IC-Hersteller Onsemi
IC-Hersteller (103)
- Alle Hersteller
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (27)
- Ablic (23)
- Acco Semiconductor (1)
- Advanced Power (4)
- Allegro Microsystems (96)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (184)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (47)
- Cambridge GaN Devices (22)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (241)
- Divimath (8)
- Elmos AG (1)
- EPC (132)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (8)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- Ikanos (3)
- IKON (1)
- Indie Semiconductor (8)
- Innovision Semiconductor Inc (2)
- Intel (80)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (3)
- Kinetic Technology (10)
- Lattice semiconductor Corporation (20)
- Littelfuse (1)
- Lumissil Microsystems (8)
- M3 Technology (M3Tek) (7)
- Macnica (22)
- Marvell Semiconductor (1)
- MaxLinear (178)
- Menlo Micro (1)
- MikroE (20)
- MindCet (2)
- Monolithic Power Systems (946)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (34)
- Nisshinbo Micro Device Inc. (10)
- Novosense Micro (1)
- NXP (323)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (114)
- Powermat (1)
- Pulsiv (19)
- Qorvo (95)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (297)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (90)
- SG-Micro (33)
- Silanna Semiconductor (9)
- Silergy Corporation (30)
- Silicon Laboratory Inc. (110)
- Silicontent Technology (59)
- Silvertel (60)
- Skycore Semiconductors (1)
- Skyworks (33)
- Southchip (8)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (30)
- Wise Integration (1)
- Wolfspeed (17)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
Details
| Topologie | SEPIC Buck-Boost Topologie |
| Eingangsspannung | 5-24 V |
| Ausgang 1 | 20 V / 3 A |
| IC-Revision | 2 |
Beschreibung
The NCP81239 USB Power Delivery (PD) Controller is a synchronous buck boost that is optimized for converting battery voltage or adapter voltage into power supply rails required in notebook, tablet, and desktop systems, as well as many other consumer devices using USB PD standard and C−Type cables. The NCP81239 is fully compliant to the USB Power Delivery Specification when used in conjunction with a USB PD or C−Type Interface Controller. NCP81239 is designed for applications requiring dynamically controlled slew rate limited output voltage that require either voltage higher or lower than the input voltage. The NCP81239 drives 4 NMOSFET switches, allowing it to buck or boost and support the consumer and provider role swap function specified in the USB Power Delivery Specification which is suitable for all USB PD applications. The USB PD Buck Boost Controller operates with a supply and load range of 4.5 V to 28 V.
Eigenschaften
- 4.5 V to 28 V operating range
- I2C interface
- Switching frequency from 150 kHz to 1200 kHz
- Slew rate control during transition
- Supports USB-PD, QC2.0, and QC3.0 profiles
- Overvoltage and overcurrent protection
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q (%) | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | L (µH) | IRP,40K (A) | ISAT,10% (A) | ISAT,30% (A) | RDC (mΩ) | fres (MHz) | Material | Anwendung | Interface typ | Montageart | IR 1 (mA) | Arbeitsspannung (V (DC)) | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | IR (mA) | Z @ 1 GHz (Ω) | H (mm) | Pins (pcs) | Reihen | G (mm) | Gender | Verpackung | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 885012005055 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | 10 pF | ±5% | 50 | 0402 | -55 °C up to +125 °C | 600 | – | 10 GΩ | NP0 Klasse I | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | – | – | 7" Tape & Reel | ||
| 885012205041 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | 330 pF | ±10% | 25 | 0402 | -55 °C up to +125 °C | – | 3.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | – | – | 7" Tape & Reel | ||
| 885012205061 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | 1 nF | ±10% | 50 | 0402 | -55 °C up to +125 °C | – | 2.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | – | – | 7" Tape & Reel | ||
| 885012205062 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | 1.5 nF | ±10% | 50 | 0402 | -55 °C up to +125 °C | – | 2.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | – | – | 7" Tape & Reel | ||
| 885012205010 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | 4.7 nF | ±10% | 10 | 0402 | -55 °C up to +125 °C | – | 5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | – | – | 7" Tape & Reel | ||
| 885012205067 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | 10 nF | ±10% | 50 | 0402 | -55 °C up to +125 °C | – | 2.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | – | – | 7" Tape & Reel | ||
| 885012205037 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | 100 nF | ±10% | 16 | 0402 | -55 °C up to +125 °C | – | 5 | 5 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | – | – | 7" Tape & Reel | ||
| 885012105006 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 6.3 V(DC) | 1 µF | ±20% | 6.3 | 0402 | -55 °C up to +85 °C | – | 15 | 0.1 GΩ | X5R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | – | – | 7" Tape & Reel | ||
| 885012105008 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 6.3 V(DC) | 4.7 µF | ±20% | 6.3 | 0402 | -55 °C up to +85 °C | – | 20 | 0.01 GΩ | X5R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | – | – | 7" Tape & Reel | ||
 | 742792410 | SPEC | 10 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-CBF SMT-Ferrit | – | – | – | 1806 | -55 °C up to +125 °C | – | – | – | – | 4.5 | 1.6 | 0.5 | – | – | – | – | – | – | – | – | – | SMT | 6000 | – | 60 | 120 | 1000 MHz | 6000 | 0.01 | High Current | 5000 | 122 | 1.6 | – | – | – | – | – | ||
 | 74279223560 | SPEC | 10 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-MPSB EMI Multilayer Power Suppression Bead | – | – | – | 1612 | -55 °C up to +125 °C | – | – | – | – | 4.06 | 3.05 | 0.89 | – | – | – | – | – | – | – | – | – | SMT | 10000 | – | 56 | 90 | 1000 MHz | 10000 | 0.004 | Hochstrom | 10000 | 90 | 2.28 | – | – | – | – | – | ||
 | 744325420 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-HCI SMT-Hochstrominduktivität | – | – | – | 1050 | -40 °C up to +150 °C | – | – | – | – | 10.5 | 10.2 | – | 4.2 | 15.4 | 5 | 14 | 7.1 | 33 | Superflux | – | – | SMT | – | – | – | – | – | – | 0.00787 | – | – | – | 4.7 | 2 | – | – | – | – | ||
 | 632723300011 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-COM USB 3.1 Type C Receptacle Horizontal THR / SMT | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | – | – | – | – | – | – | – | – | – | – | USB 3.1 | Type C | THR | – | 20 | – | – | – | – | – | Horizontal | 5000 | – | – | 24 | – | 1.9 | Receptacle | Tape and Reel | |
 | 61300211121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | 5.08 | – | – | – | – | – | – | – | – | – | – | – | THT | – | 250 | – | – | – | – | – | Gerade | 3000 | – | – | 2 | Single | – | Pin Header | Beutel | |
 | 61300311121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | 7.62 | – | – | – | – | – | – | – | – | – | – | – | THT | – | 250 | – | – | – | – | – | Gerade | 3000 | – | – | 3 | Single | – | Pin Header | Beutel | |
 | 61300411121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | 10.16 | – | – | – | – | – | – | – | – | – | – | – | THT | – | 250 | – | – | – | – | – | Gerade | 3000 | – | – | 4 | Single | – | Pin Header | Beutel |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q (%) | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | L (µH) | IRP,40K (A) | ISAT,10% (A) | ISAT,30% (A) | RDC (mΩ) | fres (MHz) | Material | Anwendung | Interface typ | Montageart | IR 1 (mA) | Arbeitsspannung (V (DC)) | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | IR (mA) | Z @ 1 GHz (Ω) | H (mm) | Pins (pcs) | Reihen | G (mm) | Gender | Verpackung | Muster |
|---|
