Our MICROVIA.hdi hand sample WE.microbga demonstrates the power of microvia technology on rigid multilayers. Laser-drilled microvias, placed directly into the solder pads of a BGA component, can unbundle a 0.4 mm pitch to three wiring layers.
Consistently applied microvia technology offers the possibility of miniaturizing the PCB: A smaller PCB can significantly reduce the price of the PCB and also of the overall system.
At the same time, each microvia that replaces a PTH improves signal integrity by reducing parasitic effects. Other measures such as runtime matching and defined impedances through a specific stackup are demonstrated here.
Design: HDI12_3-6b-3
Explanations: 12 layers with PTH, buried vias over 6 layers and 3 sequential micro via layers symmetrically on each side.
Explanations: Comparison of area requirements between BGA components with pitch 0.8 mm and 0.4 mm.
Design: The contour is milled
Design: Specified impedances with project-specific stackup, length compensation for runtime matching
Design: link to this page via www.we-online.com/microviasample
