IC-Hersteller Infineon Technologies
IC-Hersteller (103)
- Alle Hersteller
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (28)
- Ablic (23)
- Acco Semiconductor (1)
- Advanced Power (4)
- Allegro Microsystems (100)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (204)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (46)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (259)
- Divimath (8)
- Elmos AG (1)
- EPC (140)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (8)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- IKON (1)
- Indie Semiconductor (8)
- Innovision Semiconductor Inc (2)
- Intel (68)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (3)
- Kinetic Technology (8)
- Lattice semiconductor Corporation (38)
- Littelfuse (1)
- Lumissil Microsystems (8)
- M3 Technology (M3Tek) (7)
- Macnica (22)
- Marvell Semiconductor (1)
- MaxLinear (181)
- Menlo Micro (1)
- MikroE (25)
- MindCet (2)
- Monolithic Power Systems (980)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (267)
- Nisshinbo Micro Device Inc. (10)
- Novosense Micro (1)
- NXP (336)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (117)
- Powermat (1)
- Pulsiv (19)
- Qorvo (97)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (297)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (86)
- SG-Micro (57)
- SiFive (2)
- Silanna Semiconductor (9)
- Silergy Corporation (33)
- Silicon Laboratory Inc. (108)
- Silicontent Technology (59)
- Silvertel (59)
- Skycore Semiconductors (1)
- Skyworks (33)
- Southchip (14)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (31)
- Wise Integration (3)
- Wolfspeed (23)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
Infineon Technologies IRSM505-065 | Demoboard EVAL-M1-05-65D
EVAL-M1-05-65D User Manual iMOTION™ Modular Application Design Kit
Details
| Topologie | Sonstige Topologie |
| IC-Revision | 2.1 |
Beschreibung
The EVAL-M1-05-65D evaluation board is a part of the iMOTION™ Modular Application Design Kit for drives (iMOTION™ MADK). The MADK-platform is intended to use various power stages with different control boards. These boards can easily be interfaced through the 20 pin iMOTION™ MADK-M1 interface connector. This evaluation board is designed to give comprehensible solutions of a power stage featuring μIPM™ -DIP. The board is equipped with all assembly groups for sensor less field oriented control (FOC). It provides a singlephase AC-connector, rectifier, DC-link and 3-phase output for power. It contains emitter-shunts for current sensing and a voltage divider for DC-link voltage measurement. The EVAL-M1-05-65D evaluation board is available from Infineon. The features of this board are described in the design feature chapter of this document, whereas the remaining paragraphs provide information to enable the customers to copy, modify and qualify the design for production according to their own specific requirements. Environmental conditions were considered in the design of the EVAL-M1-05-65D. The design was tested as described in this document but not qualified regarding safety requirements or manufacturing and operation over the whole operating temperature range or lifetime. The boards provided by Infineon are subject to functional testing only. Evaluation boards are not subject to the same procedures as regular products regarding Returned Material Analysis (RMA), Process Change Notification (PCN) and Product Discontinuation (PD). Evaluation boards are intended to be used under laboratory conditions by specialists only.
Eigenschaften
- 3-phase inverter including high voltage gate drivers
- Integrated bootstrap functionality
- Trench FREDFET with RDS(on) of 1.3 Ω @ 25°C
- Under voltage lockout for all channels
- Matched propagation delay for all channels
- Temperature feedback via NTC applicable for IRSM505-065
- Optimized dV/dt for loss and EMI trade off
- 3.3 V logic compatible and advanced input filter
- Possibility to choose single shunt or leg shunt current sensing
- Driver tolerant to negative transient voltage
- Isolation 1900 Vrms, 1min
- Certified by UL file number E252584
Typische Anwendungen
- Housing Appliance
- energy efficient fans and pumps
Weiterführende Informationen
Artikeldaten
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Pins | PCB/Kabel/Panel | Modularity | Typ | Wire Section | λDom typ.(nm) | Emittierte Farbe | λPeak typ.(nm) | IV typ.(mcd) | VF typ.(V) | Chiptechnologie | 2θ50% typ.(°) | C | VR(V (AC)) | Sicherheitsklasse | dV/dt(V/µs) | DF @ 1 kHz(%) | RISO | Raster(mm) | L(mm) | B(mm) | H(mm) | Verpackung | Tol. C | Bauform | Betriebstemperatur | Q(%) | DF(%) | Keramiktyp | Fl(mm) | Endurance(h) | IRIPPLE(mA) | ILeak(µA) | Ø D(mm) | Montageart | G(mm) | IR(A) | Arbeitsspannung(V (AC)) | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | WR-TBL Serie 2165S - 5.08 mm Horizontal Entry Modular w. Rising Cage Clamp, 3, Käfigzugklemme | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | Pins3 | PCB/Kabel/PanelPCB | ModularityJa | TypHorizontal | Wire Section 12 to 30 (AWG) 3.31 to 0.0509 (mm²) | – | – | – | – | – | – | – | – | – | – | – | – | – | Raster5.08 mm | Länge15.24 mm | – | – | VerpackungKarton | – | – | Betriebstemperatur -30 °C up to +120 °C | – | – | – | – | – | – | – | – | MontageartTHT | – | Nennstrom24 A | Arbeitsspannung250 V (AC) | ||||
