WE-TTT Thermal Transfer Tape

Characteristics

  • Customizable in size and shape
  • No MOQ or tooling costs
  • No need for additional mechanical fixing of cooling assemblies
  • Double-sided adhesive surface
  • High mechanical strength
  • Ideal if a thin bond is required
  • Do you wish an individual offer for WE-TTT? Request now! Request for customized components WE-TTT

Applications

  • Power semiconductors
  • Graphic processing units
  • Microprocessors
  • Chipsets
  • Memory modules
  • Cooling assemblies

Products

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Order Code
Data­sheet
Downloads
Status
L(m)
W(mm)
H(mm)
κ(W/(m*K))
Dielectric Strength(kV/mm)
Adhesive Strength(N/ cm)
Samples
403012008
25 m, 8 mm, 0.2 mm
Status Activei| Production is active. Expected lifetime: >10 years.
Length25 m
Width8 mm
Height0.2 mm
Thermal Conductivity1 W/(m*K)
Dielectric Strength4 kV/mm
Adhesive Strength5.79 N/ cm
403012050
25 m, 50 mm, 0.2 mm
Status Activei| Production is active. Expected lifetime: >10 years.
Length25 m
Width50 mm
Height0.2 mm
Thermal Conductivity1 W/(m*K)
Dielectric Strength4 kV/mm
Adhesive Strength5.79 N/ cm