IC-Hersteller Onsemi
IC-Hersteller (103)
- Alle Hersteller
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (28)
- Ablic (23)
- Acco Semiconductor (1)
- Advanced Power (4)
- Allegro Microsystems (100)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (204)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (46)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (259)
- Divimath (8)
- Elmos AG (1)
- EPC (140)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (8)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- IKON (1)
- Indie Semiconductor (8)
- Innovision Semiconductor Inc (2)
- Intel (68)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (3)
- Kinetic Technology (8)
- Lattice semiconductor Corporation (38)
- Littelfuse (1)
- Lumissil Microsystems (8)
- M3 Technology (M3Tek) (7)
- Macnica (22)
- Marvell Semiconductor (1)
- MaxLinear (181)
- Menlo Micro (1)
- MikroE (25)
- MindCet (2)
- Monolithic Power Systems (980)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (267)
- Nisshinbo Micro Device Inc. (10)
- Novosense Micro (1)
- NXP (337)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (117)
- Powermat (1)
- Pulsiv (19)
- Qorvo (97)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (297)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (86)
- SG-Micro (58)
- SiFive (2)
- Silanna Semiconductor (9)
- Silergy Corporation (33)
- Silicon Laboratory Inc. (108)
- Silicontent Technology (59)
- Silvertel (59)
- Skycore Semiconductors (1)
- Skyworks (33)
- Southchip (14)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (31)
- Wise Integration (3)
- Wolfspeed (23)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
Details
| Topologie | SEPIC Buck-Boost Topologie |
| Eingangsspannung | 3.75-9 V |
| Schaltfrequenz | 2000 kHz |
| Ausgang 1 | 5.5 V / 1.25 A |
Beschreibung
The single−ended primary−inductor converter (SEPIC)is a type of DC/DC converter that allows the electricalpotential (voltage) at its output to be greater than, less than,or equal to that at its input. The SEPIC converter iscontrolled by the duty cycle of the main switch Q1.
Eigenschaften
- Peak Current Mode Control with Internal Slope Compensation
- 1.2 V 2% Reference Voltage
- 2 MHz Fixed Frequency Operation
- Wide Input Voltage Range of 3.2 V to 40 V, 45 V Load Dump
- Input Under voltage Lockout (UVLO)
- Internal Soft−Start
- Low Quiescent Current in Sleep Mode (< 10 A Typical)
- Cycle−by−Cycle Current Limit Protection
- Hiccup−Mode Overcurrent Protection (OCP)
- Hiccup−Mode Short−Circuit Protection (SCP)
- Thermal Shutdown (TSD)
- NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable
- This is a Pb−Free Device
Typische Anwendungen
- Headlamps, Backlighting
- Small Form Factor Point−of−Load Power Regulation
Weiterführende Informationen
Artikeldaten
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR(V (DC)) | Bauform | Betriebstemperatur | DF(%) | RISO | Keramiktyp | L(mm) | B(mm) | H(mm) | Fl(mm) | Verpackung | L(µH) | IRP,40K(A) | ISAT(A) | RDC max.(mΩ) | fres(MHz) | Version | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSGP MLCCs 25 V(DC), 3.3 µF, ±10% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | Kapazität3.3 µF | Kapazität±10% | Nennspannung25 V (DC) | Bauform1210 | Betriebstemperatur -55 °C up to +125 °C | Verlustfaktor3.5 % | Isolationswiderstand0.2 GΩ | KeramiktypX7R Klasse II | Länge3.2 mm | Breite2.5 mm | Höhe1.6 mm | Pad Dimension0.75 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 25 V(DC), 4.7 µF, ±10% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | Kapazität4.7 µF | Kapazität±10% | Nennspannung25 V (DC) | Bauform1206 | Betriebstemperatur -55 °C up to +125 °C | Verlustfaktor7 % | Isolationswiderstand0.1 GΩ | KeramiktypX7R Klasse II | Länge3.2 mm | Breite1.6 mm | Höhe1.6 mm | Pad Dimension0.6 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | |||||
 | WE-PD SMT-Speicherdrossel, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWE-PD SMT-Speicherdrossel | – | – | – | Bauform7332 | Betriebstemperatur -40 °C up to +150 °C | – | – | – | Länge7.3 mm | Breite7.4 mm | Höhe3.2 mm | – | – | Induktivität3.3 µH | Performance Nennstrom5.7 A | Sättigungsstrom5.3 A | Gleichstromwiderstand24 mΩ | Eigenresonanzfrequenz51 MHz | VersionPerformance |