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Details
| Topologie | Sonstige Topologie |
| IC-Revision | A02 |
Beschreibung
The BGM220 Explorer Kit is an ultra-low cost, small form factor development and evaluation platform for the BGM220P Bluetooth Module.The kit features a USB interface, an on-board SEGGER J-Link debugger, one user-LED and button, and support for hardware add-on boards via a mikroBus socket and a Qwiic connector. The hardware add-on support allows developers to create and prototype applications using a virtually endless combination of off-the-shelf boards from mikroE, sparkfun, AdaFruit, and Seeed Studios
Eigenschaften
- User LED and push button
- 20-pin 2.54 mm breakout pads
- mikroBUS™ socket
- Qwiic® connector
- SEGGER J-Link on-board debugger
- Virtual COM port
- Packet Trace Interface (PTI)
- USB-powered.
Weiterführende Informationen
Artikeldaten
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | IR(mA) | RDC(Ω) | Z @ 100 MHz(Ω) | Zmax(Ω) | Testbedingung Zmax | IR 2(mA) | Testbedingung IR 2 | Z @ 1 GHz(Ω) | Typ | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | WE-TMSB SMT-Ferrit, 200 mA, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWE-TMSB SMT-Ferrit | Nennstrom200 mA | – | Impedanz @ 100 MHz240 Ω | Maximale Impedanz460 Ω | Maximale Impedanz536 MHz | Nennstrom 2300 mA | Nennstrom 2ΔT = 40 K | Impedanz @ 1 GHz342 Ω | TypBreitband | ||||
 | WE-CBA SMT EMI Suppression Ferrite Bead, 400 mA, 0.3 Ω | Downloads10 Dateien RF & Microwave SimulationsmodelleAlle 10 Dateien als ZIP herunterladen | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWE-CBA SMT EMI Suppression Ferrite Bead | Nennstrom400 mA | Gleichstromwiderstand0.3 Ω | Impedanz @ 100 MHz220 Ω | Maximale Impedanz330 Ω | Maximale Impedanz400 MHz | – | – | Impedanz @ 1 GHz262.58 Ω | TypBreitband |