OverviewAll product unitsProduct unitThermal Management
OverviewAll product unitsProduct unitThermal Management
All subcategories More about Thermal Management

Thermal Management Solutions  

Thermal Management describes all the methods used to take care of all the excess heat that electronic devices and components generate. It is a field of upmost importance in order to guarantee reliability of electronic devices and components, develop robust devices and reduce e-waste.

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WE-PCM Design Guideline  

The WE-PCM is designed as an alternative to the use of thermal pastes & greases between high performance components, such as processors or power components, and cooling assemblies. This material changes from solid to liquid at a certain temperature, thus providing a complete wet-out of the interface without any spills or overflow.

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WE-TGF Design Guideline  

The WE-TGF is a silicone elastomer gap filler pad, designed to fill a gap between one or multiple electronic components and a cooling assembly, such as a heatsink, cooling plate or metal housing.

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WE-TGFG Design Guideline  

The WE-TGFG is a synthetic graphite layer wrapped around a core offoam. By placing the graphite around a foam core we provide verticalconductivity to a horizontal heat spreader.

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WE-TGS Design Guideline  

The WE-TGS is a synthetic graphite heat spreader. This implies that most of the thermal conductivity provided by the material occurs at the horizontal or XY axis. This effect enables the final application to use even larger cooling surfaces instead of being limited by the contact surfaces of the component that needs to be cooled.

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WE-TINS Design Guideline  

The WE-TINS is a silicone elastomer gap filler pad, designed to electrically isolate electronic components and cooling assemblies, such as a heatsinks, metal housings or radiators.

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WE-TTT Design Guideline  

The WE-TTT is a double sided tape designed to provide a thermal interface material that at the same time allows for mechanical fixing in both contact surfaces.

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