 0.7 | – | – | – | – | – | – | – | – | – | – | ||
 | 74279228260 | SPEC | 10 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-MPSB EMI Multilayer Power Suppression Bead | – | – | – | – | – | – | – | – | – | – | 0603 | -55 °C up to +125 °C | – | – | – | 1.6 | 0.3 | – | – | – | – | – | 0.8 | 0.8 | – | – | – | – | 26 | 39 | 515 MHz | 6500 | 33 | Hochstrom | ||
 | 885012206095 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 100 nF | ±10% | 50 | 0603 | -55 °C up to +125 °C | 3 | 5 GΩ | X7R Klasse II | 1.6 | 0.4 | 7" Tape & Reel | – | – | – | – | 0.8 | 0.8 | – | – | – | – | – | – | – | – | – | – | ||
 | 61300211121 | SPEC | – | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD Pin Header - Single | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | 5.08 | – | Beutel | Stiftleiste | 250 | 2.54 | Single | – | – | – | – | – | 2 | – | – | – | 3000 | – | Gerade | |
 | 618009231121 | SPEC | – | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-DSUB PCB | – | – | – | – | – | – | – | – | – | – | – | -55 °C up to +105 °C | – | 5000 MΩ | – | 30.8 | – | Tray | Weiblich | 125 | 2.77 | – | – | – | 3 | – | – | 9 | – | – | – | 3000 | – | Abgewinkelt | |
 | 74650073R | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WP-THRBU REDCUBE THR with internal through-hole thread | – | – | – | – | – | – | – | – | – | – | – | -55 °C up to +150 °C | – | – | – | – | – | Tape and Reel | – | – | – | – | 7 | 3 | – | M3 | 2.5 | 4 | – | – | – | 50000 | – | – |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 150060VS75000 | SPEC | |
| 74279228260 | SPEC | |
| 885012206095 | SPEC | |
| 61300211121 | SPEC | – |
| 618009231121 | SPEC | – |
| 74650073R | SPEC | – |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | Fl (mm) | Verpackung | Gender | Arbeitsspannung (V (AC)) | Raster (mm) | Reihen | W (mm) | H (mm) | IR 1 (A) | Ti | Tl (mm) | Pins (pcs) | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR (mA) | Z @ 1 GHz (Ω) | Typ | Muster |
|---|
