OverviewAll product unitsProduct unitThermal ManagementProduct familyGap Filling SolutionsProduct seriesWE-TTT Thermal Transfer Tape

WE-TTT Thermal Transfer Tape


  • Customizable in size and shape
  • No MOQ or tooling costs
  • No need for additional mechanical fixing of cooling assemblies
  • Double-sided adhesive surface
  • High mechanical strength
  • Ideal if a thin bond is required
  • Do you wish an individual offer for WE-TTT? Request now! Request for customized components WE-TTT


  • Power semiconductors
  • Graphic processing units
  • Microprocessors
  • Chipsets
  • Memory modules
  • Cooling assemblies