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STMicroelectronics A2F12M12W2-F1 | Demoboard STDES-DABBIDIR
25 kW, dual active bridge bidirectional power converter for EV charging and battery energy storage systems
Details
| Topologie | LLC Resonanzwandler |
| Eingangsspannung | 800 V |
| Ausgang 1 | 800 V |
| IC-Revision | 1.0 |
Beschreibung
The STDES-DABBIDIR provides a complete solution for a bidirectional DC-DC power converter.A dual active bridge topology based on an ACEPACK 2 SiC power module is proposed.The STM32G474RE MCU, enabling digital-intensive power control and optimized for mixed-signal applications, is used.Thanks to the latest generation SiC power module and high-frequency operation (100 kHz), high performance and design optimization are reached.Soft switching DAB behavior is managed by adaptive modulation techniques, according to the load/voltage variation.Bidirectional mode operation supports V2G and V2L implementations as well as UPS and battery energy storage applications.
Eigenschaften
- Main power board
- Driver board (1xHV side 2xLV side)
- STM32G474RET3 control board
- Dual active bridge DC-DC power converter:
- Nominal DC input voltage: 800 V
- Nominal DC output voltage: 400 V
- Nominal power: 25 kW
- Switching frequency: 100 kHz
- Peak efficiency: 98.4%
- ACEPACK 2 SiC power module to optimize power section integration and thermal dissipation
- Bidirectional digital power control
- Extended soft switching mode, enabled by sophisticated modulation techniques
- Passive elements weight and size reduction thanks to high frequency SiC MOSFETs operation
- STGAP2SICS galvanic isolated gate driver for SiC
- STM32G474RET3 MCU for full digital solution
- Inrush current control and soft startup
Typische Anwendungen
- Dual Active Bridge Bidirectional power converter, UPS
- Power converter for EV charging
- battery energy storage
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q (%) | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Pins | Reihen | H (mm) | Gender | IR (mA) | Verpackung | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 150080GS75000 | SPEC | 7 Dateien | WL-SMCW SMT Mono-color Chip LED Waterclear | 525 | Grün | 515 | 450 | 3.2 | InGaN | 140 | – | – | – | 0805 | -40 °C up to +85 °C | – | – | – | – | 2 | 1.25 | – | – | – | – | – | – | – | – | – | 0.7 | – | – | Tape and Reel | ||
| 150080RS75000 | SPEC | 7 Dateien | WL-SMCW SMT Mono-color Chip LED Waterclear | 625 | Rot | 630 | 150 | 2 | AlInGaP | 140 | – | – | – | 0805 | -40 °C up to +85 °C | – | – | – | – | 2 | 1.25 | – | – | – | – | – | – | – | – | – | 0.7 | – | – | Tape and Reel | ||
 | 74279262 | SPEC | 9 Dateien | WE-CBF SMT-Ferrit | – | – | – | – | – | – | – | – | – | – | 0603 | -55 °C up to +125 °C | – | – | – | – | 1.6 | 0.8 | 0.3 | 120 | 200 | 510 MHz | 1350 | 0.3 | Breitband | – | – | 0.8 | – | 500 | – | ||
 | 742792021 | SPEC | 9 Dateien | WE-CBF SMT-Ferrit | – | – | – | – | – | – | – | – | – | – | 0805 | -55 °C up to +125 °C | – | – | – | – | 2 | 1.2 | 0.5 | 22 | 40 | 1000 MHz | 6000 | 0.008 | High Current | – | – | 0.9 | – | 4500 | – | ||
 | 885012006057 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 100 pF | ±5% | 50 | 0603 | -55 °C up to +125 °C | 1000 | – | 10 GΩ | NP0 Klasse I | 1.6 | 0.8 | 0.4 | – | – | – | – | – | – | – | – | 0.8 | – | – | 7" Tape & Reel | ||
| 885012206046 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | 100 nF | ±10% | 16 | 0603 | -55 °C up to +125 °C | – | 3.5 | 5 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | – | – | – | – | – | – | – | – | 0.8 | – | – | 7" Tape & Reel | ||
| 885012207102 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 470 nF | ±10% | 50 | 0805 | -55 °C up to +125 °C | – | 3 | 1.1 GΩ | X7R Klasse II | 2 | 1.25 | 0.5 | – | – | – | – | – | – | – | – | 1.25 | – | – | 7" Tape & Reel | ||
 | 62201021121 | SPEC | – | 6 Dateien | WR-PHD 1.27 mm THT Dual Pin Header | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | 500 MΩ | – | 6.35 | – | – | – | – | – | – | – | Gerade | 10 | Dual | – | Pin Header | 1000 | Karton | |
 | 61300411121 | SPEC | – | 6 Dateien | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | 10.16 | – | – | – | – | – | – | – | Gerade | 4 | Single | – | Pin Header | 3000 | Beutel |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 150080GS75000 | SPEC | |
| 150080RS75000 | SPEC | |
| 74279262 | SPEC | |
| 742792021 | SPEC | |
| 885012006057 | SPEC | |
| 885012206046 | SPEC | |
| 885012207102 | SPEC | |
| 62201021121 | SPEC | – |
| 61300411121 | SPEC | – |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q (%) | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Pins | Reihen | H (mm) | Gender | IR (mA) | Verpackung | Muster |
|---|