IC-Hersteller Intel

IC-Hersteller (103)

Intel PEF98030

Lantiq™ FALC™ ON FTTx System-on-Chip Family

Details

TopologieSperrwandler
Eingangsspannung27-58 V
Ausgang 112 V / 1.2 A

Beschreibung

The Lantiq™ FALC™ ON FTTx family of GPON ONU ICs is a scalable, highly integrated, cost- optimized and low-power system-on-chip solution that can be used in all FTTx deployment scenarios. The ICs provide an intelligent and cost-effective solution for managing the optical interface. In fact, the overall optical system performance exceeds the levels defi ned by the ITU-T G.984.2 standard.The optical side of a FALC™ ON FTTx device directly connects to a Bi-Directional Optical Sub- Assembly (BiDi OSA/BOSA) component, a photonic IC, or an optical transceiver module. The client side provides up to four GE interfaces for data traffi c. Integrated 10/100/1000BASE-T Ethernet PHY modules on the SoC enable direct interfacing with standard magnetics for two 1000BASE-T or four 10/100BASE-T links. On-chip voice processing, used with external SLIC devices, allows up to four FXS ports to be enabled. The comprehensive SoC design includes a burst-mode laser driver, post amplifi er and clock and data recovery, as well as a GPON ONU MAC and an on-chip CPU.

Eigenschaften

  • System-on-Chip (SoC) for GPON Optical Network Termination (ONU)
  • ITU-T G.984-compliant GPON TC sublayer
  • Flexible optical interfaces for Bi-Directional Optical Sub-Assembly (BiDiOSA/BOSA) components or optical transceivermodules
  • Integrated burst-mode laser driver and APD/PIN receiver
  • Flexible L2-L4 packet processing engine with extensive traffi c management functionality, compliant with the BroadbandForum TR-156, G.984.4/G.988 and Metro Ethernet Forum Implementation Agreement #10 specifi cations
  • Real GPON wire-speed packet processing with throughput independent of packet size and CPU application processing
  • Four triple-speed Ethernet ports
  • Two integrated 10/100/1000BASE-T Ethernet PHY modules supporting Energy-Effi cient Ethernet (EEE)
  • SGMII interface operating at 1 Gbit/s or 2.5 Gbit/s
  • Dual RGMII/RMII or single GMII/MII/TMII interface
  • Up to four integrated voice codecs with SLIC™ interface

Typische Anwendungen

  • Cellular Backhaul Unit (CBU)
  • Small Business Unit (SBU)
  • Multi-Dwelling Unit (MDU
  • Home Gateway Unit (HGU)
  • Single Family Unit (SFU)

Artikeldaten

Artikel Nr.
Daten­blatt
Simu­lation
Downloads
Status
Produktserie
IRP,40K(A)
ISAT,30%(A)
RDC typ.(mΩ)
fres(MHz)
VOP(V)
Version
Vin
VOut1(V)
IOut1(A)
VOut2(V)
IOut2(A)
VOut3(V)
IOut3(A)
L(µH)
n
VT(V (AC))
Bauform
Montageart
Muster
WE-MAPI SMT-Speicherdrossel, 8.7 A, 10.5 A
Simu­lation
Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.
Performance Nennstrom8.7 A
Sättigungsstrom @ 30%10.5 A
Gleichstromwiderstand14 mΩ
Eigenresonanzfrequenz140 MHz
Betriebsspannung80 V
VersionSMT 
Induktivität0.33 µH
Bauform3020 
MontageartSMT 
WE-PoE Übertrager für Power over Ethernet, –, –
Simu­lation
Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.
VersionFlyback 
Input Voltage 36 - 57 V (DC)
Ausgangsspannung 112 V
Ausgangsstrom 11.2 A
Ausgangsspannung 25 V
Ausgangsstrom 22.8 A
Ausgangsspannung 33.3 V
Ausgangsstrom 34.3 A
Induktivität120 µH
Übersetzungsverhältnis15:1.5:1:3:5 
Prüfspannung1500 V (AC)
BauformEFD15 
MontageartSMT