WE-TTT Thermal Transfer Tape
Characteristics
- Customizable in size and shape
- No MOQ or tooling costs
- No need for additional mechanical fixing of cooling assemblies
- Double-sided adhesive surface
- High mechanical strength
- Ideal if a thin bond is required
- Do you wish an individual offer for WE-TTT? Request now! Request for customized components WE-TTT
Applications
- Power semiconductors
- Graphic processing units
- Microprocessors
- Chipsets
- Memory modules
- Cooling assemblies
Products
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Reset allOrder Code | Datasheet | Downloads | Status | L(m) | W(mm) | H(mm) | κ(W/(m*K)) | Dielectric Strength(kV/mm) | Adhesive Strength(N/ cm) | SamplesAvailability & Sample | |
|---|---|---|---|---|---|---|---|---|---|---|---|
403012008 | SPEC25 m, 8 mm, 0.2 mm | Availability – | Status Activei| Production is active. Expected lifetime: >10 years. | Length25 m | Width8 mm | Height0.2 mm | Thermal Conductivity1 W/(m*K) | Dielectric Strength4 kV/mm | Adhesive Strength5.79 N/ cm | –Check availability | |
403012050 | SPEC25 m, 50 mm, 0.2 mm | Availability – | Status Activei| Production is active. Expected lifetime: >10 years. | Length25 m | Width50 mm | Height0.2 mm | Thermal Conductivity1 W/(m*K) | Dielectric Strength4 kV/mm | Adhesive Strength5.79 N/ cm | –Check availability |
Availability Forecast
WE item number: –
VPELead time
–– weeks
| Expected Availability | Opening inventory | Quantity |
|---|---|---|
| Current Availability | – | – |
There is no forecast for this quantity request.
Does it just not fit? Please contact us.Simply contact our service team for special orders and bulk quantities.Contact us
