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Overview
| Topology | Other Topology |
| Input voltage | 1.8-3.3 V |
| IC revision | A02 |
Description
The SiWx917 Wi-Fi 6 and Bluetooth LE 5.4 Dev Kit is a compact, yet feature-packed development platform for testing, developing, and prototyping wireless IoT applications quickly. The development platform includes a broad range of sensors, various peripheral devices, and a Qwiic connector, allowing you to explore the endless world of Sparkfun expansion hardware.
Features
Based on SiWG917M111MGTBA Wi-Fi 6 and Bluetooth LE SoC8 MB Flash, 8 MB external PSRAM, 7x7 QFN, -40°C to +85°CIntegrated on-chip antennaRF: Front-end design based on external RF Switch and BPF, RF connector for conducted RF measurementsOn-board sensors: Temperature Sensor (Si7021), Humidity Sensor (Si7021), 6-axis inertial sensor (ICM-20689), 2 x Digital Microphones (ICS-43434), Ambient Light Sensor (VEML6035)Probe points for power measurementsQwiic Connector: For compatibility with Sparkfun's expansion hardware (Sensors, Cameral, LCD, etc)USB Port: Board Power, Serial Communication (ISP Bootloader)On-board Debugger: SWD, VCOM
Typical applications
- Communications Circuits
- Hard Drives
- PCMCIA Cards
- Modems
- Audio and Video Signal Routing
- Cellular Phones
- Battery-Powered Systems
- Low-Voltage Data-Acquisition Systems
- Power Routing
More information
Products
Order Code | Datasheet | Simulation | Downloads | Status | Product series | Z @ 100 MHz(Ω) | Zmax(Ω) | Test Condition Zmax | IR 2(mA) | Test Condition IR 2 | Z @ 1 GHz(Ω) | Type | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | WE-TMSB Tiny Multilayer Suppression Bead, 240 Ω, 460 Ω | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWE-TMSB Tiny Multilayer Suppression Bead | Impedance @ 100 MHz240 Ω | Maximum Impedance460 Ω | Maximum Impedance536 MHz | Rated Current 2300 mA | Rated Current 2ΔT = 40 K | Impedance @ 1 GHz342 Ω | TypeWide Band |