 | WR-TBL Serie 2169 - 7.50 mm Horizontal Entry Modular w. Rising Cage Clamp, 3, Käfigzugklemme | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | Pins3 | PCB/Kabel/PanelPCB | ModularityJa | TypHorizontal | Wire Section 12 to 30 (AWG) 3.31 to 0.0509 (mm²) | – | – | – | – | – | – | – | – | – | – | – | – | – | Raster7.5 mm | Länge22.5 mm | – | – | VerpackungKarton | – | – | Betriebstemperatur -30 °C up to +120 °C | – | – | – | – | – | – | – | – | MontageartTHT | – | Nennstrom24 A | Arbeitsspannung750 V (AC) | ||||
 | WR-PHD Buchsenleisten - Zweireihig, 20, – | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWR-PHD Buchsenleisten - Zweireihig | Pins20 | – | – | TypAbgewinkelt | – | – | – | – | – | – | – | – | – | – | – | – | – | Isolationswiderstand1000 MΩ | Raster2.54 mm | Länge25.9 mm | – | – | VerpackungTray | – | – | Betriebstemperatur -40 °C up to +105 °C | – | – | – | – | – | – | – | – | MontageartTHT | – | Nennstrom3 A | Arbeitsspannung250 V (AC) | |||
 | WCAP-FTX2 Folienkondensatoren, –, Across the mains | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-FTX2 Folienkondensatoren | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität100 nF | Nennspannung275 V (AC) | SicherheitsklasseX2 | Spannungsanstiegsgeschwindigkeit300 V/µs | Verlustfaktor0.1 % | Isolationswiderstand30 GΩ | Raster15 mm | Länge18 mm | Breite6 mm | Höhe12 mm | VerpackungKarton | Kapazität±10% | BauformRaster 15 mm | Betriebstemperatur -40 °C up to +105 °C | – | – | – | – | – | – | – | – | MontageartBoxed THT | Pin Länge4 mm | – | – | ||||
 | WL-TMRW THT Mono-color Round Waterclear, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWL-TMRW THT Mono-color Round Waterclear | – | – | – | – | – | dominante Wellenlänge [typ.]621 nm | Emittierte FarbeRot | Spitzen-Wellenlänge [typ.]628 nm | Lichtstärke [typ.]2600 mcd | Durchlassspannung [typ.]2 V | ChiptechnologieAlInGaP | Abstrahlwinkel Phi 0° [typ.]30 ° | – | – | – | – | – | – | – | Länge3 mm | Breite3 mm | Höhe5.3 mm | VerpackungLose | – | Bauform3 mm | Betriebstemperatur -40 °C up to +85 °C | – | – | – | – | – | – | – | – | MontageartTHT | – | – | – | ||||
 | WCAP-ATG5 Aluminium-Elektrolytkondensatoren, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-ATG5 Aluminium-Elektrolytkondensatoren | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität220 µF | Nennspannung35 V (AC) | – | – | – | – | Raster3.5 mm | Länge11.5 mm | – | – | VerpackungAmmopack | Kapazität±20% | – | – | – | Verlustfaktor12 % | – | – | Endurance 2000 | Rippelstrom255 mA | Leckstrom77 µA | Durchmesser8 mm | – | – | – | – | ||||
| WCAP-ATG5 Aluminium-Elektrolytkondensatoren, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-ATG5 Aluminium-Elektrolytkondensatoren | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität100 µF | Nennspannung400 V (AC) | – | – | – | – | Raster7.5 mm | Länge31.5 mm | – | – | VerpackungAmmopack | Kapazität±20% | – | – | – | Verlustfaktor15 % | – | – | Endurance 2000 | Rippelstrom520 mA | Leckstrom1200 µA | Durchmesser16 mm | – | – | – | – | ||||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität1 nF | Nennspannung50 V (AC) | – | – | – | Isolationswiderstand10 GΩ | – | Länge2 mm | Breite1.25 mm | Höhe0.8 mm | Verpackung7" Tape & Reel | Kapazität±5% | Bauform0805 | Betriebstemperatur -55 °C up to +125 °C | Güte1000 % | – | KeramiktypNP0 Klasse I | Pad Dimension0.5 mm | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität2.2 nF | Nennspannung50 V (AC) | – | – | – | Isolationswiderstand10 GΩ | – | Länge2 mm | Breite1.25 mm | Höhe0.8 mm | Verpackung7" Tape & Reel | Kapazität±5% | Bauform0805 | Betriebstemperatur -55 °C up to +125 °C | Güte1000 % | – | KeramiktypNP0 Klasse I | Pad Dimension0.5 mm | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 25 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität1 µF | Nennspannung25 V (AC) | – | – | – | Isolationswiderstand0.5 GΩ | – | Länge2 mm | Breite1.25 mm | Höhe1.25 mm | Verpackung7" Tape & Reel | Kapazität±10% | Bauform0805 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor5 % | KeramiktypX7R Klasse II | Pad Dimension0.5 mm | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität100 nF | Nennspannung50 V (AC) | – | – | – | Isolationswiderstand5 GΩ | – | Länge2 mm | Breite1.25 mm | Höhe0.8 mm | Verpackung7" Tape & Reel | Kapazität±10% | Bauform0805 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor2.5 % | KeramiktypX7R Klasse II | Pad Dimension0.5 mm | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 6.3 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 6.3 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität10 µF | Nennspannung6.3 V (AC) | – | – | – | Isolationswiderstand0.01 GΩ | – | Länge2 mm | Breite1.25 mm | Höhe1.25 mm | Verpackung7" Tape & Reel | Kapazität±20% | Bauform0805 | Betriebstemperatur -55 °C up to +85 °C | – | Verlustfaktor15 % | KeramiktypX5R Klasse II | Pad Dimension0.5 mm | – | – | – | – | – | – | – | – |