IC manufacturers Silicon Laboratory Inc.

IC manufacturers (103)

Silicon Laboratory Inc. BGM220P | Demoboard BGM220-EK4314A

BGM220 Bluetooth Module Explorer Kit

Overview

TopologyOther Topology
IC revisionA02

Description

The BGM220 Explorer Kit is an ultra-low cost, small form factor development and evaluation platform for the BGM220P Bluetooth Module.The kit features a USB interface, an on-board SEGGER J-Link debugger, one user-LED and button, and support for hardware add-on boards via a mikroBus socket and a Qwiic connector. The hardware add-on support allows developers to create and prototype applications using a virtually endless combination of off-the-shelf boards from mikroE, sparkfun, AdaFruit, and Seeed Studios

Features

  • User LED and push button
  • 20-pin 2.54 mm breakout pads
  • mikroBUS™ socket
  • Qwiic® connector
  • SEGGER J-Link on-board debugger
  • Virtual COM port
  • Packet Trace Interface (PTI)
  • USB-powered.

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
IR(mA)
RDC(Ω)
Z @ 100 MHz(Ω)
Zmax(Ω)
Test Condition Zmax
IR 2(mA)
Test Condition IR 2
Z @ 1 GHz(Ω)
Type
Samples
WE-TMSB Tiny Multilayer Suppression Bead, 200 mA, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Rated Current200 mA
Impedance @ 100 MHz240 Ω
Maximum Impedance460 Ω
Maximum Impedance536 MHz 
Rated Current 2300 mA
Rated Current 2ΔT = 40 K 
Impedance @ 1 GHz342 Ω
TypeWide Band 
WE-CBA SMT EMI Suppression Ferrite Bead, 400 mA, 0.3 Ω
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Rated Current400 mA
DC Resistance0.3 Ω
Impedance @ 100 MHz220 Ω
Maximum Impedance330 Ω
Maximum Impedance400 MHz 
Impedance @ 1 GHz262.58 Ω
TypeWide Band