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Details
| Topologie | Sonstige Topologie |
| Eingangsspannung | 1.8-3.3 V |
| IC-Revision | A02 |
Beschreibung
The SiWx917 Wi-Fi 6 and Bluetooth LE 5.4 Dev Kit is a compact, yet feature-packed development platform for testing, developing, and prototyping wireless IoT applications quickly. The development platform includes a broad range of sensors, various peripheral devices, and a Qwiic connector, allowing you to explore the endless world of Sparkfun expansion hardware.
Eigenschaften
Based on SiWG917M111MGTBA Wi-Fi 6 and Bluetooth LE SoC8 MB Flash, 8 MB external PSRAM, 7x7 QFN, -40°C to +85°CIntegrated on-chip antennaRF: Front-end design based on external RF Switch and BPF, RF connector for conducted RF measurementsOn-board sensors: Temperature Sensor (Si7021), Humidity Sensor (Si7021), 6-axis inertial sensor (ICM-20689), 2 x Digital Microphones (ICS-43434), Ambient Light Sensor (VEML6035)Probe points for power measurementsQwiic Connector: For compatibility with Sparkfun's expansion hardware (Sensors, Cameral, LCD, etc)USB Port: Board Power, Serial Communication (ISP Bootloader)On-board Debugger: SWD, VCOM
Typische Anwendungen
- Communications Circuits
- Hard Drives
- PCMCIA Cards
- Modems
- Audio and Video Signal Routing
- Cellular Phones
- Battery-Powered Systems
- Low-Voltage Data-Acquisition Systems
- Power Routing
Weiterführende Informationen
Artikeldaten
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Z @ 100 MHz(Ω) | Zmax(Ω) | Testbedingung Zmax | IR 2(mA) | Testbedingung IR 2 | Z @ 1 GHz(Ω) | Typ | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | WE-TMSB SMT-Ferrit, 240 Ω, 460 Ω | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWE-TMSB SMT-Ferrit | Impedanz @ 100 MHz240 Ω | Maximale Impedanz460 Ω | Maximale Impedanz536 MHz | Nennstrom 2300 mA | Nennstrom 2ΔT = 40 K | Impedanz @ 1 GHz342 Ω | TypBreitband |