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STMicroelectronics STM32L4R9ZI | Demoboard STEVAL-STWINKT1B
STWIN SensorTile Wireless Industrial Node development kit and reference design for industrial IoT applications
Details
| Topologie | Sensors |
| IC-Revision | 4 |
Beschreibung
The STWIN SensorTile wireless industrial node (STEVAL-STWINKT1B) is a development kit and reference design that simplifies prototyping and testing of advanced industrial IoT applications such as condition monitoring and predictive maintenance. The kit features a core system board with a range of embedded industrial-grade sensors and an ultra-low-power microcontroller for vibration analysis of 9-DoF motion sensing data across a wide range of vibration frequencies, including very high frequency audio and ultrasound spectra, and high precision local temperature and environmental monitoring.The development kit is complemented with a rich set of software packages and optimized firmware libraries, as well as a cloud dashboard application, all provided to help speed up design cycles for end-to-end solutions.The kit supports Bluetooth® low energy wireless connectivity through an on-board module, and Wi-Fi connectivity through a special plugin expansion board (STEVAL-STWINWFV1). Wired connectivity is also supported via an on-board RS485 transceiver. The core system board also includes an STMod+ connector for compatible, low cost, small form factor daughter boards associated with the STM32 family, such as the LTE Cell pack.Apart from the core system board, the kit is provided complete with a 480 mAh Li-Po battery, an STLINK-V3MINI debugger and a plastic box.
Eigenschaften
- Multi-sensing wireless platform implementing vibration monitoring and ultrasound detection
- Updated version of STEVAL-STWINKT1, now including STSAFE-A110 populated, BlueNRG-M2SA module and IMP23ABSU MEMS microphone
- Built around STWIN core system board with processing, sensing, connectivity and expansion capabilities
- Ultra-low-power ARM Cortex-M4 MCU at 120 MHz with FPU, 2048 kbytes Flash memory (STM32L4R9)
- Micro SD Card slot for standalone data logging applications
- On-board Bluetooth® low energy v5.0 wireless technology and Wi-Fi (with STEVAL-STWINWFV1 expansion board), and wired RS485 and USB OTG connectivity
- Option to implement Authentication and Brand protection secure solution with STSAFE-A110
- Wide range of industrial IoT sensors:
- ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor (IIS3DWB)
- 3D accelerometer + 3D Gyro iNEMO inertial measurement unit (ISM330DHCX) with machine learning core
- ultra-low-power high performance MEMS motion sensor (IIS2DH)
- ultra-low-power 3-axis magnetometer (IIS2MDC)
- digital absolute pressure sensor (LPS22HH)
- relative humidity and temperature sensor (HTS221)
- low-voltage digital local temperature sensor (STTS751)
- industrial grade digital MEMS microphone (IMP34DT05)
- analog MEMS microphone with frequency response up to 80 kHz (IMP23ABSU)
- Modular architecture, expandable via on-board connectors:
- STMOD+ and 40-pin flex general purpose expansions
- 12-pin male plug for connectivity expansions
- 12-pin female plug for sensing expansions
- Other kit components:
- Li-Po battery 480 mAh
- STLINK-V3MINI debugger with programming cable
- Plastic box
Typische Anwendungen
- Condition monitoring
- Condition monitoring
Weiterführende Informationen
Artikeldaten
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR(V (DC)) | Bauform | Betriebstemperatur | DF(%) | RISO | Keramiktyp | L(mm) | B(mm) | H(mm) | Fl(mm) | Verpackung | L(µH) | IRP,40K(A) | ISAT,30%(A) | RDC typ.(mΩ) | fres(MHz) | VOP(V) | Montageart | Pins | Gender | Typ | Ausführung | Haltbarkeit | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSGP MLCCs 10 V(DC), 2.2 µF, ±20% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 10 V(DC) | Kapazität2.2 µF | Kapazität±20% | Nennspannung10 V (DC) | Bauform0402 | Betriebstemperatur -55 °C up to +85 °C | Verlustfaktor10 % | Isolationswiderstand0.05 GΩ | KeramiktypX5R Klasse II | Länge1 mm | Breite0.5 mm | Höhe0.5 mm | Pad Dimension0.25 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | |||||
 | WE-MAPI SMT-Speicherdrossel, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWE-MAPI SMT-Speicherdrossel | – | – | – | Bauform2510 | Betriebstemperatur -40 °C up to +125 °C | – | – | – | Länge2.5 mm | Breite2 mm | Höhe1 mm | – | – | Induktivität2.2 µH | Performance Nennstrom2.2 A | Sättigungsstrom @ 30%3.55 A | Gleichstromwiderstand147 mΩ | Eigenresonanzfrequenz60 MHz | Betriebsspannung80 V | MontageartSMT | Pins2 | – | – | – | – | ||||
 | WR-CRD SD Card Connectors, –, – | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWR-CRD SD Card Connectors | – | – | – | – | Betriebstemperatur -25 °C up to +85 °C | – | Isolationswiderstand1000 MΩ | – | – | – | – | – | VerpackungTape and Reel & Mylar | – | – | – | – | – | – | MontageartSMT | Pins8 | GenderBuchse | TypPush & Push | AusführungMit Kartenerkennung | Haltbarkeit10 000 Mating cycles |