IC-Hersteller Texas Instruments

IC-Hersteller (103)

Texas Instruments LMG2100R044 | Demoboard TIDA-010936

48V/16A small form factor three-phase GaN inverter reference design for integrated motor drives

Details

TopologieInverswandler
Eingangsspannung12-60 V
Schaltfrequenz40-100 kHz
Ausgang 148 V / 17 A
IC-RevisionA

Beschreibung

This reference design demonstrates a high-power density 12V to 60V 3-phase power stage using three LMG2100R044 100V, 35A GaN half-bridges with integrated GaN FETs, driver and bootstrap diode specifically for motor-integrated servo drives and robotics applications. Accurate phase-current sensing is achieved through the IN241A current sense amplifier, DC-link and phase voltages are also measured allowing validation of advanced sensorless designs, such as the InstaSPIN-FOC™. The design offers a TI BoosterPack compatible 3.3-V I/O interface to connect to a C2000™ MCU LaunchPad™ development kit or Sitara™ microcontrollers for quick and easy performance evaluation of our GaN technology.

Eigenschaften

High efficiency (99.3% peak) at 40kHz PWM enables operation at 25C ambient and up to 16Arms continuous current without heatsink
Small form factor GaN half-bridge power stage enables high power density and simplifies PCB layoutGaN half-bridge enables operation at higher PWM frequencies to help reduce DC-bus capacitor height while replacing electrolytics with ceramic capacitorsZero reverse recovery losses reduce switch node oscillations
Low dead time of 16.6ns minimize phase voltage distortions Precision phase current sense with ±33A range using 1-mΩ shunt and current sense amplifier with high PWM rejection

Typische Anwendungen

  • LLC converters
  • Power tools
  • Buck, boost, buck-boost converters
  • Telecom and server power
  • Motor drives
  • Solar inverters

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktserieλDom typ.
(nm)
FarbeλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie50% typ.
(°)
CTol. CVR
(V (DC))
BauformBetriebstemperaturDF
(%)
RISOKeramiktypL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
VerpackungL
(µH)
IRP,40K
(A)
ISAT,10%
(A)
ISAT,30%
(A)
fres
(MHz)
MontageartZ @ 100 MHz
(Ω)
Zmax
(Ω)
Testbedingung ZmaxIR 2
(mA)
RDC max.
(Ω)
Typ Muster
150060GS75000SPEC
26 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WL-SMCW SMT Mono-color Chip LED Waterclear 525 Grün 515 430 3.2 InGaN 140 0603 -40 °C up to +85 °C 1.6 0.8 0.7 Tape and Reel SMT
74279272SPEC
9 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WE-CBF SMT-Ferrit 0402 -55 °C up to +125 °C 1 0.5 0.5 0.25 SMT 300 400 380 MHz 700 0.8 Breitband
74437324220SPEC
9 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WE-LHMI SMT Speicherdrossel 4020 -40 °C up to +125 °C 4.45 4.06 1.8 22 1.3 1.45 2.35 14 SMT 0.5
885012206036SPEC
9 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 16 V(DC)2.2 nF ±10% 16 0603 -55 °C up to +125 °C 3.510 GΩ X7R Klasse II 1.6 0.8 0.8 0.4 7" Tape & Reel
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktserieλDom typ.
(nm)
FarbeλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie50% typ.
(°)
CTol. CVR
(V (DC))
BauformBetriebstemperaturDF
(%)
RISOKeramiktypL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
VerpackungL
(µH)
IRP,40K
(A)
ISAT,10%
(A)
ISAT,30%
(A)
fres
(MHz)
MontageartZ @ 100 MHz
(Ω)
Zmax
(Ω)
Testbedingung ZmaxIR 2
(mA)
RDC max.
(Ω)
Typ Muster