WE-TTT Thermal Transfer Tape
Characteristics
- Customizable in size and shape
- No MOQ or tooling costs
- No need for additional mechanical fixing of cooling assemblies
- Double-sided adhesive surface
- High mechanical strength
- Ideal if a thin bond is required
- Do you wish an individual offer for WE-TTT? Request now! Request for customized components WE-TTT
Applications
- Power semiconductors
- Graphic processing units
- Microprocessors
- Chipsets
- Memory modules
- Cooling assemblies
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